Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCKU040-1FFVA1156I: Xilinx Kintex UltraScale FPGA — Complete Product Guide

Product Details

The XCKU040-1FFVA1156I is a high-performance Xilinx FPGA from the Kintex® UltraScale™ family, manufactured by AMD (formerly Xilinx). Built on 20nm process technology, this device delivers an exceptional price/performance/watt ratio, making it an industry-leading choice for mid-range FPGA design across communications, data centers, video processing, and defense applications.


What Is the XCKU040-1FFVA1156I?

The XCKU040-1FFVA1156I is a Field Programmable Gate Array (FPGA) belonging to AMD’s Kintex UltraScale product family. It is packaged in a 1156-pin Flip-Chip Ball Grid Array (FCBGA) form factor, rated for industrial temperature operation. The “-1” suffix denotes speed grade 1, the standard performance tier for this device family.

This FPGA is designed for applications that demand high DSP bandwidth, large on-chip memory, and robust I/O capability — all within a cost-optimized package footprint.


XCKU040-1FFVA1156I Key Specifications

General Product Information

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XCKU040-1FFVA1156I
FPGA Family Kintex® UltraScale™
Series XCKU040
Process Technology 20nm
Temperature Grade Industrial (I)
Speed Grade -1

Logic and Memory Resources

Resource Specification
Logic Cells 424,200
CLB Logic Blocks 242,400
Look-Up Tables (LUTs) 530,250
Flip-Flops 1,060,500
Block RAM (Total Bits) 21,100 Kbits
Block RAM Tiles 600
UltraRAM (URAM) Blocks 0 (XCKU040)
DSP Slices 1,920

I/O and Package Details

Parameter Value
Total Package Pins 1,156
User I/O Count 520
Package Type FCBGA (Flip-Chip BGA)
Package Code FFVA1156
I/O Supply Voltage Up to 3.3V
Differential I/O Pairs 260

Power Supply and Electrical Characteristics

Parameter Value
Core Supply Voltage (VCCINT) Min 922 mV
Core Supply Voltage (VCCINT) Max 979 mV
Nominal Core Voltage 0.95V
I/O Voltage Support 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Maximum Operating Frequency 630 MHz
Clock Management Blocks MMCM, PLL

High-Speed Transceivers

Transceiver Feature Detail
GTH Transceiver Count 20
GTH Line Rate Up to 16.375 Gbps
PCIe Gen3 Support Yes (up to x8)
SATA / SAS Support Yes
Ethernet (100G) Support Yes

Compliance and Ordering Information

Attribute Detail
RoHS Compliant Yes
REACH Compliant Yes
Moisture Sensitivity Level (MSL) MSL 4 — 72 Hours
Operating Temperature Range -40°C to +100°C (Industrial)
DigiKey Part Number 1176-XCKU040-1FFVA1156ICT-ND
Packaging Tray

XCKU040-1FFVA1156I Part Number Decoder

Understanding the Xilinx part numbering system helps engineers quickly identify device characteristics:

Segment Meaning
XC Xilinx Commercial product
KU Kintex UltraScale family
040 Device size (040 = mid-range density)
-1 Speed grade (-1 standard, -2 faster, -3 fastest)
FF Flip-Chip package type
VA Package variant identifier
1156 Pin count (1,156 balls)
I Temperature grade: Industrial (-40°C to +100°C)

XCKU040-1FFVA1156I Features and Architecture

UltraScale Architecture Advantages

The Kintex UltraScale XCKU040-1FFVA1156I is built on AMD’s UltraScale architecture, which delivers ASIC-like clocking, routing, and logic capabilities. Key architectural innovations include:

  • ASIC-like clocking with fine-grained clock gating for dynamic power reduction
  • Next-generation transceivers (GTH) supporting up to 16.375 Gbps per channel
  • Advanced DSP58E2 slices with pre-adders optimized for complex arithmetic operations
  • Dedicated PCIe Gen3 hard blocks for minimal latency system integration
  • High-speed memory interfaces supporting DDR4, DDR3, LPDDR3, and QDR II+

Power Efficiency at 20nm

Compared to previous-generation Kintex-7 FPGAs, the XCKU040-1FFVA1156I delivers up to 40% lower power consumption at equivalent performance levels. This is achieved through:

  • Fine-grained sleep transistors in each CLB
  • Dynamic voltage and frequency scaling support
  • Multiple power domains with independent control
  • Optimized 20nm TSMC process node

High-Performance DSP Processing

With 1,920 DSP slices, the XCKU040-1FFVA1156I is engineered for signal-processing-intensive workloads. The DSP58E2 architecture supports:

  • Cascaded DSP chains for FIR filters and FFT pipelines
  • 27×18-bit multiplier with 48-bit accumulator
  • Pre-adder for symmetric filter coefficient optimization
  • Pattern detection for overflow and convergent rounding

XCKU040-1FFVA1156I Applications

The XCKU040-1FFVA1156I is well-suited for the following industries and use cases:

Networking and Data Centers

  • 100G Ethernet line cards and switch fabrics
  • Network packet processing and deep packet inspection
  • Hardware accelerators for machine learning inference

Wireless and Communications Infrastructure

  • 4G/LTE and 5G base station remote radio heads
  • Digital Front-End (DFE) processing
  • Massive MIMO beamforming algorithms

Video and Imaging

  • 8K/4K Ultra-HD video encoding and transcoding
  • High-speed camera frame grabbers
  • Medical imaging (MRI, CT, ultrasound) signal processing

Defense and Aerospace

  • Radar and sonar signal processing
  • Secure communications with cryptographic acceleration
  • Electronic warfare (EW) systems

Test and Measurement

  • High-speed analog digitizer backends
  • Protocol analyzers and logic analyzers
  • Software-defined radio (SDR) platforms

XCKU040-1FFVA1156I vs. Related Kintex UltraScale Devices

Feature XCKU025 XCKU040 XCKU060 XCKU095
Logic Cells 236,600 424,200 725,625 1,143,750
DSP Slices 1,080 1,920 2,760 4,320
Block RAM (Kbits) 11,700 21,100 38,000 64,800
GTH Transceivers 20 20 32 60
Max User I/O 312 520 520 600
Process Node 20nm 20nm 20nm 20nm

The XCKU040 occupies the sweet spot in the Kintex UltraScale lineup — significantly more capable than the entry-level KU025 while remaining more cost-effective than the larger KU060 and KU095 devices.


Development Tools for XCKU040-1FFVA1156I

AMD Vivado Design Suite

The primary design environment for the XCKU040-1FFVA1156I is AMD Vivado Design Suite, which includes:

  • Vivado HLS (High-Level Synthesis) — design in C/C++ or SystemC
  • IP Integrator — block diagram design for subsystem integration
  • Vivado Simulator — functional and timing simulation
  • Power Estimator — accurate pre-implementation power analysis

Vitis Unified Software Platform

For heterogeneous compute acceleration and embedded applications, AMD’s Vitis platform enables:

  • OpenCL-based hardware acceleration targeting
  • Hardware/software co-design and debugging
  • AI inference acceleration libraries (Vitis AI)

Supported IP Cores

  • PCIe Gen3 x8 DMA subsystem
  • 100G Ethernet MAC (CMAC)
  • DDR4 memory controller
  • JESD204B/C high-speed ADC/DAC interface

Frequently Asked Questions

What is the XCKU040-1FFVA1156I used for?

The XCKU040-1FFVA1156I is used in applications requiring high-performance programmable logic, including 100G networking, 5G wireless infrastructure, medical imaging, defense electronics, and high-performance computing acceleration.

What is the operating temperature range of the XCKU040-1FFVA1156I?

The “I” suffix designates the industrial temperature grade, supporting operation from -40°C to +100°C junction temperature, making it suitable for harsh industrial and outdoor environments.

What package does the XCKU040-1FFVA1156I use?

It uses a 1156-ball FCBGA (Flip-Chip Ball Grid Array) package with a 35mm × 35mm body size, using a 1.0mm ball pitch.

Is the XCKU040-1FFVA1156I RoHS compliant?

Yes. The XCKU040-1FFVA1156I is fully RoHS and REACH compliant, meeting global environmental regulations for lead-free electronics manufacturing.

What transceiver speed does the XCKU040-1FFVA1156I support?

The device includes 20 GTH transceivers capable of operating at up to 16.375 Gbps per channel, supporting protocols including PCIe Gen3, 100G Ethernet, SATA, Interlaken, and more.

What is the difference between XCKU040-1FFVA1156I and XCKU040-2FFVA1156I?

The only difference is the speed grade: the -1 variant is the standard speed grade while the -2 variant offers higher performance with tighter timing margins, at a higher price point.


Summary

The XCKU040-1FFVA1156I is a versatile, high-performance Kintex UltraScale FPGA offering an outstanding combination of logic density (424,200 logic cells), DSP performance (1,920 slices), memory bandwidth (21,100 Kbits block RAM), and high-speed serial connectivity (20× GTH at 16.375 Gbps). Its industrial temperature rating, RoHS compliance, and proven 20nm architecture make it a reliable choice for demanding applications across telecommunications, defense, data center, and video processing markets.

For design support, pricing, and availability of the XCKU040-1FFVA1156I, consult authorized AMD Xilinx distributors or contact your local sales representative.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.