Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCKU040-1FFVA1156C: Xilinx Kintex UltraScale FPGA — Complete Product Guide

Product Details

Meta Description: The XCKU040-1FFVA1156C is a high-performance Xilinx Kintex UltraScale FPGA with 530,250 logic cells, 520 I/Os, and 20nm technology. Ideal for 100G networking, medical imaging, and data center applications.


The XCKU040-1FFVA1156C is a field-programmable gate array (FPGA) from AMD Xilinx’s Kintex® UltraScale™ family, engineered for demanding mid-range applications that require the best balance of performance, power efficiency, and cost. Built on 20nm process technology, this device delivers ASIC-class performance in a programmable silicon package. If you are looking for a powerful Xilinx FPGA for signal processing, networking, or data center workloads, the XCKU040-1FFVA1156C is a compelling choice.


What Is the XCKU040-1FFVA1156C?

The XCKU040-1FFVA1156C belongs to the Kintex UltraScale FPGA family — AMD Xilinx’s mid-range product line targeting applications that demand high DSP throughput and high-speed transceivers without the cost of high-end Virtex-class devices. The part number breaks down as follows:

Part Number Segment Meaning
XCKU040 Kintex UltraScale device with ~530K logic cells
-1 Speed grade -1 (standard/commercial speed)
FFVA Flip-chip fine-pitch ball grid array (FC-BGA) package
1156 1156-pin package
C Commercial temperature range (0°C to +85°C)

XCKU040-1FFVA1156C Key Specifications

The table below summarizes the most important electrical, logical, and physical specifications for this device.

Parameter Value
Part Number XCKU040-1FFVA1156C
Manufacturer AMD (Xilinx)
FPGA Family Kintex® UltraScale™
Process Technology 20nm
System Logic Cells 530,250
Logic Cells (LUTs) 242,400 CLB LUTs
Block RAM 21,100 Kbits (28.3 Mb)
DSP Slices 1,920
User I/O Pins 520
Total Package Pins 1,156
Package Type 1156-BBGA / FCBGA
Package Dimensions 35 mm × 35 mm
Core Voltage (VCCINT) 0.922V – 0.979V (nominal 0.95V)
Max Clock Frequency Up to 630 MHz
Temperature Range 0°C to +85°C (Commercial)
RoHS Compliant Yes
MSL (Moisture Sensitivity) Per JEDEC J-STD-020

XCKU040-1FFVA1156C Transceiver and High-Speed I/O Specifications

One of the standout capabilities of the XCKU040-1FFVA1156C is its high-speed serial transceiver infrastructure. The following table details the transceiver specifications.

Transceiver Feature Specification
Number of GTH Transceivers Up to 24
Max GTH Line Rate 16.3 Gb/s
Backplane Support Up to 16G backplane-capable
PCIe Interface Integrated PCIe Gen3 (up to ×8)
Supported I/O Standards LVCMOS, HSTL, SSTL, LVDS, GTH, GTY
DDR4 Memory Support Up to 2,400 Mb/s
Max Total Transceiver Bandwidth Multi-hundred Gbps

XCKU040-1FFVA1156C Logic and DSP Resources

For DSP-intensive and compute-heavy designs, the XCKU040-1FFVA1156C offers exceptional on-chip resources:

Resource Quantity
CLB LUTs 242,400
CLB Flip-Flops 485,760
Block RAM Tiles (36Kb each) 600
Total Block RAM 21,100 Kbits
DSP48E2 Slices 1,920
DSP Compute Performance Up to 8.2 TeraMACs
MMCM (Mixed-Mode Clock Managers) 8
PLL 8
Maximum Internal Clocks Hundreds (fine granular gating)

UltraScale Architecture: What Makes It Special?

#### ASIC-Class Routing and Clocking

The UltraScale architecture is the first ASIC-class All Programmable architecture designed to enable multi-hundred Gbps system performance. Unlike previous FPGA generations, the routing and clocking fabric is co-optimized with the Vivado® Design Suite to minimize placement-and-route penalties and achieve predictable timing closure at high utilization.

#### 20nm Process Technology Advantages

Fabricated on TSMC’s 20nm planar process, the XCKU040-1FFVA1156C achieves:

  • Up to 40% lower power compared to the previous 28nm Kintex-7 generation
  • Higher logic density per mm² of silicon
  • 12.5 Gb/s transceiver line rate even in the slowest (-1L) speed grade
  • Improved signal integrity at high frequencies

#### Next-Generation Transceivers

The GTH transceivers in the XCKU040-1FFVA1156C support data rates up to 16.3 Gb/s, making the device suitable for:

  • 100G Ethernet (4×25G or 10×10G)
  • Interlaken protocol
  • OTN (Optical Transport Networking)
  • JESD204B for high-speed ADC/DAC interfaces
  • CPRI/eCPRI for wireless basestation fronthaul

#### Integrated Hard IP Blocks

The device integrates multiple hard IP blocks that save logic resources and reduce power:

  • PCIe Gen3 ×8 core (up to 8 GT/s)
  • 100G Ethernet MAC (available via soft IP)
  • Integrated GTH serial transceivers
  • DDR4 memory controllers

Target Applications for the XCKU040-1FFVA1156C

The XCKU040-1FFVA1156C is purpose-built for a wide range of demanding applications across multiple industries.

#### Networking and Data Center

  • 100G packet processing — line-rate classification, forwarding, and deep packet inspection
  • Network function virtualization (NFV) acceleration
  • SmartNIC and FPGA-based network offload engines
  • Data center interconnect (DCI) solutions

#### Wireless and Telecommunications

  • Heterogeneous wireless infrastructure — massive MIMO, remote radio heads (RRH)
  • Fronthaul (CPRI/eCPRI) and midhaul aggregation
  • TD-LTE/5G NR digital front-end (DFE) processing
  • Baseband unit (BBU) signal processing

#### Medical Imaging

  • Next-generation medical imaging — CT, MRI, PET-CT reconstruction engines
  • Real-time ultrasound beamforming
  • High-speed image acquisition with JESD204B ADC interfaces
  • AI inference acceleration for diagnostic imaging

#### Video and Broadcast

  • 8K/4K video processing — encode, decode, and format conversion
  • High-frame-rate broadcast video switching
  • Pro-AV distribution and signal routing

#### Defense and Aerospace

  • Radar and EW signal processing
  • SIGINT (signals intelligence) collection
  • High-integrity avionics data processing
  • Cryptographic and encryption acceleration

XCKU040-1FFVA1156C vs. Competing Kintex UltraScale Devices

The KU040 sits in the mid-range of the Kintex UltraScale family. The table below places it in context against adjacent family members.

Device Logic Cells Block RAM (Kbits) DSP Slices Transceivers Package Options
XCKU025 323,000 14,900 1,080 16 FC-BGA
XCKU040 530,250 21,100 1,920 24 FC-BGA
XCKU060 726,000 28,700 2,760 32 FC-BGA
XCKU085 1,045,000 42,400 4,320 32 FC-BGA
XCKU115 1,451,000 75,900 5,520 64 FC-BGA

The XCKU040 offers the optimal balance for designs that have outgrown the KU025 but do not yet need the cost and power of the KU060 and above.


Design Tools and Software Support

#### Vivado Design Suite

The XCKU040-1FFVA1156C is fully supported by the AMD Vivado® Design Suite, which provides:

  • HDL synthesis and implementation
  • Timing-driven placement and routing
  • Integrated logic analyzer (ILA) for on-chip debugging
  • Power analysis and optimization
  • IP Integrator for block-design-based flows

Vivado is co-optimized with the UltraScale architecture to achieve faster design closure and higher utilization than was possible with the earlier ISE toolchain.

#### IP Core Ecosystem

AMD Xilinx provides a rich IP core library compatible with the KU040, including:

  • PCIe Gen3 subsystem
  • 100G Ethernet subsystem
  • High Bandwidth Memory (HBM) controllers (higher-end devices)
  • JESD204B interface IP
  • Video codec and display port IP

#### Board Support and Development Kits

The KCU105 Evaluation Kit from AMD Xilinx uses the KU040 device and is the recommended starting point for hardware evaluation of the XCKU040-1FFVA1156C.


Ordering and Packaging Information

Attribute Detail
Full Part Number XCKU040-1FFVA1156C
Manufacturer AMD (formerly Xilinx, Inc.)
Package 1156-BBGA / FCBGA
Package Size 35 mm × 35 mm
Ball Pitch 1.0 mm
Temperature Grade Commercial (0°C to +85°C)
Speed Grade -1
RoHS Status Compliant
DigiKey Part Number 1088-5247390-ND
Availability Stocked / Available to Order

Note: The XCKU040-1FFVA1156C is a commercial-grade device. For industrial or extended temperature range applications, consult AMD Xilinx for alternative part options or contact your authorized distributor.


Frequently Asked Questions (FAQ)

#### What does the “-1” speed grade mean on the XCKU040-1FFVA1156C?

The “-1” in the part number indicates the standard commercial speed grade, which is the slowest speed grade offered in the Kintex UltraScale family. Higher speed grades (-2, -3) offer faster propagation delays and higher maximum clock frequencies, while the -1L variant is an ultra-low-power option. For most 100G networking and DSP applications, the -1 speed grade is sufficient.

#### Is the XCKU040-1FFVA1156C pin-compatible with Virtex UltraScale devices?

Yes. AMD Xilinx designed the Kintex UltraScale and Virtex UltraScale families with footprint compatibility in the same package sizes. The XCKU040-1FFVA1156C in its 1156-pin FCBGA package shares a compatible footprint with certain Virtex UltraScale devices, enabling designers to scale their designs to a higher-performance device without a full PCB redesign.

#### What is the core supply voltage for the XCKU040-1FFVA1156C?

The VCCINT (core logic) supply voltage is nominally 0.95V, with an operating range of 0.922V to 0.979V. The I/O supply voltages (VCCO) depend on the I/O standard used and typically range from 1.2V to 3.3V.

#### Does the XCKU040-1FFVA1156C support DDR4 memory?

Yes. The XCKU040-1FFVA1156C supports DDR4 memory interfaces at speeds up to 2,400 Mb/s, which is ideal for applications requiring high-bandwidth buffering such as packet processing and video frame buffers.

#### What programming tool is used for the XCKU040-1FFVA1156C?

The device is programmed using AMD Xilinx’s Vivado Design Suite via JTAG or through an SPI/BPI flash configuration memory. Vivado supports bitstream generation, partial reconfiguration, and hardware debugging workflows for UltraScale devices.


Summary

The XCKU040-1FFVA1156C is a high-performance, power-efficient FPGA that delivers the processing power of ASIC-class architecture in a flexible, reprogrammable package. With 530,250 logic cells, 1,920 DSP slices, 21,100 Kbits of block RAM, 24 GTH transceivers at up to 16.3 Gb/s, and a 1,156-pin FCBGA package, it stands out as an ideal choice for engineers designing 100G networking equipment, medical imaging systems, wireless infrastructure, and data center accelerators.

Built on 20nm process technology and supported by the Vivado Design Suite, the XCKU040-1FFVA1156C offers a reliable, well-documented, and ecosystem-rich platform for demanding FPGA design projects.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.