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XCKU035-1SFVA784C: AMD Xilinx Kintex UltraScale FPGA – Complete Product Guide

Product Details

The XCKU035-1SFVA784C is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale series. Built on 20nm process technology, this device delivers an exceptional balance of logic density, signal processing bandwidth, and power efficiency — making it one of the most capable mid-range FPGAs available for demanding embedded applications. Whether you are designing for telecommunications, defense, medical imaging, or data center workloads, the XCKU035-1SFVA784C offers the computational resources and flexibility to meet your requirements.


What Is the XCKU035-1SFVA784C?

The XCKU035-1SFVA784C is a commercial-grade, speed grade -1, member of the Xilinx FPGA Kintex UltraScale family. It is housed in a 784-ball FCBGA (Flip Chip Ball Grid Array) package — also referred to as the SFVA784 package — with a compact 23×23mm body. This device is fully RoHS compliant and is optimized for surface-mount assembly on high-density PCBs.

The “XCKU035” designation indicates it belongs to the mid-range tier of the Kintex UltraScale product line, offering greater logic resources than the XCKU025 while remaining more cost-efficient than the XCKU040, XCKU060, and larger siblings. The “-1” speed grade represents the standard commercial performance tier, and the “C” suffix denotes the commercial operating temperature range (0°C to 85°C).


XCKU035-1SFVA784C Key Specifications at a Glance

Parameter Value
Part Number XCKU035-1SFVA784C
Manufacturer AMD (Xilinx)
FPGA Family Kintex UltraScale
Process Technology 20nm
Logic Cells / Macrocells 444,343
Configurable Logic Blocks (CLBs) 25,391
Look-Up Tables (LUTs) 203,128
Total RAM Bits 19,456 Kbit (19,456,000 bits)
User I/O Pins 468
Total Package Pins 784
Package Type FCCSP BGA (SFVA784)
Package Dimensions 23mm × 23mm
Speed Grade -1 (Commercial)
Operating Temperature 0°C to 85°C
Core Supply Voltage (VCCINT) Min 922 mV
Core Supply Voltage (VCCINT) Max 979 mV
I/O Supply Voltage Up to 3.3V
Maximum Operating Frequency 630 MHz
Clock Management MMCM, PLL
RoHS Compliant Yes
MSL Rating MSL 4 – 72 hours

Detailed Technical Specifications

Logic Architecture and Density

At the core of the XCKU035-1SFVA784C is AMD Xilinx’s UltraScale architecture — an ASIC-like programmable architecture that eliminates traditional FPGA routing penalties found in previous generations. The device integrates 444,343 logic cells organized across 25,391 Configurable Logic Blocks (CLBs), each containing LUTs, flip-flops, and carry chains for arithmetic-intensive designs.

With 203,128 6-input Look-Up Tables (LUTs), designers have an extensive fabric for implementing complex combinational and sequential logic. Fine-grained CLBs allow efficient mapping of DSP-heavy algorithms, state machines, and custom accelerators with minimal resource waste.

Memory Resources

Memory Type Capacity
Total On-Chip RAM 19,456 Kbits (≈ 2.37 MB)
Block RAM (BRAM) High-density 36Kb BRAM tiles
UltraRAM (URAM) Not available on base KU035
Distributed RAM Implemented via LUTs

The large block RAM capacity enables efficient on-chip data buffering, FIFO management, and look-up table storage without external memory dependencies — critical for low-latency real-time processing applications.

I/O Capabilities

I/O Parameter Value
Total User I/O Pins 468
Package Pins 784 (SFVA784)
I/O Standards Supported LVCMOS, LVDS, SSTL, HSTL, and more
Maximum I/O Supply Voltage 3.3V
Differential I/O Pairs Yes (LVDS-capable banks)

The 468 user-accessible I/O pins cover a broad range of single-ended and differential signaling standards. This makes the XCKU035-1SFVA784C well-suited for interfacing with DDR memory controllers, high-speed ADC/DAC converters, multi-gigabit serial links, and general-purpose logic interfaces.

Clock Management

The XCKU035-1SFVA784C includes advanced clock management resources:

Clock Resource Type
Mixed-Mode Clock Manager MMCM
Phase-Locked Loop PLL
Maximum Clock Frequency 630 MHz
Clock Routing Global, Regional, and Local networks

MMCM and PLL resources provide precise frequency synthesis, phase shifting, and duty cycle correction — essential for multi-clock domain designs, high-speed serial interfaces, and synchronous memory controllers.

Power and Voltage Supply

Power Parameter Value
Core Voltage (VCCINT) Min 922 mV
Core Voltage (VCCINT) Max 979 mV
I/O Voltage (VCCO) Up to 3.3V
Auxiliary Supply (VCCAUX) 1.8V (typical)
Power Optimization Fine-grain clock gating, ASIC-like clocking

AMD Xilinx’s UltraScale architecture on 20nm delivers up to 40% lower power compared to previous-generation devices at equivalent performance levels — a significant advantage for power-constrained designs in embedded and rack-mount environments.


Package and Physical Characteristics

SFVA784 Package Details

Package Parameter Detail
Package Code SFVA784
Package Type Flip Chip BGA (FCCSPBGA)
Total Ball Count 784
Body Size 23mm × 23mm
Mounting Style Surface Mount Technology (SMT)
MSL (Moisture Sensitivity Level) MSL 4 – 72 hours
RoHS Compliance Yes

The compact 23×23mm footprint enables high-density board designs without sacrificing I/O or performance. The flip-chip BGA construction delivers excellent thermal dissipation and signal integrity — key requirements for designs running at hundreds of megahertz.


Ordering Information and Part Number Decoding

Understanding the XCKU035-1SFVA784C part number helps engineers quickly identify device characteristics:

Segment Meaning
XC Xilinx Commercial
KU Kintex UltraScale Family
035 Device Size/Tier (mid-range)
-1 Speed Grade (-1 = Standard Commercial)
S Package Modifier
FVA Flip-Chip VBGA Architecture
784 Pin Count (784 balls)
C Temperature Grade (C = Commercial: 0°C to 85°C)

Available Speed Grades for XCKU035 in SFVA784 Package

Part Number Speed Grade Temperature Grade
XCKU035-3SFVA784E -3 (Fastest) Extended
XCKU035-2SFVA784I -2 Industrial
XCKU035-2SFVA784E -2 Extended
XCKU035-1SFVA784C -1 (Standard) Commercial
XCKU035-1SFVA784I -1 Industrial
XCKU035-L1SFVA784I -1L (Low Power) Industrial

Kintex UltraScale Architecture Overview

The XCKU035-1SFVA784C is built on AMD Xilinx’s UltraScale Architecture, which introduced several landmark improvements over the previous 7-Series FPGA generation:

UltraScale ASIC-Like Clocking

Traditional FPGAs suffer from significant timing closure challenges due to non-deterministic routing delays. The UltraScale architecture introduces ASIC-like clocking — a structured clock tree topology that reduces skew, enables predictable timing across the fabric, and supports fine-grain clock gating at individual CLB level. This translates directly to higher operating frequencies and reduced active power consumption.

Next-Generation Transceivers

The Kintex UltraScale family includes high-speed serial transceivers supporting multi-gigabit interfaces — enabling applications such as 100G Ethernet packet processing, PCIe Gen3, JESD204B high-speed ADC/DAC interfaces, Interlaken, and custom serial protocols.

High DSP and BRAM to Logic Ratios

The XCKU035 is architecturally optimized for digital signal processing. The high ratio of DSP48E2 slices and BRAM to logic resources makes it particularly effective for FFT engines, FIR filters, matrix multiplication, and machine learning inference accelerators.

Vivado Design Suite Integration

All Kintex UltraScale devices are supported exclusively by the Xilinx Vivado Design Suite, which provides:

  • RTL synthesis and optimization
  • Timing-driven place and route
  • In-circuit debugging via Integrated Logic Analyzer (ILA)
  • IP Integrator for block-design based development
  • Partial reconfiguration support
  • High-Level Synthesis (HLS) via Vitis HLS

XCKU035-1SFVA784C Applications

The combination of high logic density, fast clock rates, rich memory, and broad I/O support makes the XCKU035-1SFVA784C a strong fit for the following application domains:

Telecommunications and Networking

  • 100G Ethernet packet processing and classification
  • Multi-protocol line card acceleration
  • 5G baseband processing and beamforming
  • CPRI/eCPRI fronthaul interfaces

Defense and Aerospace

  • Radar and electronic warfare signal processing
  • Software-defined radio (SDR) front-end processing
  • Secure communications and cryptographic accelerators
  • High-reliability data acquisition systems

Medical Imaging

  • Ultrasound beamforming engines
  • CT/MRI reconstruction pipelines
  • High-speed medical sensor interface controllers
  • Real-time image processing at 8K4K resolution

High-Performance Computing and Data Centers

  • Hardware accelerators for AI/ML inference
  • Custom memory controllers and cache coherence logic
  • FPGA-based network interface cards (SmartNICs)
  • Low-latency co-processor for financial analytics

Industrial Automation

  • Multi-axis motor control and servo drive logic
  • Real-time industrial communication (EtherCAT, PROFINET)
  • Machine vision processing pipelines
  • Sensor fusion and control loop implementation

Comparison: XCKU035 vs. Related Kintex UltraScale Devices

Feature XCKU025 XCKU035 XCKU040 XCKU060
Logic Cells ~301K ~444K ~530K ~726K
CLBs ~17K ~25K ~30K ~41K
Total RAM Bits ~13,000 Kb ~19,456 Kb ~23,000 Kb ~38,000 Kb
User I/O (SFVA784) 468 468 468 N/A
Max Frequency 630 MHz 630 MHz 630 MHz 630 MHz
Price/Performance Entry Mid (Best Value) Mid-High High

The XCKU035 sits at the sweet spot for mid-range programmable logic designs — significantly more capable than the XCKU025 while avoiding the cost premium of the XCKU040 and above. For designs that need substantial logic capacity without requiring the extreme density of upper-tier devices, the XCKU035-1SFVA784C delivers outstanding value.


Design and Development Resources

Engineers working with the XCKU035-1SFVA784C have access to AMD Xilinx’s comprehensive development ecosystem:

Resource Description
Vivado Design Suite Primary IDE for synthesis, implementation, and debug
Vitis Unified Software Platform For embedded software and HLS-based design
Xilinx Power Estimator (XPE) Static and dynamic power analysis tool
IP Catalog Pre-verified IP cores (PCIe, DDR, Ethernet, etc.)
Partial Reconfiguration Dynamic reconfiguration of FPGA regions at runtime
Hardware Debug (ILA, VIO) In-system signal capture and stimulus injection
KCU105 Evaluation Kit Reference development board for the KU-series
Xilinx Answer Records FAQs, errata, and application notes

Frequently Asked Questions (FAQ)

What is the XCKU035-1SFVA784C used for?

The XCKU035-1SFVA784C is used in applications requiring programmable logic with high signal processing bandwidth, including telecommunications equipment, defense electronics, medical imaging systems, and high-performance computing accelerators.

What is the difference between XCKU035-1SFVA784C and XCKU035-1SFVA784I?

The only difference is the temperature grade. The “C” suffix indicates a commercial temperature range of 0°C to 85°C, while the “I” suffix indicates the industrial temperature range of -40°C to 100°C. All logic, I/O, and speed specifications remain identical at the -1 speed grade.

What design tools support the XCKU035-1SFVA784C?

The device is supported by the Xilinx Vivado Design Suite (2014.x and later). The older ISE Design Suite does not support UltraScale devices. AMD also provides Vitis HLS for high-level synthesis flows.

Is the XCKU035-1SFVA784C RoHS compliant?

Yes. The XCKU035-1SFVA784C is fully RoHS compliant, making it suitable for designs targeting the European Union and other markets with hazardous substance restrictions.

What is the MSL rating of the XCKU035-1SFVA784C?

The device carries an MSL 4 rating, which means it must be used within 72 hours of opening the moisture-barrier bag, or it must be baked prior to soldering if the floor life has been exceeded.

How many I/O pins does the XCKU035-1SFVA784C have?

The device provides 468 user-accessible I/O pins within the 784-ball SFVA package.


Summary

The XCKU035-1SFVA784C is a proven, production-grade FPGA that brings AMD Xilinx’s UltraScale architecture to mid-range applications with demanding logic, DSP, and connectivity requirements. With 444,343 logic cells, 19,456 Kbits of on-chip RAM, 468 I/O pins, and support for clock frequencies up to 630 MHz, it delivers significant computational muscle in a compact 784-ball BGA package. Fully supported by the Vivado Design Suite and AMD’s extensive IP ecosystem, it is an ideal choice for engineers designing next-generation telecommunications, defense, medical, and data center systems.

For procurement inquiries, volume pricing, and technical support on the XCKU035-1SFVA784C and related Kintex UltraScale devices, contact your authorized AMD Xilinx distributor or visit the AMD product page directly.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.