Meta Description: The XC2S200-6FGG1217C is a Xilinx Spartan-II FPGA featuring 200,000 system gates, 5,292 logic cells, speed grade -6, and a Pb-free 1217-ball FGG package. Ideal for high-density commercial designs.

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The XC2S200-6FGG1217C is a high-performance, commercially graded Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. It combines 200,000 system gates, a robust 1,176-CLB array, and the fastest available -6 speed grade — all housed in a Pb-free 1217-ball Fine-Pitch Ball Grid Array (FGG) package. Whether you are designing for telecommunications, industrial automation, or embedded control systems, the XC2S200-6FGG1217C delivers exceptional logic density and I/O flexibility at a competitive price point.

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What Is the XC2S200-6FGG1217C? A Complete Overview

The XC2S200-6FGG1217C belongs to Xilinx’s Spartan-II FPGA product line — a family engineered to provide high logic capacity, abundant memory resources, and low-cost programmable logic as an alternative to mask-programmed ASICs. The part number encodes every critical design parameter:

For engineers looking to explore the full range of Xilinx FPGA products, the Spartan-II family represents one of the most cost-effective entry points into high-density programmable logic.

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XC2S200-6FGG1217C Key Technical Specifications

The XC2S200-6FGG1217C is built on Xilinx’s proven 0.18 µm, seven-layer metal CMOS process technology with a 2.5V core supply voltage. Below is a comprehensive summary of its most important parameters.

Core Logic Resources

Electrical & Timing Characteristics

Package & Physical Specifications

Note: The -6 speed grade is exclusively available in the commercial temperature range. Industrial temperature variants are not offered at this speed grade.

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XC2S200-6FGG1217C Architecture: Inside the Spartan-II Core

Configurable Logic Blocks (CLBs)

The logic fabric of the XC2S200-6FGG1217C is organized around a 28×42 array of Configurable Logic Blocks (CLBs), totalling 1,176 CLBs. Each CLB contains four logic cells, and each logic cell includes a 4-input Look-Up Table (LUT), a storage element (flip-flop or latch), and fast carry logic. This architecture enables efficient implementation of arithmetic functions, state machines, and complex combinational logic.

Block RAM and Distributed RAM

Memory is one of the standout strengths of the XC2S200-6FGG1217C. The device provides:

• 75,264 bits of distributed RAM embedded within the CLB fabric, configurable as ROM, single-port RAM, or dual-port RAM.
• 56K bits (56,000 bits) of synchronous dual-port Block RAM, arranged in two columns on opposite sides of the die.

Together, these memory resources make the XC2S200-6FGG1217C well-suited for buffering, data pipelining, and lookup table–intensive applications.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1217C incorporates four Delay-Locked Loops (DLLs), one at each corner of the die. The DLLs eliminate clock distribution skew, multiply or divide clock frequencies, and shift clock phase — significantly simplifying high-speed synchronous design across large logic arrays.

Input/Output Blocks (IOBs)

Each IOB in the XC2S200-6FGG1217C supports a wide range of industry-standard I/O interfaces. The device offers up to 284 user I/O pins (excluding four global clock/user input pins), providing extensive system connectivity. Supported I/O standards include LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL variants, giving designers maximum flexibility when interfacing with external components.

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Configuration Modes of the XC2S200-6FGG1217C

The XC2S200-6FGG1217C supports four standard configuration modes, selectable via the M[2:0] mode pins:

All I/O drivers remain in a high-impedance state during power-on and throughout the configuration process. After configuration completes, any unused I/O pins also remain in high-impedance unless otherwise specified in the bitstream settings.

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Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The XC2S200 is the largest and most capable member of the Spartan-II FPGA family. The table below shows how it compares to smaller family members.

The XC2S200-6FGG1217C occupies the top position in the family, making it the natural choice whenever a design requires the maximum logic density, I/O count, and memory resources available within the Spartan-II portfolio.

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Top Applications for the XC2S200-6FGG1217C

The XC2S200-6FGG1217C is a versatile solution across a broad range of industries. Its high gate count, deep memory, and fastest speed grade make it especially effective in:

#### Telecommunications & Networking

High-density line cards, protocol bridging, data framing, and packet processing benefit directly from the 200K gate capacity and the four DLLs for precise clock management at frequencies up to 200 MHz.

#### Industrial Automation & Control

Motion control, real-time sensor fusion, and PLC replacement applications leverage the XC2S200-6FGG1217C’s wide I/O range and flexible I/O standard support, including HSTL and SSTL for high-speed bus interfaces.

#### Embedded Computing

The device serves as a powerful glue logic and co-processing element in embedded systems, offering in-field programmability that is impossible to achieve with traditional ASICs.

#### Digital Signal Processing (DSP)

With 75,264 bits of distributed RAM and 56K bits of block RAM, the XC2S200-6FGG1217C efficiently implements FIR filters, FFT engines, and other DSP data paths without external memory dependencies.

#### Test & Measurement Equipment

The flexible configuration interface and JTAG boundary-scan capability make the XC2S200-6FGG1217C an excellent choice for in-system programming, debugging, and automated test equipment (ATE).

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XC2S200-6FGG1217C vs. ASIC: Why Choose FPGA?

A key advantage of the XC2S200-6FGG1217C over mask-programmed ASICs is full in-field programmability. This eliminates the high NRE (Non-Recurring Engineering) cost, long development cycles, and the inherent risk of silicon re-spins. Furthermore, design updates and bug fixes can be deployed without any hardware replacement, making the XC2S200-6FGG1217C particularly valuable in products with evolving firmware requirements.

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Development Tools & Software Support

The XC2S200-6FGG1217C is fully supported by Xilinx ISE Design Suite, the industry-standard toolchain for Spartan-II devices. Designers can work in VHDL or Verilog for design entry, with full synthesis, place-and-route, timing analysis, and bitstream generation covered within the ISE environment. JTAG-based in-circuit debugging is also available through ISE’s ChipScope Pro analyzer.

Key supported tools include:

• Xilinx ISE Design Suite (primary toolchain)
• ModelSim / Vivado Simulator for functional simulation
• JTAG boundary-scan via IEEE 1149.1
• Third-party IP cores for processors, memory controllers, and communication interfaces

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Ordering Information & Part Number Decoder

When ordering the XC2S200-6FGG1217C, confirm the following parameters with your distributor:

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Frequently Asked Questions: XC2S200-6FGG1217C

Q: What does the -6 speed grade mean for the XC2S200-6FGG1217C? The -6 designation identifies the fastest speed grade in the Spartan-II family. It provides the shortest propagation delays and supports the highest operating frequencies. Importantly, the -6 speed grade is only offered in the commercial temperature range.

Q: Is the XC2S200-6FGG1217C RoHS compliant? Yes. The double “G” in the FGG package designation confirms Pb-free, RoHS-compliant packaging — suitable for designs targeting European and international environmental compliance standards.

Q: What configuration memory does the XC2S200-6FGG1217C use? The XC2S200-6FGG1217C is SRAM-based and requires external configuration on every power cycle. It is typically paired with Xilinx Platform Flash PROMs or SPI/BPI flash devices that store the bitstream and load it automatically at startup.

Q: Can the XC2S200-6FGG1217C be programmed in-system? Yes. Using the Boundary-Scan (JTAG) configuration mode, the device can be configured in-system via a standard JTAG chain, enabling in-circuit programming and real-time debugging without removing the component from the PCB.

Q: What I/O standards does the XC2S200-6FGG1217C support? The device supports a comprehensive set of single-ended and differential I/O standards, including LVTTL, LVCMOS 3.3V/2.5V/1.8V, PCI, GTL/GTL+, HSTL (Class I/III), and SSTL2/SSTL3 (Class I/II).

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Summary: Why the XC2S200-6FGG1217C Is the Right Choice

The XC2S200-6FGG1217C stands out as the highest-density, fastest-speed-grade member of the Xilinx Spartan-II family in a large-scale Pb-free ball grid array package. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 75,264 bits of distributed RAM, 56K bits of block RAM, and four DLLs — all operating at up to 200 MHz — this device delivers the resources needed for complex, high-throughput digital designs. Its commercial temperature range, RoHS-compliant packaging, and full ISE toolchain support make the XC2S200-6FGG1217C a dependable, production-ready solution for engineers across telecommunications, industrial, and embedded computing sectors.