The XCKU095-1FFVA1156C is a high-performance field programmable gate array (FPGA) from AMD Xilinx’s Kintex® UltraScale™ family. Built on 20nm process technology, this device delivers an exceptional balance of signal processing bandwidth, next-generation transceiver performance, and cost-effective packaging — making it one of the most capable mid-range FPGAs available today. Whether you are designing for 100G networking, medical imaging, wireless infrastructure, or data center applications, the XCKU095-1FFVA1156C offers the logic density and connectivity you need.

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What Is the XCKU095-1FFVA1156C?

The XCKU095-1FFVA1156C is a member of AMD Xilinx’s Kintex UltraScale FPGA series. The part number breaks down as follows:

As a Xilinx FPGA, the XCKU095-1FFVA1156C is designed for demanding system-level applications where programmable logic, high-speed serial I/O, and DSP capability must coexist in a mid-range form factor.

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XCKU095-1FFVA1156C Key Specifications

The table below summarizes the essential electrical and logic specifications for the XCKU095-1FFVA1156C:

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XCKU095-1FFVA1156C Package Details

Understanding the physical package is critical for PCB design and procurement. The XCKU095-1FFVA1156C uses a 1156-pin Flip-Chip Ball Grid Array (FC-BGA) package with the following physical characteristics:

The 1156-pin FC-BGA package provides excellent signal integrity and is footprint-compatible with other Kintex UltraScale devices sharing the same FFVA1156 package designator, simplifying design migration between density options.

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XCKU095-1FFVA1156C Logic and Memory Architecture

Configurable Logic Blocks (CLBs) and LUTs

The XCKU095-1FFVA1156C features over 600,000 6-input LUTs organized inside Configurable Logic Blocks (CLBs). Each CLB contains one slice with eight LUTs and sixteen flip-flops. The LUTs can function as:

• 6-input combinational logic
• Two 5-input functions with shared inputs
• 64-bit distributed RAM (SLICEM type)
• 32-bit shift register (SRL32) for delay lines and FIFOs

Block RAM and On-Chip Memory

The device includes 1,080 36Kb Block RAM blocks with built-in FIFO and ECC support, giving designers nearly 38 Mb of dedicated on-chip storage. Block RAM in the XCKU095 features hardened memory cascade, which reduces fabric utilization and improves performance for bandwidth-intensive applications such as packet buffering, video frame storage, and lookup tables.

DSP Slices for Signal Processing

With 2,760 DSP slices (DSP48E1), the XCKU095-1FFVA1156C delivers outstanding arithmetic throughput. Each DSP slice provides:

• 27×18-bit multiplier
• 96-bit XOR for CRC and ECC
• 27-bit pre-adder for efficient sum-of-products computations
• Multiply-accumulate (MAC) and multiply-add support

This architecture makes the XCKU095-1FFVA1156C well suited for digital signal processing, FIR filters, FFT engines, neural network inference accelerators, and forward error correction (FEC) implementations.

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High-Speed Serial Transceivers

One of the defining strengths of the XCKU095-1FFVA1156C is its integrated high-speed serial transceiver infrastructure. The device includes GTH and GTY transceivers supporting:

The integrated PCIe Gen3 block supports x8 operation, making this device a strong candidate for server-side PCIe offload cards and SmartNIC designs. The 100G Ethernet and 150G Interlaken hard IP cores enable wire-rate packet processing without consuming programmable logic resources.

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Clock Management and Timing

The XCKU095-1FFVA1156C includes a robust clock management subsystem:

• Mixed-Mode Clock Managers (MMCMs) for frequency synthesis, phase shifting, and duty-cycle correction
• Phase-Locked Loops (PLLs) for low-jitter clocking
• UltraScale ASIC-like clock gating to minimize dynamic power consumption
• Clock region boundaries organized in 60-CLB-tall segments for predictable timing closure
• Up to 40% lower dynamic power consumption compared to the previous 28nm generation

The fine-grained clock gating architecture allows designers to power down unused regions of the device dynamically, making the XCKU095-1FFVA1156C well suited for power-constrained applications.

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Design Tool Support

The XCKU095-1FFVA1156C is fully supported in AMD’s Vivado Design Suite, the primary development environment for UltraScale and UltraScale+ devices.

Vivado provides synthesis, implementation, simulation, and bitstream generation in a single integrated environment. The Kintex UltraScale IP catalog includes hundreds of verified IP cores for DDR4 memory controllers, PCIe, Ethernet, video processing, and DSP functions.

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Typical Applications for the XCKU095-1FFVA1156C

The XCKU095-1FFVA1156C is deployed across a wide range of high-performance embedded and communications applications:

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XCKU095-1FFVA1156C vs. Other Kintex UltraScale Variants

The Kintex UltraScale family spans multiple density and package combinations. Here is how the XCKU095 compares to adjacent family members:

The XCKU095-1FFVA1156C offers the highest logic density in the 1156-pin FC-BGA package, making it the top choice when system board real estate is constrained but high logic capacity is required.

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Ordering Information

Note: Always verify current pricing, stock, and lead time with authorized distributors such as DigiKey, Mouser, or Arrow Electronics. Demand for Kintex UltraScale devices can vary significantly with market conditions.

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Frequently Asked Questions

What is the XCKU095-1FFVA1156C used for?

The XCKU095-1FFVA1156C is used in high-performance signal processing, 100G networking, medical imaging, wireless baseband processing, and data center acceleration. Its combination of over 1.1 million logic cells, 2,760 DSP slices, and high-speed GTH/GTY transceivers makes it ideal for compute-intensive, bandwidth-demanding systems.

What is the difference between the -1C and -1I speed grades?

The C suffix denotes a commercial temperature range (0°C to 85°C junction temperature), while the I suffix denotes an industrial temperature range (−40°C to 100°C junction temperature). The timing performance at a given speed grade is identical across temperature ranges; only the guaranteed operating range differs.

Is the XCKU095-1FFVA1156C RoHS compliant?

Yes, the XCKU095-1FFVA1156C is RoHS compliant, making it suitable for products sold in the European Union and other jurisdictions with lead-free component requirements.

What design tools are required for the XCKU095-1FFVA1156C?

The device is supported by AMD’s Vivado Design Suite (version 2015.3 and later). Vivado provides a complete RTL-to-bitstream workflow including IP integration, timing-driven place-and-route, power analysis, and in-system debugging with Integrated Logic Analyzer (ILA) cores.

Can the XCKU095-1FFVA1156C be replaced with a different density in the same package?

Yes. AMD Xilinx designed the FFVA1156 package for density scalability. The XCKU060-1FFVA1156C and XCKU095-1FFVA1156C share footprint compatibility, allowing a PCB designed for one to migrate to the other with pin-compatible design practices. Consult the UltraScale Packaging and Pinouts User Guide (UG575) for complete footprint migration details.

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Summary

The XCKU095-1FFVA1156C is a production-grade, RoHS-compliant Kintex UltraScale FPGA delivering over 1.1 million logic cells, 2,760 DSP slices, up to 520 user I/Os, and high-speed GTH/GTY transceivers in a compact 1156-pin FC-BGA package. Built on AMD’s 20nm UltraScale architecture, it provides the best price-performance-per-watt in the mid-range FPGA segment and is fully supported by the Vivado Design Suite. From 100G networking to next-generation medical imaging and 5G wireless infrastructure, the XCKU095-1FFVA1156C is engineered to meet the demands of today’s most challenging embedded system designs.