Meta Description: Buy XC2S200-6FGG1215C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, 1215-ball Pb-free FBGA package. Full specs, pinout, and applications inside.
The XC2S200-6FGG1215C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a robust 1215-ball Fine-Pitch Ball Grid Array (FBGA) Pb-free package, this component is engineered for demanding digital design applications. Whether you are working in telecommunications, industrial automation, or embedded systems, the XC2S200-6FGG1215C delivers exceptional logic density, flexible I/O support, and reliable commercial-grade performance — all backed by Xilinx’s proven 0.18µm process technology.
For a broader selection of compatible devices, explore the full range of Xilinx FPGA solutions available today.
What Is the XC2S200-6FGG1215C? A Complete Product Overview
The XC2S200-6FGG1215C belongs to the Xilinx Spartan-II FPGA family, a six-member product line spanning densities from 15,000 to 200,000 system gates. The XC2S200 sits at the top of this family, making it the most capable device in the series. The “-6” suffix indicates the fastest available commercial speed grade, while “FGG1215” identifies the 1215-ball Pb-free Fine-Pitch BGA package. The trailing “C” confirms its Commercial temperature range (0°C to +85°C).
As a programmable logic device, it offers engineers the flexibility to implement complex digital logic without the high non-recurring engineering (NRE) costs or long lead times associated with mask-programmed ASICs. Furthermore, its in-field reconfigurability makes it ideal for designs that require iterative updates post-deployment.
XC2S200-6FGG1215C Key Specifications at a Glance
General Device Specifications
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Spartan-II |
| Part Number |
XC2S200-6FGG1215C |
| Number of Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O Pins |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Delay-Locked Loops (DLLs) |
4 |
| Configuration Bits |
1,335,840 |
| Process Technology |
0.18µm |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Fastest Commercial) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Package Type |
FGG1215 – 1215-Ball Pb-Free Fine-Pitch BGA |
| RoHS Compliance |
Pb-Free (Pb-Free “G” suffix) |
XC2S200-6FGG1215C Memory Resources
| Memory Type |
Capacity |
| Total Block RAM |
56,000 bits (56K) |
| Total Distributed RAM |
75,264 bits |
| Combined On-Chip RAM |
131,264 bits |
Spartan-II Family Comparison – Where XC2S200 Ranks
| Device |
Logic Cells |
System Gates |
CLB Array |
Total CLBs |
Max I/O |
Dist. RAM (bits) |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
96 |
86 |
6,144 |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
216 |
92 |
13,824 |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
384 |
176 |
24,576 |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
600 |
176 |
38,400 |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
864 |
260 |
55,296 |
48K |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
1,176 |
284 |
75,264 |
56K |
The XC2S200-6FGG1215C clearly stands at the apex of the Spartan-II lineup, offering the highest logic density, the largest distributed and block RAM, and the most available user I/O pins in the family.
XC2S200-6FGG1215C Architecture and Internal Structure
Configurable Logic Blocks (CLBs)
The core of the XC2S200-6FGG1215C is its 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling highly flexible digital logic implementation. This structured CLB grid supports fast and predictable interconnect routing, ensuring that successive design iterations consistently meet timing requirements.
Block RAM and Distributed RAM
The XC2S200-6FGG1215C provides two complementary on-chip memory architectures:
- Block RAM (56K bits): Dedicated dual-port memory blocks positioned in two vertical columns on opposite sides of the die. These are ideal for buffering, FIFOs, and lookup tables requiring high-bandwidth access.
- Distributed RAM (75,264 bits): Implemented within the CLB fabric itself, this memory is ideal for small, fast data storage distributed throughout the logic array.
Delay-Locked Loops (DLLs)
Four dedicated Delay-Locked Loops (DLLs) — one at each corner of the die — eliminate clock skew and enable precise clock edge alignment. They also support clock frequency synthesis and phase shifting, which is critical for high-speed synchronous designs.
Input/Output Blocks (IOBs)
The XC2S200-6FGG1215C supports up to 284 user I/O pins, each backed by a flexible IOB that supports 16 selectable I/O standards, including:
- LVTTL
- LVCMOS (1.8V, 2.5V, 3.3V)
- PCI (3.3V, 66 MHz)
- GTL / GTL+
- HSTL (Class I, III, IV)
- SSTL (2 and 3, Class I and II)
XC2S200-6FGG1215C Package Information – FGG1215 Explained
Decoding the Part Number
| Code |
Meaning |
| XC |
Xilinx Commercial Device |
| 2S200 |
Spartan-II, 200K Gates |
| -6 |
Speed Grade -6 (Fastest, Commercial Only) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-Free |
| 1215 |
1215 Solder Balls |
| C |
Commercial Temperature Range (0°C to +85°C) |
Why the FGG1215 Package?
The 1215-ball Pb-free Fine-Pitch BGA package is the largest package available for the XC2S200. It offers maximum pin accessibility and is especially well-suited for applications where board-level integration requires extensive I/O routing and high pin density. The Pb-free “GG” designation confirms compliance with RoHS environmental standards, making it suitable for designs sold in the European Union and other regulated markets.
XC2S200-6FGG1215C Configuration Modes
The XC2S200-6FGG1215C supports four standard configuration modes, offering design flexibility for different system architectures.
| Configuration Mode |
Pre-Config Pull-ups |
M[2:0] |
CCLK Direction |
Data Width |
Serial DOUT |
| Master Serial |
No |
000 |
Output |
1-bit |
Yes |
| Slave Parallel |
Yes |
010 |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
Yes |
100 |
N/A |
1-bit |
No |
| Slave Serial |
Yes |
110 |
Input |
1-bit |
Yes |
During power-on and throughout the configuration process, all I/O drivers enter a high-impedance state, protecting downstream circuitry until the FPGA is fully configured.
Top Applications for the XC2S200-6FGG1215C
The XC2S200-6FGG1215C is a versatile device suitable for a wide range of professional and industrial applications. Its high gate count, generous I/O, and commercial speed grade make it particularly effective in the following areas:
Telecommunications and Networking
The device handles high-speed data processing and complex signal manipulation with ease. It is commonly deployed in network routers, communication protocol implementation, and high-speed serial data links.
Industrial Automation and Motor Control
In factory automation environments, the XC2S200-6FGG1215C enables precise digital control of motor drives, PLCs, and process automation systems. Its deterministic timing and rugged design make it reliable for 24/7 industrial operation.
Embedded Systems and Digital Signal Processing
Engineers use the XC2S200-6FGG1215C to implement custom DSP pipelines, image processing engines, and embedded CPU cores using HDL designs or soft-processor IP cores.
Medical Imaging and Diagnostic Equipment
The combination of on-chip RAM, deterministic I/O timing, and reconfigurability makes this FPGA well-suited for medical imaging devices, patient monitoring systems, and diagnostic tools where accuracy is critical.
Security and Surveillance Systems
High data-throughput requirements in biometric identification, encryption engines, and surveillance video processing are well-matched to the XC2S200-6FGG1215C’s logic density and I/O capabilities.
XC2S200-6FGG1215C Advantages Over Mask-Programmed ASICs
One of the core value propositions of the XC2S200-6FGG1215C is its role as a cost-effective and flexible alternative to traditional ASICs. Key advantages include:
| Feature |
XC2S200-6FGG1215C (FPGA) |
Traditional ASIC |
| NRE (Non-Recurring Engineering) Cost |
None |
Very High ($500K+) |
| Time to Market |
Days to Weeks |
Months to Years |
| In-Field Reconfigurability |
Yes |
No |
| Design Risk |
Low |
High |
| Minimum Order Quantity |
1 Unit |
Often 10,000+ |
| Prototype Iteration Speed |
Fast |
Slow |
The XC2S200-6FGG1215C is therefore an excellent choice for low-volume production runs, prototyping, and any application requiring future design flexibility.
Development Tools and Software Support
Xilinx ISE Design Suite
The XC2S200-6FGG1215C is supported by the Xilinx ISE Design Suite, the primary development environment for Spartan-II devices. ISE provides:
- HDL synthesis (VHDL, Verilog)
- Place-and-Route (PAR)
- Timing analysis and simulation
- JTAG programming via iMPACT
Note: Because the XC2S200 is a legacy device, it is not supported by Vivado Design Suite. Designers should use ISE version 14.7, the final release that supports Spartan-II.
Supported Programming Languages
| Language |
Support Level |
| VHDL |
Full |
| Verilog |
Full |
| ABEL |
Limited |
| Schematic Entry |
Supported via ISE |
XC2S200-6FGG1215C vs. Common Alternatives
| Part Number |
Gates |
Speed Grade |
Package |
Pb-Free |
I/O Pins |
| XC2S200-6FGG1215C |
200K |
-6 |
FGG1215 |
Yes |
284 |
| XC2S200-6FGG456C |
200K |
-6 |
FGG456 |
Yes |
284 |
| XC2S200-6FG256C |
200K |
-6 |
FG256 |
No |
176 |
| XC2S200-5FGG456C |
200K |
-5 |
FGG456 |
Yes |
284 |
| XC2S150-6FGG456C |
150K |
-6 |
FGG456 |
Yes |
260 |
The FGG1215 package uniquely provides the highest pin count and is the Pb-free variant of the largest available Spartan-II package, making the XC2S200-6FGG1215C the premium configuration within the XC2S200 lineup.
Frequently Asked Questions About the XC2S200-6FGG1215C
What does the “-6” speed grade mean?
The -6 speed grade is the fastest commercially available speed grade for the Spartan-II family. It is exclusively available in the Commercial temperature range (0°C to +85°C). A lower number in Xilinx speed grades indicates faster performance.
Is the XC2S200-6FGG1215C RoHS compliant?
Yes. The double-“G” suffix in “FGG1215” denotes a Pb-free (lead-free) package, meaning the device is RoHS compliant and suitable for environmentally regulated markets.
What is the core voltage of the XC2S200-6FGG1215C?
The device operates on a 2.5V core voltage, consistent across the entire Spartan-II family. I/O voltages are configurable per bank through selectable I/O standards.
Can the XC2S200-6FGG1215C be used for new designs today?
While Xilinx classifies the Spartan-II family as Not Recommended for New Designs (NRND), it remains widely available on the secondary market for maintenance, legacy system repair, and production continuity purposes.
What configuration interface does the XC2S200-6FGG1215C support?
It supports Master Serial, Slave Serial, Slave Parallel (SelectMAP), and JTAG (Boundary-Scan) configuration modes, offering broad compatibility with external configuration controllers and PROM devices.
Conclusion: Is the XC2S200-6FGG1215C Right for Your Project?
The XC2S200-6FGG1215C is a powerful, proven Xilinx Spartan-II FPGA that delivers the family’s maximum logic density, fastest commercial speed grade, and a large-ball-count Pb-free package. It excels in legacy system maintenance, high-I/O embedded applications, and any design that benefits from the extensive on-chip RAM and flexible I/O standards offered by the Spartan-II platform.
If you are sourcing this device or exploring compatible alternatives, be sure to verify specifications against Xilinx datasheet DS001 and confirm availability from a trusted distributor to ensure authentic, quality-guaranteed components.