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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XCKU025-2FFVA1156E: AMD Xilinx Kintex UltraScale FPGA – Full Specifications & Guide

Product Details

The XCKU025-2FFVA1156E is a high-performance Field Programmable Gate Array (FPGA) manufactured by AMD (formerly Xilinx), belonging to the Kintex® UltraScale™ family. Built on 20nm process technology, this device delivers an exceptional blend of logic density, DSP performance, and memory bandwidth — making it a top choice for engineers designing data center hardware accelerators, wireless infrastructure, medical imaging systems, and automotive applications.

For a broader overview of AMD’s programmable logic portfolio, visit our guide on Xilinx FPGA solutions.


What Is the XCKU025-2FFVA1156E?

The XCKU025-2FFVA1156E is part of Xilinx’s Kintex UltraScale FPGA series — a mid-range family engineered for applications that demand high DSP throughput and large block RAM capacity without the cost of high-end UltraScale+ devices. The “2” in the part number indicates Speed Grade 2, which is the standard commercial performance tier for this device. The “E” suffix designates the extended commercial temperature range (0°C to +100°C junction temperature).

With 318,150 logic cells, 312 user I/Os, and a maximum operating frequency of 725 MHz, the XCKU025-2FFVA1156E is engineered for demanding real-world deployments.


XCKU025-2FFVA1156E Key Specifications

General Identification

Parameter Value
Part Number XCKU025-2FFVA1156E
Manufacturer AMD (Xilinx)
Series Kintex® UltraScale™
Product Status Active
RoHS Compliance RoHS3 Compliant

Logic & Memory Resources

Parameter Value
Logic Cells (Macrocells) 318,150
Logic Blocks (CLBs) 145,440
Registers 290,880
Total RAM Bits 13,004,800 bits (≈13,005 Kbit)
Process Technology 20nm

Electrical Characteristics

Parameter Value
Core Supply Voltage (Min) 0.922 V (922 mV)
Core Supply Voltage (Max) 0.979 V (979 mV)
Nominal Core Voltage 0.95 V
I/O Supply Voltage Up to 3.3 V
Maximum Operating Frequency 725 MHz

I/O & Connectivity

Parameter Value
Total User I/Os 312
Clock Management Tiles MMCM, PLL
Number of Speed Grades Available 2 (this device is Speed Grade 2)

Package & Mechanical

Parameter Value
Package Type 1156-BBGA, FCBGA
Package Code FFVA1156
Number of Pins 1,156
Terminal Form Ball (BGA)
Terminal Pitch 1 mm
Mounting Type Surface Mount (SMT)
Packaging Format Tray

XCKU025-2FFVA1156E Part Number Decoder

Understanding the part number structure helps engineers quickly identify the exact variant for procurement and design:

Segment Meaning
XC Xilinx (AMD) commercial product
KU Kintex UltraScale family
025 Device size designation (logic density tier)
-2 Speed Grade 2 (standard performance)
FF Flip-Chip Fine-Pitch Ball Grid Array package
VA Package variant code
1156 Total pin count (1156 balls)
E Extended commercial temperature (0°C to +100°C Tj)

Kintex UltraScale Architecture Highlights

The Kintex UltraScale family is based on AMD’s UltraScale architecture, which introduced several key improvements over previous-generation 7-Series devices:

#### ASIC-Like Clocking Architecture

UltraScale devices implement fine-granular clock gating, enabling lower dynamic power consumption compared to the previous generation — up to 40% lower power than 28nm Kintex-7 FPGAs.

#### Next-Generation Transceivers

The architecture includes high-speed serial transceivers optimized for 100G networking, wireless backhaul, and high-bandwidth data links — supporting standards critical in modern data center and telecom infrastructure.

#### High DSP and Block RAM Ratios

The XCKU025-2FFVA1156E provides a high ratio of DSP slices and block RAM relative to logic, which is ideal for signal processing workloads such as FFT engines, FIR filters, and matrix multiply operations.

#### UltraScale Memory Architecture

The device supports large, distributed on-chip RAM configurations. With 13,004,800 total RAM bits, designers can implement deep FIFOs, large lookup tables, or embedded frame buffers without off-chip memory overhead.


XCKU025-2FFVA1156E Applications

The XCKU025-2FFVA1156E is suited to a broad range of industries and applications:

Industry Typical Use Cases
Data Center Hardware accelerators, FPGA-based compute offload, SmartNICs
Wireless & Telecom 4G/5G radio unit DFE, TD-LTE baseband, remote radio heads
Medical Ultrasound imaging, CT reconstruction, medical data processing
Video & Broadcast 8K video processing, real-time image processing pipelines
Automotive Advanced driver assistance systems (ADAS), sensor fusion
Industrial Random logic integration, industrial control, machine vision
Scientific Instruments High-speed data acquisition, signal processing platforms

Development Tools for the XCKU025-2FFVA1156E

#### Vivado Design Suite

AMD’s Vivado Design Suite is the primary design environment for all UltraScale FPGAs. It provides:

  • Logic synthesis and implementation
  • Place-and-route with timing closure
  • IP integrator for block-design based workflows
  • Integrated simulation and verification

Vivado offers a free WebPACK edition that supports a subset of devices; the full edition is required for the XCKU025-2FFVA1156E.

#### Evaluation & Development Boards

Engineers evaluating the Kintex UltraScale family commonly use the KCU105 Evaluation Kit, which features a KU040 device in the same FCBGA package family and provides a representative development environment with DDR4, PCIe, and SFP+ interfaces.


XCKU025-2FFVA1156E vs. Similar Kintex UltraScale Devices

Part Number Logic Cells I/Os Package Speed Grade Temp Grade
XCKU025-1FFVA1156C 318,150 312 FCBGA-1156 1 Commercial
XCKU025-2FFVA1156E 318,150 312 FCBGA-1156 2 Extended Commercial
XCKU025-2FFVA1156I 318,150 312 FCBGA-1156 2 Industrial
XCKU035-2FFVA1156E ~444,000 348 FCBGA-1156 2 Extended Commercial
XCKU040-2FFVA1156E ~530,000 360 FCBGA-1156 2 Extended Commercial

Key takeaway: The XCKU025-2FFVA1156E occupies the entry point of the Kintex UltraScale 1156-pin family. It shares pin compatibility with the XCKU035 and XCKU040 in the same FFVA1156 package, enabling straightforward migration paths for design scaling.


Ordering & Availability

Parameter Detail
Manufacturer Part Number XCKU025-2FFVA1156E
Product Status Active
Packaging Tray (bulk)
Manufacturer Lead Time Approximately 30 weeks (verify at time of order)
Non-Cancellable / Non-Returnable Yes (NCNR) — confirm before placing orders

Important Note: The XCKU025-2FFVA1156E is classified as a Non-Cancellable, Non-Returnable (NCNR) component by most distributors. Always confirm your design requirements before placing purchase orders.


Frequently Asked Questions

What is the difference between XCKU025-2FFVA1156E and XCKU025-2FFVA1156I?

The only difference is the temperature rating. The “E” suffix indicates Extended Commercial temperature (0°C to +100°C junction temperature), while the “I” suffix designates the Industrial grade (-40°C to +100°C). Both share identical logic resources, I/O count, and package.

Is the XCKU025-2FFVA1156E pin-compatible with larger Kintex UltraScale devices?

Yes. Devices in the FFVA1156 package — including the XCKU025, XCKU035, and XCKU040 — are designed for footprint compatibility, allowing designers to migrate to higher-density devices without changing the PCB layout.

What design software supports the XCKU025-2FFVA1156E?

The XCKU025-2FFVA1156E is supported by AMD Vivado Design Suite (version 2015.1 and later). It is not supported by the legacy ISE Design Suite.

What does “Speed Grade 2” mean for this FPGA?

Speed Grade 2 is the standard performance tier for commercial applications. Within the Kintex UltraScale family, available speed grades are 1L (lowest power), 1, 2, and 3 (highest performance). Speed Grade 2 balances performance and power for most production designs.


Summary

The XCKU025-2FFVA1156E is a robust, mid-range FPGA from AMD’s Kintex UltraScale family, purpose-built for applications requiring high signal-processing performance, substantial on-chip memory, and a large user I/O count — all within a compact, surface-mount 1156-ball BGA package. Its 20nm process node, 725 MHz maximum frequency, and RoHS3 compliance make it a reliable choice for commercial product development in demanding sectors including data center acceleration, wireless infrastructure, and medical imaging systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.