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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1222C: Complete Guide to the Xilinx Spartan-II FPGA

Product Details

Meta Description: The XC2S200-6FGG1222C is a high-density Xilinx Spartan-II FPGA with 200K system gates, -6 speed grade, and a fine-pitch BGA package — ideal for cost-sensitive programmable logic designs. Read the full specification guide here.


The XC2S200-6FGG1222C is a field-programmable gate array (FPGA) from Xilinx’s Spartan-II family — one of the most widely deployed low-cost FPGA series in embedded systems history. This specific variant delivers 200,000 system gates, a commercial-grade -6 speed rating, and is housed in a fine-pitch ball grid array (FBGA) package, making it a strong choice for engineers seeking a balance of performance, density, and board-level integration. Whether you are maintaining legacy industrial systems or sourcing components for a cost-optimized design, the XC2S200-6FGG1222C remains a relevant and capable device.


What Is the XC2S200-6FGG1222C? Understanding the Part Number

Before diving into specifications, it helps to decode exactly what the XC2S200-6FGG1222C part number means. Each segment of the identifier carries a specific technical meaning:

Part Number Segment Meaning
XC2S200 Xilinx Spartan-II device with 200K system gates
-6 Speed grade 6 — the fastest available grade for this family (commercial range only)
FGG Fine-Pitch Ball Grid Array (FBGA) package — lead-free (Pb-free) “G” variant
1222 Package pin/ball count descriptor
C Commercial temperature range (0°C to +85°C)

Note: The -6 speed grade is exclusively available in the commercial temperature range. Industrial temperature variants (suffix “I”) are limited to -5 speed grade.


XC2S200-6FGG1222C Full Technical Specifications

The table below summarizes the core electrical and logic specifications for the XC2S200-6FGG1222C, drawn from the official Xilinx Spartan-II data sheet (DS001).

Core Logic Resources

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Delay-Locked Loops (DLL) 4

Electrical & Timing Specifications

Parameter Value
Core Voltage 2.5V
Process Technology 0.18 µm
Max System Clock 263 MHz
Speed Grade -6 (fastest commercial)
Temperature Range 0°C to +85°C (Commercial)
Package Type Fine-Pitch BGA (FBGA)

Package & Physical Specifications

Parameter Value
Package Code FGG (Pb-free Fine-Pitch BGA)
Package Standard JEDEC MO-195
RoHS Compliance Pb-free (G suffix)
Mounting Style Surface Mount (SMT)

Key Features of the Xilinx Spartan-II XC2S200-6FGG1222C

The XC2S200-6FGG1222C inherits all the architectural strengths of the Spartan-II platform. Therefore, understanding these features helps engineers evaluate whether it fits their design requirements.

Configurable Logic Blocks (CLBs)

Each CLB in the Spartan-II architecture contains two slices, and each slice contains two four-input look-up tables (LUTs) and two flip-flops. This structure allows the XC2S200-6FGG1222C to implement a wide variety of logic functions efficiently. Furthermore, the LUTs can be used as 16×1-bit RAM or as shift registers, adding significant flexibility.

Block RAM Architecture

The XC2S200-6FGG1222C includes 56K bits of dedicated block RAM, organized in two columns on opposite sides of the die. Each block RAM can be configured as a synchronous single-port or simple dual-port memory. As a result, this device is well-suited for buffering, FIFO queues, and lookup table implementations in signal processing applications.

Delay-Locked Loops (DLL)

Four on-chip DLLs — one at each corner of the die — provide clock distribution with zero propagation delay, clock multiplication, clock division, and phase shifting. Consequently, the XC2S200-6FGG1222C achieves highly reliable, low-skew clocking across the entire device.

Input/Output Blocks (IOBs)

The IOBs support a wide range of I/O standards, including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. Each IOB contains programmable input and output delays as well as optional pull-up and pull-down resistors. This makes the XC2S200-6FGG1222C highly adaptable to multi-voltage board environments.


XC2S200-6FGG1222C vs. Other XC2S200 Speed Grades

Choosing the right speed grade is critical for meeting timing constraints. The table below compares the available speed grades for the XC2S200 within the Spartan-II family.

Speed Grade Max Clock (MHz) Temperature Range Typical Use Case
-6 263 MHz Commercial (0°C – +85°C) High-speed consumer and industrial designs
-5 ~200 MHz Commercial & Industrial General-purpose embedded designs

The -6 speed grade (as in the XC2S200-6FGG1222C) is the highest performance option available in the Spartan-II series and is exclusively offered in the commercial temperature range.


Spartan-II Family Comparison: Where Does the XC2S200 Stand?

To put the XC2S200-6FGG1222C in context, here is how it compares to other devices in the Spartan-II family.

Device Logic Cells System Gates CLB Array Max I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 5,292 200,000 28×42 284 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the most logic cells, the highest I/O count, and the largest block RAM capacity. Therefore, the XC2S200-6FGG1222C is the top-of-range option for applications that demand maximum programmable logic density within this platform.


Typical Applications of the XC2S200-6FGG1222C

The XC2S200-6FGG1222C is a versatile device used across a broad range of industries. Its combination of high gate density, multiple I/O standards, and fast clock speeds makes it suitable for the following applications:

  • Industrial automation — programmable motor control, sensor fusion, and real-time I/O processing
  • Telecommunications — line card logic, protocol bridging, and framing engines
  • Medical instrumentation — imaging data pipelines and signal conditioning logic
  • Aerospace & defense legacy systems — replacement and maintenance of existing FPGA-based designs
  • Consumer electronics prototyping — HDMI signal routing, display controllers, and USB interfaces
  • Embedded computing — glue logic between processors and peripheral devices

Because the XC2S200-6FGG1222C is a well-established device with a stable supply chain in the secondary market, it is also commonly used in equipment refurbishment and long-lifecycle industrial maintenance scenarios.


Design Tools and Software Support for the XC2S200-6FGG1222C

 Xilinx ISE Design Suite

The XC2S200-6FGG1222C is fully supported by the Xilinx ISE Design Suite, the legacy toolchain for Spartan-II and earlier Xilinx devices. ISE provides synthesis, implementation, simulation, and bitstream generation for Spartan-II targets. Notably, ISE is available as a free WebPACK edition for smaller devices and a full-featured version for larger designs.

HDL Support

The device supports both VHDL and Verilog hardware description languages. Additionally, schematic entry is supported within ISE for simpler designs. Engineers transitioning from newer Xilinx families (such as Spartan-6 or Artix-7) will find familiar design methodologies, although Vivado does not support the Spartan-II family.

 Configuration Methods

The XC2S200-6FGG1222C supports multiple configuration modes:

Configuration Mode Description
Master Serial Uses an external serial PROM
Slave Serial Configured by an external master device
Master Parallel (Byte-Wide) Faster configuration via byte-wide parallel interface
Slave Parallel Byte-wide parallel configuration from a processor
JTAG Boundary Scan IEEE 1149.1 compliant in-system programming

Ordering Information and Availability

When sourcing the XC2S200-6FGG1222C, engineers should note the following ordering considerations:

Field Detail
Manufacturer Xilinx (now AMD Xilinx)
Part Number XC2S200-6FGG1222C
Product Status Not Recommended for New Designs (NRND)
RoHS Status Pb-free (G in package suffix)
Temperature Grade Commercial (C suffix)
Primary Source Authorized distributors & secondary market suppliers

Since the Spartan-II family is classified as Not Recommended for New Designs (NRND), designers starting a new project should consider migrating to more modern Xilinx families such as the Spartan-7 or Artix-7. However, for existing systems, the XC2S200-6FGG1222C continues to be actively traded on the secondary market.

For a broader selection of programmable logic devices and sourcing options, visit Xilinx FPGA at PCBSync — a trusted resource for Xilinx component procurement.


XC2S200-6FGG1222C vs. Modern Xilinx Alternatives

For engineers evaluating a migration path away from the XC2S200-6FGG1222C, the table below compares it to current-generation Xilinx alternatives.

Feature XC2S200-6FGG1222C Spartan-7 XC7S25 Artix-7 XC7A35T
Logic Cells 5,292 23,360 33,280
Block RAM 56K bits 1,620 Kb 1,800 Kb
DSP Slices None 80 90
Max I/O 284 170 250
Core Voltage 2.5V 1.0V 1.0V
Process Node 0.18 µm 28 nm 28 nm
PCIe Support No No Yes (1 lane)
Design Tools ISE Vivado Vivado

While modern alternatives offer far greater density and integration, the XC2S200-6FGG1222C remains the correct choice when maintaining existing hardware platforms or when board redesign is not feasible.


Frequently Asked Questions About the XC2S200-6FGG1222C

Is the XC2S200-6FGG1222C still in production?

No. The XC2S200-6FGG1222C belongs to Xilinx’s Spartan-II family, which carries Not Recommended for New Designs (NRND) status. However, stock continues to circulate through the secondary market and authorized excess inventory distributors.

What is the difference between XC2S200-6FGG1222C and XC2S200-6FGG456C?

Both devices are based on the same XC2S200 silicon. The difference lies in the package: the FGG1222 and FGG456 designators refer to different fine-pitch BGA package variants with different ball counts and PCB footprints. Always verify the footprint compatibility before substituting one for the other.

Can Vivado be used to program the XC2S200-6FGG1222C?

No. The Xilinx Vivado Design Suite does not support the Spartan-II family. You must use the Xilinx ISE Design Suite (version 14.7 is the last and most stable release) for synthesis, implementation, and bitstream generation targeting the XC2S200-6FGG1222C.

What configuration PROM is compatible with the XC2S200-6FGG1222C?

Xilinx XCF series Platform Flash PROMs (such as the XCF01S and XCF02S) are commonly used with Spartan-II devices for master serial configuration. The correct PROM size depends on the bitstream size generated during implementation.

 What is the power consumption of the XC2S200-6FGG1222C?

Exact power consumption depends heavily on design activity, clock frequency, and I/O loading. Xilinx’s legacy XPower Estimator tool (available through ISE) is the recommended method for estimating power in Spartan-II designs. In general, the 2.5V core supply and 0.18 µm process result in moderate static and dynamic power compared to modern low-power FPGAs.


Summary: Should You Use the XC2S200-6FGG1222C?

The XC2S200-6FGG1222C is a mature, well-characterized Xilinx Spartan-II FPGA that delivers 200K system gates, 5,292 logic cells, 56K bits of block RAM, and a peak clock frequency of 263 MHz — all in a commercial-grade, Pb-free fine-pitch BGA package. It is the largest member of the Spartan-II family and carries the fastest available speed grade for commercial temperature applications.

While it is not recommended for new designs, the XC2S200-6FGG1222C continues to serve an essential role in legacy system maintenance, industrial equipment refurbishment, and inventory-constrained replacement scenarios. Its comprehensive support in the Xilinx ISE Design Suite and well-documented architecture make it straightforward to work with for experienced FPGA engineers.

For procurement, datasheet downloads, and technical support on the XC2S200-6FGG1222C and related Xilinx programmable logic devices, Xilinx FPGA resources are available at PCBSync to assist with component sourcing and selection.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.