The XCKU115-1FLVA2104I is a high-capacity, industrial-grade Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale family. Designed for demanding signal-processing and high-bandwidth applications, this device delivers over 1.4 million system logic cells in a 2104-pin FCBGA package — making it one of the most powerful mid-range Xilinx FPGA devices available for production designs.
Whether you are developing 100G networking systems, medical imaging platforms, 8K video processing pipelines, or heterogeneous wireless infrastructure, the XCKU115-1FLVA2104I provides the performance, logic density, and I/O bandwidth to accelerate your design to market.
What Is the XCKU115-1FLVA2104I?
The XCKU115-1FLVA2104I belongs to AMD Xilinx’s Kintex UltraScale product family, built on a 20nm process node using Stacked Silicon Interconnect (SSI) technology. It combines two XCKU060 super-logic regions (SLRs) on a single package interposer to deliver maximum logic capacity without the cost premium of Virtex-class devices.
Part Number Breakdown
Understanding the part number helps engineers quickly identify key device attributes:
| Field |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial |
| KU |
KU |
Kintex UltraScale Family |
| 115 |
115 |
Device Size (largest in KU family) |
| -1 |
-1 |
Speed Grade (standard; -3 is fastest) |
| FLVA |
FLVA |
Package Type: Fine-pitch FCBGA, “A” pinout |
| 2104 |
2104 |
Pin Count (2104-pin package) |
| I |
I |
Temperature Grade: Industrial (-40°C to +100°C) |
XCKU115-1FLVA2104I Key Specifications
Core Logic & Fabric Resources
| Parameter |
Value |
| FPGA Family |
Kintex UltraScale |
| Process Node |
20nm |
| Architecture |
SSI (Stacked Silicon Interconnect), 2 SLRs |
| System Logic Cells |
1,451,100 |
| CLB Flip-Flops |
1,326,720 |
| CLB LUTs |
663,360 |
| Distributed RAM (Kb) |
10,180 |
Memory Resources
| Memory Type |
Quantity |
Total Capacity |
| Block RAM (36Kb each) |
2,160 |
75.9 Mb |
| Block RAM (18Kb each) |
4,320 |
75.9 Mb (shared) |
| FIFO36 / FIFO18 |
2,160 / 4,320 |
— |
DSP & Signal Processing
| Parameter |
Value |
| DSP48E2 Slices |
5,520 |
| Peak DSP Performance |
>8 TOPS (tera operations/sec) |
| DSP Cascade Chain |
Supported |
Transceivers & Serial I/O
| Transceiver Type |
Count |
Max Line Rate |
| GTH Transceivers |
80 |
Up to 16.3 Gb/s |
| PCIe Hard Block (Gen3 ×8) |
4 |
— |
| 100G Ethernet MAC |
2 |
— |
| 150G Interlaken |
2 |
— |
I/O & Package
| Parameter |
Value |
| Package Type |
FCBGA (Fine-pitch Ceramic BGA) |
| Package Designator |
FLVA2104 |
| Total User I/O |
702 (FLVA2104 “B” pinout) / 832 (“A” pinout) |
| HP I/O Banks |
High-Performance (1.0V–1.8V) |
| HR I/O Banks |
Not present (UltraScale uses HP only at this density) |
| XADC (Analog-to-Digital) |
1 (12-bit, 1 MSPS) |
Power & Voltage
| Parameter |
Value |
| VCCINT (Core Voltage) |
0.95V |
| VCCAUX |
1.8V |
| VCCO I/O |
1.0V, 1.2V, 1.35V, 1.5V, 1.8V (HP banks) |
| VMGTAVCC (Transceiver) |
1.0V |
| VMGTAVTT |
1.2V |
Operating Conditions
| Parameter |
Value |
| Speed Grade |
-1 (standard performance) |
| Temperature Grade |
Industrial |
| Operating Temperature |
-40°C to +100°C (junction) |
| RoHS Compliance |
Yes |
XCKU115-1FLVA2104I vs. Similar Variants
Choosing the right variant for your design depends on speed grade, package, and temperature requirements:
| Part Number |
Speed Grade |
Package |
I/O Count |
Temp Grade |
| XCKU115-1FLVA2104I |
-1 |
FLVA2104 |
832 |
Industrial |
| XCKU115-2FLVA2104I |
-2 |
FLVA2104 |
832 |
Industrial |
| XCKU115-2FLVB2104I |
-2 |
FLVB2104 |
702 |
Industrial |
| XCKU115-1FLVB2104I |
-1 |
FLVB2104 |
702 |
Industrial |
| XCKU115-2FLVA1517I |
-2 |
FFVA1517 |
624 |
Industrial |
| XCKU115-3FLVA1517C |
-3 |
FFVA1517 |
624 |
Commercial |
Note: The “A” pinout (FLVA) provides more user I/O than the “B” pinout (FLVB) in the same 2104-pin package. The -1 speed grade is the entry-level performance tier; -3 is the highest. Industrial grade (“I”) operates at extended temperature ranges vs. commercial (“C”) or extended (“E”).
Applications for the XCKU115-1FLVA2104I
The XCKU115 is the largest device in the Kintex UltraScale family and is purpose-built for bandwidth-intensive workloads. Common deployment scenarios include:
#### 100G Networking & Data Center
The integrated 100G Ethernet MACs and four PCIe Gen3 ×8 hard blocks make the XCKU115-1FLVA2104I an ideal choice for line-rate packet processing, network function virtualization (NFV), and SmartNIC designs.
#### High-Performance DSP & Radar
With 5,520 DSP48E2 slices, the device supports multi-channel digital beamforming, radar signal processing, and software-defined radio (SDR) at scale without external co-processors.
#### Medical Imaging
Next-generation CT scanners, MRI reconstruction engines, and 3D ultrasound systems benefit from the combination of high logic density, fast Block RAM access, and deterministic latency.
#### 8K/4K Video Processing
Video pipelines requiring multi-stream 4K or 8K encode/decode, frame-rate conversion, and real-time color processing leverage the XCKU115’s DSP and memory bandwidth.
#### Wireless Infrastructure (Heterogeneous Networks)
Remote radio heads, Digital Front-End (DFE) implementations for LTE/5G, and baseband unit (BBU) processing are core applications supported by the device’s high-speed GTH transceiver count.
#### ASIC Prototyping & Emulation
The large logic fabric (1.45M cells across two SLRs) and chip-to-chip interconnect bandwidth make this device a leading choice for multi-die ASIC emulation platforms.
Kintex UltraScale Architecture Highlights
#### SSI Technology (Stacked Silicon Interconnect)
The XCKU115 combines two XCKU060 super-logic regions on a passive silicon interposer, presenting as a single unified device. Inter-SLR routing uses dedicated SLL (Super Long Line) resources that provide near-on-chip bandwidth without signal integrity penalties.
#### UltraScale CLB Architecture
Each Configurable Logic Block (CLB) contains a single slice with eight 6-input LUTs and sixteen flip-flops. Each LUT can implement any 6-input logic function, two independent 5-input functions, 64-bit distributed RAM (SLICEM), or a 32-bit shift register (SRL32).
#### GTH Transceivers (Up to 16.3 Gb/s)
The 80 integrated GTH transceivers support protocols including 10GbE, 40GbE, 100GbE (via bonding), CPRI, SRIO, PCIe, and custom serial interfaces. Each transceiver includes an independent PLL and auto-equalization logic.
#### Vivado Design Suite Integration
The XCKU115-1FLVA2104I is fully supported by the AMD Vivado Design Suite, offering:
- Hierarchical design flows with incremental compilation
- IP Integrator for block-level design
- Partial Reconfiguration (PR) support
- Power-optimized synthesis and place-and-route
PCB Design & Layout Considerations
#### Power Delivery Network (PDN)
The XCKU115 requires careful multi-rail power distribution. Key supply rails and recommended sequence:
| Rail |
Voltage |
Purpose |
| VCCINT |
0.95V |
Core logic |
| VCCAUX |
1.8V |
Auxiliary circuitry |
| VMGTAVCC |
1.0V |
GTH transceiver analog |
| VMGTAVTT |
1.2V |
GTH transceiver termination |
| VCCO |
1.0–1.8V |
I/O banks (per bank) |
Recommended power-on sequence: VCCINT → VMGTAVCC → VMGTAVTT. Both VMGTAVCC and VCCINT can ramp simultaneously.
#### BGA Routing & Thermal Management
The 2104-pin FCBGA package requires controlled-impedance fanout routing on at least 8–10 PCB layers. Thermal performance depends on heatsink attachment and airflow. Consult AMD’s UltraScale PCB Design Guide (UG583) and Packaging & Pinout Specifications (UG575) for land pattern and soldering guidelines.
#### Configuration Interface
The XCKU115-1FLVA2104I supports multiple configuration modes:
- Master/Slave Serial (SPI, BPI NOR Flash)
- SelectMAP (x8/x16/x32)
- JTAG (IEEE 1149.1)
- AES-256 bitstream encryption with battery-backed key storage (VBATT)
Ordering Information
| Attribute |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU115-1FLVA2104I |
| Product Family |
Kintex UltraScale |
| Package |
2104-Pin FCBGA (FLVA) |
| Temperature Range |
-40°C to +100°C (Industrial) |
| Moisture Sensitivity |
MSL 3 |
| Lead Finish |
RoHS Compliant |
| Datasheet |
DS892 – Kintex UltraScale FPGA Data Sheet |
| Reference Design Tool |
AMD Vivado Design Suite |
Frequently Asked Questions (FAQ)
Q: What is the difference between XCKU115-1FLVA2104I and XCKU115-2FLVA2104I? The only difference is the speed grade. The -2 variant offers higher maximum operating frequencies compared to -1. Both are industrial-temperature devices in the same FLVA2104 package with identical logic resources.
Q: Is the XCKU115-1FLVA2104I RoHS compliant? Yes. All XCKU115 variants in the FLVA2104 package are RoHS compliant and suitable for lead-free assembly processes.
Q: What design software do I need for the XCKU115-1FLVA2104I? AMD Vivado Design Suite (Design Edition or higher) is required. The free WebPACK edition does not support XCKU115 devices. Minimum recommended version is Vivado 2015.4 for full production support.
Q: What is the XCKU115 configuration bitstream size? The XCKU115 bitstream is approximately 360 Mb (uncompressed). Use SPI NOR Flash devices of at least 512 Mb for reliable single-device configuration storage.
Q: Does the XCKU115-1FLVA2104I support Partial Reconfiguration? Yes. Partial Reconfiguration is supported, allowing portions of the FPGA fabric to be reconfigured while the remainder continues to operate. This is useful for dynamic function switching in deployed systems.
Summary
The XCKU115-1FLVA2104I is AMD Xilinx’s flagship mid-range FPGA, combining 1.45 million logic cells, 5,520 DSP slices, 75.9 Mb of Block RAM, and 80 GTH transceivers in an industrial-temperature 2104-pin package. Its SSI technology and UltraScale architecture make it the go-to device for 100G networking, wireless infrastructure, medical imaging, and ASIC prototyping — anywhere that demands the highest logic density and signal processing throughput at 20nm. Fully supported by the Vivado Design Suite and footprint-compatible with Virtex UltraScale devices, the XCKU115-1FLVA2104I offers a scalable, future-proof platform for the most demanding embedded and FPGA-accelerated designs.
