The XC2S200-6FGG1226C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed as a second-generation ASIC replacement technology, this device delivers 200,000 system gates, 5,292 logic cells, and an advanced 0.18-micron process — all in a 1226-ball Fine-Pitch Ball Grid Array (FBGA) package. Whether you are developing embedded systems, telecommunications equipment, or industrial control applications, the XC2S200-6FGG1226C offers exceptional programmable logic performance at a competitive price point.
What Is the XC2S200-6FGG1226C? – Part Number Breakdown
Understanding the part number is the first step when sourcing or specifying this device.
| Field |
Value |
Meaning |
| XC2S200 |
Device Type |
Spartan-II family, 200K gate density |
| -6 |
Speed Grade |
Fastest commercial speed grade |
| FGG |
Package Type |
Fine-Pitch BGA, Pb-free (RoHS) |
| 1226 |
Pin Count |
1,226 ball FBGA package |
| C |
Temperature Range |
Commercial (0°C to +85°C) |
The “G” in “FGG” indicates a Pb-free (lead-free) package, making this variant fully RoHS compliant — an important consideration for modern electronics manufacturing and export compliance.
XC2S200-6FGG1226C Key Specifications at a Glance
| Parameter |
Specification |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Max User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Speed Grade |
-6 (fastest) |
| Core Voltage |
2.5V |
| Process Technology |
0.18 µm |
| Max System Clock |
Up to 200 MHz |
| Package |
1226-ball FBGA (FGG1226) |
| Package Type |
Pb-free / RoHS Compliant |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Configuration |
SRAM-based, unlimited reprogrammability |
XC2S200-6FGG1226C Architecture & Internal Features
Configurable Logic Blocks (CLBs)
The XC2S200 features a 28 × 42 array of Configurable Logic Blocks, yielding 1,176 CLBs total. Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture enables efficient implementation of both combinational and sequential logic.
- 4-input LUT-based logic per slice
- Each LUT configurable as a 16-bit distributed RAM
- Fast carry and arithmetic logic for high-speed math operations
SelectRAM™ Hierarchical Memory
One of the most powerful features of the XC2S200-6FGG1226C is its SelectRAM™ hierarchical memory architecture, which provides two levels of on-chip memory:
| Memory Type |
Total Capacity |
Configuration |
| Distributed RAM |
75,264 bits |
16 bits per LUT |
| Block RAM |
56,000 bits (56K) |
4K bits per block, dual-port |
Block RAM supports dual-port access, synchronous operation, and configurable aspect ratios — ideal for FIFOs, buffers, and lookup tables in high-speed data paths.
Input/Output Blocks (IOBs) and I/O Standards
The XC2S200-6FGG1226C provides up to 284 user I/O pins, making it one of the most I/O-rich configurations in the Spartan-II lineup. Its programmable IOBs support multiple I/O standards:
| I/O Standard |
Type |
| LVTTL |
Low-Voltage TTL |
| LVCMOS2 |
Low-Voltage CMOS 2.5V |
| PCI |
3.3V / 5V PCI compliant |
| GTL / GTL+ |
Gunning Transceiver Logic |
| HSTL |
High-Speed Transceiver Logic |
| SSTL2 / SSTL3 |
Stub Series Terminated Logic |
Delay-Locked Loops (DLLs)
Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — provide:
- Zero-delay clock buffering
- Clock multiplication and division
- Phase shifting for timing control
- Elimination of clock distribution skew
DLLs are critical for meeting tight setup and hold requirements in high-speed digital designs.
Spartan-II Family Comparison – Where XC2S200 Stands
| Device |
Logic Cells |
System Gates |
CLB Array |
User I/O |
Dist. RAM (bits) |
Block RAM (bits) |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, the most I/O pins, and the greatest on-chip memory capacity.
Why Choose the XC2S200-6FGG1226C Over Other Variants?
Speed Grade -6: Maximum Commercial Performance
The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range (0°C to +85°C). It is the preferred choice for applications demanding minimum propagation delays and highest throughput.
FGG1226: The Pb-Free 1226-Ball BGA Package
The FGG1226 package (1226-ball Fine-Pitch BGA, Pb-free) offers:
- Maximum pin accessibility with a large ball grid footprint
- RoHS compliance for global regulatory adherence
- Pb-free solder compatibility with modern PCB assembly processes
- Optimized for high-density board designs requiring maximum I/O routing flexibility
For engineers designing boards that must comply with REACH and RoHS directives, the “G” (Pb-free) designation in the part number is critical.
XC2S200-6FGG1226C Applications
The XC2S200-6FGG1226C is a versatile programmable logic device suited for a broad range of industries and use cases:
| Application Area |
Use Cases |
| Telecommunications |
Protocol bridging, line cards, DSP pipelines |
| Industrial Automation |
Motor control, sensor fusion, real-time I/O |
| Embedded Systems |
Custom processor cores, bus interfaces |
| Consumer Electronics |
Set-top boxes, display controllers |
| Medical Devices |
Signal acquisition, image processing |
| Networking |
Packet processing, switching fabrics |
| Test & Measurement |
Data capture, pattern generation |
| Automotive |
ADAS support circuitry, diagnostics |
Its unlimited reprogrammability makes it especially valuable in prototyping, field upgrades, and applications where design flexibility is paramount.
XC2S200-6FGG1226C vs. ASIC: Why Choose FPGA?
One of the primary value propositions of the XC2S200-6FGG1226C is its positioning as a superior alternative to mask-programmed ASICs.
| Factor |
XC2S200-6FGG1226C (FPGA) |
Custom ASIC |
| NRE Cost |
None |
High ($500K–$5M+) |
| Time to Market |
Days to weeks |
12–24 months |
| Design Risk |
Low (reprogrammable) |
High (one-shot) |
| Field Upgrades |
Yes (in-system) |
Not possible |
| Volume Cost |
Moderate |
Low (high volume) |
| Flexibility |
Full |
Fixed |
For low-to-medium volume production, the XC2S200-6FGG1226C delivers compelling economics with none of the ASIC development risk.
Configuration and Programming
The XC2S200-6FGG1226C uses SRAM-based configuration, which means:
- The device is configured at power-up from an external source (PROM, microprocessor, or other host)
- Configuration can be updated at any time — enabling field upgrades without hardware replacement
- Xilinx Platform Flash and Serial PROMs are commonly used as companion configuration devices
Supported Configuration Modes
| Mode |
Description |
| Master Serial |
FPGA auto-loads from external serial PROM |
| Slave Serial |
FPGA configured by external host controller |
| Master Parallel |
Fast parallel configuration using PROM |
| Slave Parallel (SelectMAP) |
High-speed byte-wide configuration |
| JTAG (Boundary Scan) |
IEEE 1149.1 in-system programming and debug |
JTAG support enables in-circuit debugging and boundary scan testing, which simplifies board-level test coverage significantly.
Design Tools and Software Support
The XC2S200-6FGG1226C is supported by Xilinx ISE Design Suite (legacy) as well as third-party synthesis tools. Key tools include:
- Xilinx ISE – Synthesis, implementation, and bitstream generation
- ModelSim / XSIM – HDL simulation and functional verification
- Synplify Pro – Third-party logic synthesis
- ChipScope Pro – In-system logic analysis via JTAG
- VHDL / Verilog / SystemVerilog – Fully supported HDL design entry
Note: For new designs, Xilinx (now AMD) recommends migrating to newer FPGA families. However, the XC2S200-6FGG1226C remains widely stocked for legacy system maintenance and long-lifecycle industrial applications.
Ordering Information & Part Number Variants
The XC2S200 is available in multiple speed grades and packages. The table below shows key commercial variants:
| Part Number |
Speed Grade |
Package |
Pins |
Pb-Free |
Temp Range |
| XC2S200-6FG456C |
-6 |
FBGA |
456 |
No |
Commercial |
| XC2S200-6FGG456C |
-6 |
FBGA |
456 |
Yes |
Commercial |
| XC2S200-5FG256C |
-5 |
FBGA |
256 |
No |
Commercial |
| XC2S200-5FG456C |
-5 |
FBGA |
456 |
No |
Commercial |
| XC2S200-6FGG1226C |
-6 |
FBGA |
1226 |
Yes |
Commercial |
When sourcing the XC2S200-6FGG1226C, always verify the “G” in FGG to confirm Pb-free / RoHS compliance, and confirm the 1226 pin count for your PCB footprint.
Absolute Maximum Ratings
| Parameter |
Value |
| Storage Temperature |
–65°C to +150°C |
| Core Supply Voltage (VCC) |
–0.5V to +3.0V |
| I/O Supply Voltage (VCCO) |
–0.5V to +4.0V |
| Input Voltage (VI) |
–0.5V to VCCO + 0.5V |
| Maximum Junction Temperature |
+125°C |
Always operate within recommended operating conditions. Exceeding absolute maximum ratings may permanently damage the device.
Frequently Asked Questions (FAQ)
What does the “G” in XC2S200-6FGG1226C mean?
The “G” indicates a Pb-free (lead-free) package, conforming to RoHS environmental directives. This is distinct from the standard (non-Pb-free) FG package variants.
Is the XC2S200-6FGG1226C still in production?
The Spartan-II family is considered a mature/legacy product line. Xilinx has issued product discontinuation notices for certain variants. It is recommended to check current stock from authorized distributors and plan for long-term availability if using this device in new designs.
What is the maximum I/O count of the XC2S200?
The XC2S200 supports up to 284 user I/O pins across its available packages.
Can I upgrade to a newer Xilinx FPGA?
Yes. For new designs, AMD Xilinx recommends the Spartan-7 or Artix-7 families as modern replacements offering significantly higher density, lower power, and updated tool support.
What configuration storage device should I use?
Xilinx XCF serial Platform Flash PROMs or XC18V family PROMs are compatible configuration storage devices for the Spartan-II family.
Summary: XC2S200-6FGG1226C at a Glance
The XC2S200-6FGG1226C is a mature, production-proven FPGA that continues to serve critical roles in legacy system maintenance, industrial equipment, and applications requiring the densest I/O in the Spartan-II lineup. With 200,000 system gates, 284 user I/Os, 56K bits of block RAM, and the fastest -6 speed grade in a RoHS-compliant 1226-ball BGA package, it remains a capable and well-documented programmable logic solution.
For engineers seeking a broader selection of programmable logic devices, explore our full range of Xilinx FPGA products — from legacy Spartan-II devices to the latest Artix and Virtex families.
