Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCKU095-1FFVC1517I: Xilinx Kintex UltraScale FPGA – Complete Product Guide

Product Details

The XCKU095-1FFVC1517I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex® UltraScale™ family. Built on a 20nm process node, this industrial-grade device delivers exceptional logic density, advanced signal processing bandwidth, and next-generation transceiver technology — all in a compact 1517-pin FCBGA package. Whether you’re designing for 100G networking, medical imaging, or heterogeneous wireless infrastructure, the XCKU095-1FFVC1517I provides the price-to-performance ratio your application demands.

For a broad selection of compatible devices, explore our full range of Xilinx FPGA solutions.


What Is the XCKU095-1FFVC1517I?

The XCKU095-1FFVC1517I is a member of the Kintex UltraScale FPGA family — AMD Xilinx’s mid-range, high-performance programmable logic platform. The part number breaks down as follows:

Code Segment Meaning
XC Xilinx Commercial/Military device
KU Kintex UltraScale family
095 Device density (KU095 die)
-1 Speed grade (-1 = standard speed, 0.95V VCCINT)
FFVC Fine-pitch Flip Chip BGA, “C” variant package
1517 1517-pin package
I Industrial temperature grade (–40°C to +100°C)

The “I” suffix is critical — it denotes an industrial-temperature-rated device, making the XCKU095-1FFVC1517I suitable for demanding environments where commercial-grade parts would fail.


XCKU095-1FFVC1517I Key Specifications

Core Architecture & Logic Resources

Parameter Value
FPGA Family Kintex UltraScale
Process Node 20nm
Logic Cells (Equivalent) 1,176,000
CLB Logic Slices ~537,600
Look-Up Tables (LUTs) ~537,600 (6-input)
Flip-Flops ~1,075,200
DSP48E2 Slices 2,760
Block RAM (36Kb blocks) 1,080 (total ~60.5 Mb)
UltraRAM (288Kb blocks) 0 (UltraScale, not UltraScale+)
CMTs (MMCM + PLL) 12
Max Clock Frequency 630 MHz (speed grade -1)

Package & Electrical Characteristics

Parameter Value
Package Type FCBGA (Fine-pitch Flip Chip BGA)
Pin Count 1,517
User I/O Up to 600
VCCINT (Core Voltage) 0.95V (922mV – 979mV range)
Temperature Grade Industrial: –40°C to +100°C (Tj)
RoHS Compliance Yes
Mounting Style Surface Mount Technology (SMT)

High-Speed Transceivers

Parameter Value
GTH Transceiver Channels 24 (in the FFVC1517 package)
Max GTH Line Rate 16.3 Gb/s
Integrated Hard IP PCIe Gen3 ×8, 100G Ethernet, 150G Interlaken

XCKU095-1FFVC1517I vs. Related Kintex UltraScale Variants

Understanding where the XCKU095-1FFVC1517I sits within the product family helps engineers choose the right device for their design.

Part Number Package I/O Pins Temperature Speed Grade
XCKU095-1FFVA1156C FCBGA-1156 520 Commercial (0–85°C) -1
XCKU095-1FFVA1156I FCBGA-1156 520 Industrial (–40–100°C) -1
XCKU095-1FFVC1517I FCBGA-1517 ~600 Industrial (–40–100°C) -1
XCKU095-1FFVC1517C FCBGA-1517 ~600 Commercial (0–85°C) -1
XCKU095-2FFVC1517I FCBGA-1517 ~600 Industrial (–40–100°C) -2 (faster)
XCKU095-1FFVB1760I FCBGA-1760 702 Industrial (–40–100°C) -1

Key Takeaway: The XCKU095-1FFVC1517I is the industrial-grade version of the 1517-pin variant at the standard (-1) speed grade. It offers a significant step up in I/O count compared to the 1156-pin package while maintaining industrial temperature compliance.


Why Choose the XCKU095-1FFVC1517I?

#### Best-in-Class Price/Performance/Watt at 20nm

The Kintex UltraScale family is engineered to deliver up to 40% lower power compared to the previous Kintex-7 generation. The XCKU095-1FFVC1517I achieves this through ASIC-like clocking architecture, granular clock gating, and AMD Xilinx’s advanced 20nm TSMC process, minimizing both static and dynamic power consumption without sacrificing throughput.

#### Industry-Leading DSP Signal Processing Bandwidth

With 2,760 DSP48E2 slices, the XCKU095-1FFVC1517I delivers the highest signal-processing bandwidth available in a mid-range FPGA. This makes it an ideal candidate for:

  • Digital predistortion (DPD) in wireless base stations
  • Radar and beamforming algorithms
  • Real-time medical image reconstruction (CT, MRI)
  • Machine learning inference acceleration
  • Software-defined radio (SDR) platforms

#### Next-Generation GTH Transceivers at 16.3 Gb/s

The device integrates 24 GTH transceivers capable of operating up to 16.3 Gb/s per lane. These support a wide range of industry-standard protocols including PCIe Gen3, CPRI, JESD204B, 10GbE, 25GbE, and Interlaken, reducing the need for external retimers or CDR chips.

#### Integrated Hard IP Blocks

Rather than consuming valuable fabric resources, the XCKU095-1FFVC1517I includes dedicated hardened IP for:

  • PCIe Gen3 ×8 — for high-bandwidth host interface applications
  • 100G Ethernet MAC — critical for data center and networking line cards
  • 150G Interlaken — enabling chip-to-chip and chip-to-module interconnect

#### Industrial Temperature Reliability

The “I” temperature grade certifies operation from –40°C to +100°C junction temperature, making the XCKU095-1FFVC1517I suitable for industrial control systems, military-derived COTS applications, outdoor networking equipment, and transportation electronics.


Supported Applications

The XCKU095-1FFVC1517I is widely deployed across high-demand industries:

Industry Typical Application
Telecommunications 4G/5G Remote Radio Heads, DFE, Massive MIMO
Data Center & Networking 100G line cards, packet processing, NFV acceleration
Medical Imaging CT/PET reconstruction, ultrasound beamforming
Aerospace & Defense Radar, EW, SIGINT (COTS-grade)
Industrial Automation High-speed vision systems, real-time control
Broadcast Video 8K/4K video processing pipelines
Test & Measurement High-speed data capture, protocol analyzers

Development Ecosystem & Design Tools

#### Vivado Design Suite

The XCKU095-1FFVC1517I is fully supported by AMD Xilinx’s Vivado Design Suite (version 2015.3 and later, with production speed files v1.24+). Vivado provides:

  • RTL synthesis and implementation
  • Timing analysis and constraint management
  • On-chip power estimation (XPE)
  • Bitstream generation and device programming

#### IP Catalog & Reference Designs

AMD Xilinx’s IP catalog includes hundreds of pre-verified IP cores optimized for the UltraScale architecture — including MIG for DDR4 memory, PCIe endpoint controllers, 100G Ethernet subsystems, and JESD204B interfaces — dramatically reducing time-to-market.

#### High-Level Synthesis (HLS)

For teams working in C/C++ or OpenCL, Vitis HLS (formerly Vivado HLS) allows algorithm-level design entry, with automatic conversion to RTL targeting the XCKU095-1FFVC1517I’s logic fabric and DSP resources.


Ordering Information

Attribute Detail
Manufacturer AMD (formerly Xilinx)
Part Number XCKU095-1FFVC1517I
Alternative P/N XCKU095-1FFVC1517C (commercial temp grade)
Package 1517-Pin FCBGA
Mounting Surface Mount (SMT)
Temperature Grade Industrial
Packaging Tray
RoHS Compliant

Frequently Asked Questions (FAQ)

What is the difference between XCKU095-1FFVC1517I and XCKU095-1FFVC1517C?

The only difference is the temperature grade. The “I” suffix denotes Industrial (–40°C to +100°C), while the “C” suffix denotes Commercial (0°C to +85°C). All logic resources, speed grade, and electrical characteristics are otherwise identical.

What speed grade is the XCKU095-1FFVC1517I?

The device is a -1 speed grade, operating at a core voltage (VCCINT) of 0.95V. The -1 speed grade achieves maximum clock frequencies up to approximately 630 MHz for register-to-register timing paths in typical designs.

Is the XCKU095-1FFVC1517I in production?

Yes. AMD Xilinx released the XCKU095 to production status with Vivado 2015.3 software, speed file version v1.24. It is a mature, production-qualified device.

What memory interfaces can the XCKU095-1FFVC1517I support?

Using the MIG (Memory Interface Generator) IP, the device supports DDR4, DDR3, LPDDR3, and QDR-IV SRAM interfaces, as well as HBM when used in SSI configurations. DDR4 rates up to 2,400 MT/s are achievable with proper PCB layout.

What programming tools are compatible?

The device requires Vivado Design Suite 2015.3 or later. Legacy ISE is not compatible with UltraScale devices.


Summary

The XCKU095-1FFVC1517I stands out as one of the most capable mid-range FPGAs available for industrial and high-performance applications. With 1.17 million logic cells, 2,760 DSP slices, 60.5 Mb of block RAM, 24 GTH transceivers at 16.3 Gb/s, and hard-IP support for PCIe Gen3 and 100G Ethernet — all delivered in a compact 1517-pin FCBGA and rated for industrial temperature ranges — it provides a compelling balance of capability, power efficiency, and design flexibility. Designers across telecommunications, data center, medical, and defense markets continue to rely on this device for their most demanding next-generation systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.