The XC2S200-6FGG1207C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, delivering 200,000 system gates and 5,292 logic cells in a lead-free (Pb-free) 1207-ball Fine-Pitch Ball Grid Array (FGG) package. Rated at the -6 speed grade and designed for commercial temperature range operation, this device is an ideal choice for engineers and system designers who need reliable, cost-effective programmable logic with abundant I/O capability.
Whether you are working on telecommunications, industrial control, networking, or embedded processing applications, the XC2S200-6FGG1207C provides the logic density and flexibility to replace costly mask-programmed ASICs — with the added advantage of in-field reprogrammability.
What Is the XC2S200-6FGG1207C? A Complete Overview
The XC2S200-6FGG1207C belongs to Xilinx’s Spartan-II FPGA family, a product line engineered to deliver the highest performance at the lowest possible price point. The device integrates configurable logic blocks (CLBs), distributed RAM, block RAM, and Delay-Locked Loops (DLLs) into a single, unified programmable architecture.
The part number breaks down as follows:
| Field |
Value |
Description |
| XC2S200 |
Device |
Spartan-II FPGA, 200K system gates |
| -6 |
Speed Grade |
Fastest commercial speed grade |
| FGG |
Package Type |
Fine-Pitch Ball Grid Array, Pb-free (RoHS) |
| 1207 |
Pin Count |
1,207 solder ball connections |
| C |
Temperature |
Commercial range (0°C to +85°C) |
XC2S200-6FGG1207C Key Specifications at a Glance
The table below summarizes the most critical electrical and physical parameters for the XC2S200-6FGG1207C:
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| Part Number |
XC2S200-6FGG1207C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Max User I/O Pins |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Delay-Locked Loops (DLLs) |
4 |
| Speed Grade |
-6 (Fastest) |
| System Performance |
Up to 200 MHz |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm |
| Package |
FGG1207 (1207-ball Fine-Pitch BGA) |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Yes (Pb-free “G” designation) |
XC2S200-6FGG1207C Architecture: Inside the Spartan-II FPGA
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1207C contains 1,176 CLBs arranged in a 28-column by 42-row matrix. Each CLB includes two logic cells (slices), with each slice containing two 4-input look-up tables (LUTs) and two flip-flops. This architecture enables highly efficient implementation of combinational and sequential logic.
Distributed RAM and Block RAM
| Memory Type |
Total Bits |
Equivalent |
| Distributed RAM |
75,264 bits |
~9.4 KB |
| Block RAM |
57,344 bits (~56K) |
~7 KB |
| Total On-Chip RAM |
~132K bits |
~16.5 KB |
The distributed RAM is embedded within the CLB fabric, making it ideal for small, fast lookup tables and FIFOs. The block RAM, organized into dedicated columns on both sides of the die, supports synchronous single-port and dual-port configurations — perfect for larger data buffers, filter coefficient storage, and packet buffering.
Delay-Locked Loops (DLLs)
The XC2S200-6FGG1207C features four on-chip DLLs, one at each corner of the die. These DLLs eliminate clock distribution delays and provide clock phase shifting, frequency synthesis, and clock mirroring — critical for high-speed, glitch-free system operation up to 200 MHz.
Input/Output Blocks (IOBs)
The device supports up to 284 user I/O pins, each of which can be independently configured to support a wide range of I/O standards, including LVTTL, LVCMOS2, PCI, GTL, GTL+, HSTL, SSTL2, and SSTL3. This multi-standard I/O flexibility makes the XC2S200-6FGG1207C suitable for interfacing with a broad variety of external devices and buses.
XC2S200 Spartan-II Family Comparison
The Spartan-II family spans six density options. The XC2S200 sits at the top of the lineup, offering the most resources within the family:
| Device |
Logic Cells |
System Gates |
CLB Array |
Total CLBs |
Max I/O |
Dist. RAM (bits) |
Block RAM (bits) |
| XC2S15 |
432 |
15,000 |
8×12 |
96 |
86 |
6,144 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
216 |
92 |
13,824 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
384 |
176 |
24,576 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
600 |
176 |
38,400 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
864 |
260 |
55,296 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
1,176 |
284 |
75,264 |
56K |
Speed Grade -6: The Fastest Spartan-II Commercial Option
The -6 speed grade is the highest-performance option available in the XC2S200 line and is exclusively offered in the commercial temperature range. This makes the XC2S200-6FGG1207C an excellent choice for demanding, performance-critical applications where propagation delay must be minimized and clock frequencies must be maximized.
| Speed Grade |
Availability |
Temperature Range |
| -5 |
Standard |
Commercial & Industrial |
| -6 |
Fastest |
Commercial Only (0°C to +85°C) |
FGG1207 Package: Lead-Free BGA with Maximum Pin Density
The FGG1207 package designation indicates:
- F — Fine-Pitch Ball Grid Array (FBGA)
- G (second G) — Lead-Free / RoHS-compliant (Pb-free packaging)
- 1207 — Total number of solder ball connections
The 1207-ball BGA package provides exceptional pin density, enabling compact PCB designs with high-bandwidth connectivity. The Pb-free “G” designation ensures full compliance with RoHS (Restriction of Hazardous Substances) directives, making it suitable for use in consumer, industrial, and government applications with environmental compliance requirements.
XC2S200-6FGG1207C Applications
The XC2S200-6FGG1207C is widely deployed across a broad range of industries and applications, including:
#### Industrial & Embedded Control
- Motor control and servo drive systems
- Programmable automation controllers (PAC)
- Machine vision and image processing pipelines
#### Telecommunications & Networking
- Line card FPGAs for protocol conversion
- Data framing and packet switching logic
- SONET/SDH interface bridging
#### Consumer Electronics & Computing
- Peripheral interface controllers
- High-speed bus bridging (PCI, SDRAM)
- Video signal processing and scaling
#### Test & Measurement Equipment
- Pattern generation and capture logic
- Protocol analyzers and logic controllers
- Data acquisition front-ends
Why Choose the XC2S200-6FGG1207C Over Mask-Programmed ASICs?
| Factor |
XC2S200-6FGG1207C FPGA |
Traditional ASIC |
| NRE Cost |
None |
$100K–$5M+ |
| Development Time |
Days to weeks |
6–18 months |
| Design Flexibility |
Fully reprogrammable |
Fixed at tape-out |
| Risk |
Low — iterate rapidly |
High — one chance |
| Field Upgrades |
Yes — update in-system |
No |
| Volume Scalability |
Any quantity |
Requires large MOQ |
The XC2S200-6FGG1207C eliminates the heavy upfront investment, long lead times, and inflexibility that come with ASIC development. Engineers can iterate their designs rapidly and even push firmware updates to deployed systems in the field — a capability that is completely impossible with mask-programmed ASICs.
Supported Development Tools for XC2S200-6FGG1207C
Xilinx (now AMD) supports the Spartan-II device family through its legacy ISE Design Suite, which provides a complete RTL-to-bitstream design flow:
| Tool |
Function |
| ISE Project Navigator |
Top-level design and project management |
| XST (Xilinx Synthesis Technology) |
RTL synthesis for VHDL and Verilog |
| ISE Simulator (ISIM) |
Functional and timing simulation |
| TRCE (Timing Reporter) |
Static timing analysis |
| iMPACT |
Device programming and JTAG boundary scan |
| ChipScope Pro |
In-system logic analysis and debugging |
Note: The XC2S200-6FGG1207C is not supported in the newer Vivado Design Suite, which targets 7-Series and later devices. Use ISE 14.7 for full Spartan-II support.
Ordering Information & Part Number Decoder
| Order Code |
Package |
Speed Grade |
Temp Range |
Lead-Free |
| XC2S200-5FG456C |
456-ball FBGA |
-5 |
Commercial |
No |
| XC2S200-5FGG456C |
456-ball FBGA |
-5 |
Commercial |
Yes |
| XC2S200-6FGG456C |
456-ball FBGA |
-6 |
Commercial |
Yes |
| XC2S200-6FGG1207C |
1207-ball FBGA |
-6 |
Commercial |
Yes |
Frequently Asked Questions About the XC2S200-6FGG1207C
What does the “G” in FGG1207 mean?
The second “G” in the package code indicates that the device uses lead-free (Pb-free) solder balls, making it RoHS compliant. This differentiates it from the older non-Pb-free FG packages.
Is the XC2S200-6FGG1207C still in production?
The Spartan-II family is a mature product line and Xilinx/AMD may classify it as not recommended for new designs (NRND). However, it remains available through authorized distributors and electronic component brokers for legacy system maintenance and spares inventory.
What is the maximum operating frequency of the XC2S200-6FGG1207C?
With the -6 speed grade, the device supports system performance up to 200 MHz, with internal clock distribution managed by four on-chip DLLs.
What programming file format does the XC2S200 use?
The XC2S200-6FGG1207C uses a bitstream (.bit) file generated by the ISE Design Suite. The device is configured via JTAG or a master serial/byte-peripheral interface using a Xilinx configuration PROM.
Can I use the XC2S200-6FGG1207C in an industrial temperature environment?
No. The “C” suffix indicates Commercial temperature range only (0°C to +85°C). For industrial environments (-40°C to +85°C), you would need to source an industrial-grade variant (suffix “I”).
Summary: XC2S200-6FGG1207C at a Glance
The XC2S200-6FGG1207C is a proven, high-density Xilinx Spartan-II FPGA that packs 200K system gates, 5,292 logic cells, 284 I/O pins, and 56K bits of block RAM into a compact lead-free 1207-ball BGA package. Its -6 speed grade delivers the fastest commercial-class performance in the Spartan-II lineup, with system operation up to 200 MHz. It is the go-to choice for engineers seeking a flexible, reprogrammable alternative to ASICs in commercial-temperature industrial, networking, and embedded applications.
For a broader selection of Xilinx programmable logic devices, visit Xilinx FPGA to explore compatible parts, replacements, and the full Spartan, Virtex, and Artix device families.
