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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XCKU035-1SFVA784I: Xilinx Kintex UltraScale FPGA – Full Specifications & Product Guide

Product Details

The XCKU035-1SFVA784I is a high-performance, mid-range Field Programmable Gate Array (FPGA) from AMD Xilinx, belonging to the Kintex® UltraScale™ family. Built on a cutting-edge 20nm process node, this device delivers an exceptional balance of signal processing bandwidth, logic density, and power efficiency — making it a top choice for engineers designing next-generation embedded systems, wireless infrastructure, medical imaging, and 100G networking applications.

If you are sourcing or evaluating a Xilinx FPGA for your design, the XCKU035-1SFVA784I offers a compelling combination of capability, cost-effectiveness, and industrial-grade reliability.


What Is the XCKU035-1SFVA784I?

The XCKU035-1SFVA784I is part of the Kintex UltraScale FPGA series, which AMD Xilinx positioned as the price/performance leader in the UltraScale architecture. The “1” in the part number indicates Speed Grade -1, the standard performance tier operating at 0.95V VCCINT. The “I” suffix denotes an Industrial temperature rating, supporting a junction temperature range of 0°C to 100°C (TJ).

Part Number Breakdown

Field Value Meaning
XC XC Xilinx Commercial Device
KU KU Kintex UltraScale Family
035 035 Device Density (35K logic cells density tier)
-1 -1 Speed Grade 1 (Standard Performance)
S S Super Logic Region (SLR) Package Type
FVA FVA FC-BGA Package Variant
784 784 Number of Package Pins
I I Industrial Temperature Grade

XCKU035-1SFVA784I Key Specifications

Core Logic Resources

Parameter Value
Technology Node 20nm
Logic Cells 355,474
CLB Flip-Flops 444,443
CLB LUTs 203,128
Total Block RAM 19,456 Kbits
DSP Slices 1,440
UltraRAM (36Kb Blocks) 0 (UltraRAM available in UltraScale+)
CMTs (Clock Management Tiles) 10
MMCMs 10
PLLs 20

I/O and Package Specifications

Parameter Value
Package 784-Pin FC-BGA (SFVA784)
Total I/O Pins 468
Differential I/O Pairs 234
Package Dimensions 23mm × 23mm
Mounting Type Surface Mount
Packaging Format Tray
I/O Standards Supported LVDS, SSTL, HSTL, LVCMOS, LVTTL, and more

Electrical Characteristics

Parameter Value
Core Supply Voltage (VCCINT) 0.922V – 0.979V (nominal 0.95V)
I/O Supply Voltage Up to 3.3V
Speed Grade -1
Maximum Operating Frequency Up to 630 MHz
Configuration Interfaces JTAG, SPI, BPI, SelectMAP

Transceiver Resources

Parameter Value
GTH Transceivers 16
Max Transceiver Line Rate 16.3 Gbps
PCIe Hard Blocks 2 (Gen3 x8)
100G Ethernet MAC Supported via IP
Interlaken Supported via IP

Environmental & Compliance

Parameter Value
Temperature Grade Industrial (I)
Junction Temperature Range 0°C to 100°C
RoHS Status RoHS 3 Compliant
MSL (Moisture Sensitivity Level) MSL 4 – 72 Hours
Product Status Active

Why Choose the XCKU035-1SFVA784I?

Best Price/Performance/Watt at 20nm

The Kintex UltraScale family was architected specifically to deliver the best price-to-performance ratio at the 20nm process node. Compared to prior-generation Kintex-7 devices, the XCKU035 offers significantly higher DSP bandwidth, more block RAM, and next-generation GTH transceivers — while consuming less power per unit of logic.

High DSP and Block RAM Density

With 1,440 DSP slices and 19,456 Kbits of total block RAM, the XCKU035-1SFVA784I is particularly well-suited for:

  • Digital signal processing (DSP) pipelines
  • FIR and FFT acceleration
  • Machine learning inference at the edge
  • Video processing chains

Next-Generation GTH Transceivers

The device’s 16 GTH transceivers support line rates up to 16.3 Gbps, enabling high-throughput interfaces including 10G/100G Ethernet, PCIe Gen3, JESD204B, and Aurora. This makes the XCKU035-1SFVA784I a strong candidate for backplane, SERDES-heavy, and optical transport designs.

Industrial Temperature Reliability

The -I suffix certifies this device for industrial environments, with junction temperatures up to 100°C. This is critical for applications in:

  • Telecom and wireless base stations
  • Industrial automation and control
  • Medical diagnostic equipment
  • Aerospace and defense (commercial variant)

UltraScale Architecture Advantages

The UltraScale architecture introduces ASIC-like clocking with fine-grained clock gating, reducing dynamic power consumption by up to 40% compared to the previous generation. The device is also footprint-compatible with Virtex UltraScale devices, providing a clear scalability path for designs that need more resources.


XCKU035-1SFVA784I Application Use Cases

#### 100G Networking and Data Centers

The combination of hard PCIe Gen3 blocks, GTH transceivers at 16.3 Gbps, and high DSP throughput makes the XCKU035-1SFVA784I a proven platform for packet processing engines, network interface cards (NICs), and line-rate 100G applications.

#### Wireless Infrastructure (5G/LTE)

The device’s DSP-intensive architecture supports heterogeneous wireless infrastructure workloads including baseband processing for LTE/5G Remote Radio Heads (RRH), digital predistortion (DPD), and Digital Front-End (DFE) functions.

#### Medical Imaging

High-bandwidth block RAM, dense DSP slices, and reliable industrial temperature ratings make this FPGA ideal for next-generation medical imaging systems such as MRI, CT, and ultrasound reconstruction pipelines.

#### 8K4K Video Processing

With its large logic fabric and high-speed I/O, the XCKU035-1SFVA784I handles demanding 8K4K video encode, decode, and real-time processing pipelines in broadcast and professional AV applications.

#### Radar and Electronic Warfare

The device’s JESD204B-compatible transceivers and deep DSP capabilities are well matched for radar signal processing, waveform generation, and electronic countermeasure systems.


XCKU035-1SFVA784I vs. Related Part Numbers

Designers frequently compare the XCKU035-1SFVA784I with nearby variants. Here is how they differ:

Part Number Speed Grade Temp Grade Package VCCINT
XCKU035-1SFVA784I -1 Industrial 784 FC-BGA 0.95V
XCKU035-1SFVA784C -1 Commercial 784 FC-BGA 0.95V
XCKU035-2SFVA784I -2 Industrial 784 FC-BGA 0.95V
XCKU035-2SFVA784E -2 Extended 784 FC-BGA 0.95V
XCKU035-1FFVA1156I -1 Industrial 1156 FC-BGA 0.95V
XCKU035-1FBVA900I -1 Industrial 900 FC-BGA 0.95V

The XCKU035-1SFVA784I is the ideal choice when your design requires industrial-grade reliability in a cost-optimized 784-pin package with standard (-1) timing closure targets.


Development Tools and Ecosystem

Vivado Design Suite

AMD Xilinx’s Vivado Design Suite is the primary design environment for the XCKU035-1SFVA784I. It provides:

  • Logic synthesis and implementation
  • Timing closure and constraints management
  • Simulation integration (ModelSim, Questa, XSIM)
  • Partial reconfiguration support

Xilinx Power Estimator (XPE)

The Xilinx Power Estimator tool allows engineers to estimate static and dynamic power consumption for the XCKU035-1SFVA784I early in the design process, ensuring thermal budgets are met before hardware bring-up.

IP Catalog

Vivado’s IP Catalog includes pre-verified cores for:

  • PCIe Gen3 Endpoint / Root Port
  • 100G Ethernet MAC
  • JESD204B PHY
  • AXI Interconnect
  • Aurora 64B/66B serial protocol

Ordering and Procurement Information

Attribute Detail
Manufacturer AMD (formerly Xilinx)
Part Number XCKU035-1SFVA784I
DigiKey Part Number 1376-XCKU035-1SFVA784I-ND
Package 784-BFBGA, FCCSP
Minimum Order Quantity 1 (Tray packaging)
Lead Time (Typical) 26–30 weeks (consult distributor)
RoHS Compliant Yes (RoHS 3)
Product Lifecycle Active

Note: The XCKU035-1SFVA784I is an active product with standard lead times. For high-volume procurement, contact authorized AMD Xilinx distributors such as DigiKey, Arrow, Avnet, or Mouser Electronics.


Frequently Asked Questions (FAQ)

What does the “-1” speed grade mean on the XCKU035-1SFVA784I?

The -1 speed grade represents the standard performance tier for the Kintex UltraScale family. It operates with VCCINT at 0.95V. Higher speed grades (-2, -3) deliver faster timing at potentially higher power, while the -1L variant trades some speed for lower static power.

Is the XCKU035-1SFVA784I suitable for industrial environments?

Yes. The “I” suffix denotes an industrial temperature grade, with junction temperature support from 0°C to 100°C (TJ). This makes it appropriate for telecom, industrial automation, and medical instrumentation applications.

How many I/O pins are available on the 784-pin SFVA package?

The XCKU035-1SFVA784I provides 468 user I/O pins in a 784-ball FC-BGA package, supporting a wide range of single-ended and differential I/O standards.

Can the XCKU035-1SFVA784I be used for machine learning inference?

Yes. The device’s 1,440 DSP slices and large block RAM make it a capable inference accelerator for quantized neural networks, particularly in edge and embedded applications where ASSP solutions may lack flexibility.

What configuration interfaces does the XCKU035-1SFVA784I support?

The device supports JTAG, SPI (x1, x2, x4), BPI, and SelectMAP configuration interfaces, providing flexibility for both production programming and in-system reconfiguration.


Summary

The XCKU035-1SFVA784I is one of the most versatile mid-range FPGAs in the Kintex UltraScale lineup. Its combination of 355K logic cells, 1,440 DSP slices, 468 I/O pins, 16 GTH transceivers, and industrial temperature rating — all in an accessible 784-pin FC-BGA package — makes it an excellent platform for demanding signal processing, communications, and embedded compute applications. Designed and validated with Vivado tooling and a rich IP ecosystem, the XCKU035-1SFVA784I enables rapid development cycles and a clear path toward production deployment.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.