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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG1234C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1234C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Offering 200,000 system gates, a 1,234-pin Fine-Pitch BGA (FBGA) package, and a -6 commercial speed grade, this device delivers powerful programmable logic at a competitive price — making it an excellent choice for engineers looking for a proven, production-ready FPGA solution.

If you are sourcing or evaluating Xilinx FPGA components, the XC2S200-6FGG1234C deserves a close look for both new designs and legacy system support.


What Is the XC2S200-6FGG1234C? Decoding the Part Number

Understanding the part number helps engineers quickly identify the exact device:

Field Code Meaning
Device Family XC2S Xilinx Spartan-II
Gate Density 200 200,000 System Gates
Speed Grade -6 Fastest Commercial Speed Grade
Package Type FGG Fine-Pitch Ball Grid Array (Pb-Free)
Pin Count 1234 1,234 Package Pins
Temperature Range C Commercial (0°C to +85°C)

The “G” in FGG indicates a Pb-free (RoHS-compliant) package — a critical distinction for designs targeting EU markets or green manufacturing standards.


XC2S200-6FGG1234C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Delay-Locked Loops (DLLs) 4

Electrical & Physical Characteristics

Parameter Value
Supply Voltage (VCCINT) 2.5V
Technology Node 0.18 µm
Max System Performance Up to 200 MHz
Package FGG1234 (Fine-Pitch BGA)
Package Pin Count 1,234
Temperature Range Commercial: 0°C to +85°C
Speed Grade -6 (fastest in commercial range)
RoHS / Pb-Free Yes (FGG suffix)

Configuration Modes Supported

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1-bit Yes
Slave Serial Input 1-bit Yes
Slave Parallel Input 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

XC2S200-6FGG1234C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 is built around a 28 × 42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains four logic cells (slices), each with two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry logic. This architecture enables efficient implementation of both combinational and sequential logic circuits.

Block RAM and Distributed RAM

The device includes 56K bits of block RAM arranged in two columns on opposite sides of the die — ideal for data buffers, FIFOs, and lookup tables. Additionally, 75,264 bits of distributed RAM are embedded within the CLB fabric, providing fast, single-cycle access storage close to the logic.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — allow designers to eliminate clock distribution skew, multiply or divide clock frequencies, and phase-shift clocks. This is essential for high-speed synchronous designs.

Input/Output Blocks (IOBs)

The XC2S200 supports 16 programmable I/O standards, including LVTTL, LVCMOS, PCI, GTL, SSTL, and more. The large FGG1234 package provides up to 284 user I/O pins (not counting four global clock/user input pins), giving designers ample connectivity for complex interface requirements.


Spartan-II Family Comparison: Where Does the XC2S200 Fit?

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8 × 12 86 16K
XC2S30 972 30,000 12 × 18 92 24K
XC2S50 1,728 50,000 16 × 24 176 32K
XC2S100 2,700 100,000 20 × 30 176 40K
XC2S150 3,888 150,000 24 × 36 260 48K
XC2S200 5,292 200,000 28 × 42 284 56K

The XC2S200 is the highest-density device in the Spartan-II family, offering the most logic cells, I/O pins, and memory resources — making it the top choice when designers need maximum capacity within the Spartan-II platform.


Why Choose the XC2S200-6FGG1234C?

 Cost-Effective ASIC Alternative

The Spartan-II family was architected as a superior alternative to mask-programmed ASICs. Unlike ASICs, the XC2S200-6FGG1234C eliminates upfront NRE (Non-Recurring Engineering) costs, long fabrication lead times, and the inherent risk of tape-out errors. Firmware can be updated in the field — a capability impossible with fixed-function ASICs.

Fastest Commercial Speed Grade (-6)

The -6 speed grade is the highest performance option available in the commercial temperature range for Spartan-II devices. Engineers targeting maximum throughput, tight timing margins, or high-frequency clocking should select this grade. Note: the -6 speed grade is exclusively available for commercial temperature range (0°C to +85°C) applications.

Large Pin-Count Package for Complex Interfaces

The FGG1234 package (1,234-ball Fine-Pitch BGA) is one of the largest available for the XC2S200, providing access to the maximum number of user I/O pins. This makes it well-suited for applications requiring dense parallel buses, multi-standard interfaces, or multiple high-speed communication channels.

 Pb-Free / RoHS-Compliant

The “G” designation in FGG confirms that this device uses a lead-free solder ball finish, complying with RoHS directives. This is required for products shipped into the European Union and increasingly mandated across global markets.


Typical Applications for the XC2S200-6FGG1234C

The XC2S200-6FGG1234C is widely used in:

  • Telecommunications equipment – Line cards, protocol converters, and signal processing pipelines
  • Industrial control systems – Motor drives, PLCs, and real-time sensor interfaces
  • Embedded processing – Custom soft-processor implementations and co-processors
  • Test & measurement – Data acquisition, waveform generation, and automated test equipment (ATE)
  • Video and imaging – Frame buffers, pixel processing, and display controllers
  • Medical devices – High-reliability, compact logic solutions in imaging and monitoring equipment
  • Military/defense legacy support – Sustaining existing Spartan-II based board designs

Design Tool Support

The XC2S200-6FGG1234C is supported by Xilinx’s ISE Design Suite (the primary toolchain for Spartan-II devices). For engineers maintaining or migrating older designs, ISE remains the recommended environment for synthesis, placement, routing, and bitstream generation targeting Spartan-II devices.

Note: The newer Vivado Design Suite does not support Spartan-II devices. Use ISE for all XC2S200 design work.


Ordering Information & Part Marking Guide

How to Read the Spartan-II Part Number

XC2S200 - 6 - FGG - 1234 - C
  │        │    │      │    │
  │        │    │      │    └── Temperature: C = Commercial
  │        │    │      └─────── Pin Count: 1234
  │        │    └────────────── Package: FGG = Pb-Free Fine-Pitch BGA
  │        └─────────────────── Speed Grade: -6 (fastest commercial)
  └──────────────────────────── Device: Spartan-II, 200K gates

 Available XC2S200 Package Options

Part Number Package Pins Pb-Free Speed Grade Temp Range
XC2S200-6PQ208C PQFP 208 No -6 Commercial
XC2S200-6PQG208C PQFP 208 Yes -6 Commercial
XC2S200-6FG256C FBGA 256 No -6 Commercial
XC2S200-6FGG256C FBGA 256 Yes -6 Commercial
XC2S200-6FG456C FBGA 456 No -6 Commercial
XC2S200-6FGG456C FBGA 456 Yes -6 Commercial
XC2S200-6FGG1234C FBGA 1234 Yes -6 Commercial

Frequently Asked Questions (FAQ)

Is the XC2S200-6FGG1234C RoHS compliant?

Yes. The “G” in the FGG package designation confirms this is a Pb-free, RoHS-compliant version of the XC2S200 in the FGG1234 package.

 What is the difference between -5 and -6 speed grades?

The -6 speed grade offers faster propagation delays and higher maximum clock frequencies compared to the -5 grade. The -6 grade is only available in the commercial temperature range (0°C to +85°C), while -5 is available in both commercial and industrial ranges.

Can I use Vivado to program the XC2S200?

What configuration memory is compatible?

The XC2S200 is compatible with Xilinx Platform Flash PROMs (XCF series) and third-party SPI/parallel serial configuration devices for non-volatile storage of the configuration bitstream.

Is the XC2S200-6FGG1234C recommended for new designs?

Xilinx/AMD has classified Spartan-II as a mature product not recommended for new designs (NRND). For new projects, consider the Spartan-7 or Artix-7 FPGA families. However, the XC2S200-6FGG1234C remains widely available for maintenance, repair, and legacy system sustainment.


Summary

The XC2S200-6FGG1234C is the flagship device of Xilinx’s Spartan-II family — combining 200,000 system gates, 5,292 logic cells, 284 user I/Os, 56K bits of block RAM, and four DLLs in a large, Pb-free 1,234-pin BGA package. With its -6 commercial speed grade, it is the fastest and most capable Spartan-II variant, offering a compelling balance of performance, I/O density, and cost for legacy and high-volume applications.

Whether you are sustaining a production design, evaluating spares, or exploring FPGA architectures, the XC2S200-6FGG1234C remains a well-documented and broadly supported device backed by decades of Xilinx engineering.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.