The XCKU025-2FFVA1156E is a high-performance Field Programmable Gate Array (FPGA) manufactured by AMD (formerly Xilinx), belonging to the Kintex® UltraScale™ family. Built on 20nm process technology, this device delivers an exceptional blend of logic density, DSP performance, and memory bandwidth — making it a top choice for engineers designing data center hardware accelerators, wireless infrastructure, medical imaging systems, and automotive applications.
For a broader overview of AMD’s programmable logic portfolio, visit our guide on Xilinx FPGA solutions.
What Is the XCKU025-2FFVA1156E?
The XCKU025-2FFVA1156E is part of Xilinx’s Kintex UltraScale FPGA series — a mid-range family engineered for applications that demand high DSP throughput and large block RAM capacity without the cost of high-end UltraScale+ devices. The “2” in the part number indicates Speed Grade 2, which is the standard commercial performance tier for this device. The “E” suffix designates the extended commercial temperature range (0°C to +100°C junction temperature).
With 318,150 logic cells, 312 user I/Os, and a maximum operating frequency of 725 MHz, the XCKU025-2FFVA1156E is engineered for demanding real-world deployments.
XCKU025-2FFVA1156E Key Specifications
General Identification
| Parameter |
Value |
| Part Number |
XCKU025-2FFVA1156E |
| Manufacturer |
AMD (Xilinx) |
| Series |
Kintex® UltraScale™ |
| Product Status |
Active |
| RoHS Compliance |
RoHS3 Compliant |
Logic & Memory Resources
| Parameter |
Value |
| Logic Cells (Macrocells) |
318,150 |
| Logic Blocks (CLBs) |
145,440 |
| Registers |
290,880 |
| Total RAM Bits |
13,004,800 bits (≈13,005 Kbit) |
| Process Technology |
20nm |
Electrical Characteristics
| Parameter |
Value |
| Core Supply Voltage (Min) |
0.922 V (922 mV) |
| Core Supply Voltage (Max) |
0.979 V (979 mV) |
| Nominal Core Voltage |
0.95 V |
| I/O Supply Voltage |
Up to 3.3 V |
| Maximum Operating Frequency |
725 MHz |
I/O & Connectivity
| Parameter |
Value |
| Total User I/Os |
312 |
| Clock Management Tiles |
MMCM, PLL |
| Number of Speed Grades Available |
2 (this device is Speed Grade 2) |
Package & Mechanical
| Parameter |
Value |
| Package Type |
1156-BBGA, FCBGA |
| Package Code |
FFVA1156 |
| Number of Pins |
1,156 |
| Terminal Form |
Ball (BGA) |
| Terminal Pitch |
1 mm |
| Mounting Type |
Surface Mount (SMT) |
| Packaging Format |
Tray |
XCKU025-2FFVA1156E Part Number Decoder
Understanding the part number structure helps engineers quickly identify the exact variant for procurement and design:
| Segment |
Meaning |
| XC |
Xilinx (AMD) commercial product |
| KU |
Kintex UltraScale family |
| 025 |
Device size designation (logic density tier) |
| -2 |
Speed Grade 2 (standard performance) |
| FF |
Flip-Chip Fine-Pitch Ball Grid Array package |
| VA |
Package variant code |
| 1156 |
Total pin count (1156 balls) |
| E |
Extended commercial temperature (0°C to +100°C Tj) |
Kintex UltraScale Architecture Highlights
The Kintex UltraScale family is based on AMD’s UltraScale architecture, which introduced several key improvements over previous-generation 7-Series devices:
#### ASIC-Like Clocking Architecture
UltraScale devices implement fine-granular clock gating, enabling lower dynamic power consumption compared to the previous generation — up to 40% lower power than 28nm Kintex-7 FPGAs.
#### Next-Generation Transceivers
The architecture includes high-speed serial transceivers optimized for 100G networking, wireless backhaul, and high-bandwidth data links — supporting standards critical in modern data center and telecom infrastructure.
#### High DSP and Block RAM Ratios
The XCKU025-2FFVA1156E provides a high ratio of DSP slices and block RAM relative to logic, which is ideal for signal processing workloads such as FFT engines, FIR filters, and matrix multiply operations.
#### UltraScale Memory Architecture
The device supports large, distributed on-chip RAM configurations. With 13,004,800 total RAM bits, designers can implement deep FIFOs, large lookup tables, or embedded frame buffers without off-chip memory overhead.
XCKU025-2FFVA1156E Applications
The XCKU025-2FFVA1156E is suited to a broad range of industries and applications:
| Industry |
Typical Use Cases |
| Data Center |
Hardware accelerators, FPGA-based compute offload, SmartNICs |
| Wireless & Telecom |
4G/5G radio unit DFE, TD-LTE baseband, remote radio heads |
| Medical |
Ultrasound imaging, CT reconstruction, medical data processing |
| Video & Broadcast |
8K video processing, real-time image processing pipelines |
| Automotive |
Advanced driver assistance systems (ADAS), sensor fusion |
| Industrial |
Random logic integration, industrial control, machine vision |
| Scientific Instruments |
High-speed data acquisition, signal processing platforms |
Development Tools for the XCKU025-2FFVA1156E
#### Vivado Design Suite
AMD’s Vivado Design Suite is the primary design environment for all UltraScale FPGAs. It provides:
- Logic synthesis and implementation
- Place-and-route with timing closure
- IP integrator for block-design based workflows
- Integrated simulation and verification
Vivado offers a free WebPACK edition that supports a subset of devices; the full edition is required for the XCKU025-2FFVA1156E.
#### Evaluation & Development Boards
Engineers evaluating the Kintex UltraScale family commonly use the KCU105 Evaluation Kit, which features a KU040 device in the same FCBGA package family and provides a representative development environment with DDR4, PCIe, and SFP+ interfaces.
XCKU025-2FFVA1156E vs. Similar Kintex UltraScale Devices
| Part Number |
Logic Cells |
I/Os |
Package |
Speed Grade |
Temp Grade |
| XCKU025-1FFVA1156C |
318,150 |
312 |
FCBGA-1156 |
1 |
Commercial |
| XCKU025-2FFVA1156E |
318,150 |
312 |
FCBGA-1156 |
2 |
Extended Commercial |
| XCKU025-2FFVA1156I |
318,150 |
312 |
FCBGA-1156 |
2 |
Industrial |
| XCKU035-2FFVA1156E |
~444,000 |
348 |
FCBGA-1156 |
2 |
Extended Commercial |
| XCKU040-2FFVA1156E |
~530,000 |
360 |
FCBGA-1156 |
2 |
Extended Commercial |
Key takeaway: The XCKU025-2FFVA1156E occupies the entry point of the Kintex UltraScale 1156-pin family. It shares pin compatibility with the XCKU035 and XCKU040 in the same FFVA1156 package, enabling straightforward migration paths for design scaling.
Ordering & Availability
| Parameter |
Detail |
| Manufacturer Part Number |
XCKU025-2FFVA1156E |
| Product Status |
Active |
| Packaging |
Tray (bulk) |
| Manufacturer Lead Time |
Approximately 30 weeks (verify at time of order) |
| Non-Cancellable / Non-Returnable |
Yes (NCNR) — confirm before placing orders |
Important Note: The XCKU025-2FFVA1156E is classified as a Non-Cancellable, Non-Returnable (NCNR) component by most distributors. Always confirm your design requirements before placing purchase orders.
Frequently Asked Questions
What is the difference between XCKU025-2FFVA1156E and XCKU025-2FFVA1156I?
The only difference is the temperature rating. The “E” suffix indicates Extended Commercial temperature (0°C to +100°C junction temperature), while the “I” suffix designates the Industrial grade (-40°C to +100°C). Both share identical logic resources, I/O count, and package.
Is the XCKU025-2FFVA1156E pin-compatible with larger Kintex UltraScale devices?
Yes. Devices in the FFVA1156 package — including the XCKU025, XCKU035, and XCKU040 — are designed for footprint compatibility, allowing designers to migrate to higher-density devices without changing the PCB layout.
What design software supports the XCKU025-2FFVA1156E?
The XCKU025-2FFVA1156E is supported by AMD Vivado Design Suite (version 2015.1 and later). It is not supported by the legacy ISE Design Suite.
What does “Speed Grade 2” mean for this FPGA?
Speed Grade 2 is the standard performance tier for commercial applications. Within the Kintex UltraScale family, available speed grades are 1L (lowest power), 1, 2, and 3 (highest performance). Speed Grade 2 balances performance and power for most production designs.
Summary
The XCKU025-2FFVA1156E is a robust, mid-range FPGA from AMD’s Kintex UltraScale family, purpose-built for applications requiring high signal-processing performance, substantial on-chip memory, and a large user I/O count — all within a compact, surface-mount 1156-ball BGA package. Its 20nm process node, 725 MHz maximum frequency, and RoHS3 compliance make it a reliable choice for commercial product development in demanding sectors including data center acceleration, wireless infrastructure, and medical imaging systems.