The XCKU035-2FBVA676E is a high-performance field-programmable gate array (FPGA) manufactured by Xilinx (now AMD), belonging to the Kintex® UltraScale™ family. Built on a cutting-edge 20nm process node, this device delivers an exceptional balance of price, performance, and power efficiency — making it a preferred choice for engineers working on 100G networking, DSP-intensive workloads, and next-generation embedded systems.
Whether you’re designing for data centers, medical imaging, wireless infrastructure, or video processing, the XCKU035-2FBVA676E offers the logic density, I/O flexibility, and transceiver bandwidth needed to meet modern system requirements. For a broad selection of compatible devices, explore Xilinx FPGA solutions available from trusted distributors.
What Is the XCKU035-2FBVA676E?
The XCKU035-2FBVA676E is part of the Kintex UltraScale FPGA family — Xilinx’s mid-range product line engineered for demanding applications that require the highest signal processing bandwidth without the cost premium of high-end Virtex devices. This specific part features a -2 speed grade, packaged in a 676-pin FCBGA (Fine-Pitch Ball Grid Array) with a 1mm pitch, making it suitable for compact, high-density PCB designs.
XCKU035-2FBVA676E Key Specifications
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Part Number |
XCKU035-2FBVA676E |
| Family |
Kintex® UltraScale™ |
| Technology Node |
20nm |
| Logic Cells |
444,343 |
| CLB Flip-Flops |
355,474 |
| Configurable Logic Blocks (CLBs) |
1,700 |
| Look-Up Tables (LUTs) |
25,391 (6-input) |
| Block RAM |
~17 Mb |
| DSP Slices |
1,080 |
| Maximum User I/O |
312 |
| Max Operating Frequency |
725 MHz |
| Supply Voltage (VCCINT) |
0.922V – 0.979V (typical 0.95V) |
| Package |
FCBGA-676 (FBVA676) |
| Package Dimensions |
23mm x 23mm |
| Pin Count |
676 |
| Pin Pitch |
1mm |
| Operating Temperature |
0°C to 100°C (Commercial) |
| RoHS Compliance |
Yes (RoHS3) |
| Mounting Type |
Surface Mount (SMD) |
XCKU035-2FBVA676E Part Number Decoder
Understanding the part number helps engineers quickly identify the device’s specifications at a glance.
| Field |
Code |
Meaning |
| Device Family |
XC |
Xilinx FPGA |
| Architecture |
KU |
Kintex UltraScale |
| Device Size |
035 |
Mid-range logic density |
| Speed Grade |
-2 |
Standard commercial speed (-1 slowest, -3 fastest) |
| Package Code |
FBVA |
Fine-pitch BGA (FCBGA variant) |
| Pin Count |
676 |
676 solder balls |
| Temperature/Grade |
E |
Extended commercial temperature range |
XCKU035-2FBVA676E Detailed Features
#### Logic and Programmable Resources
The XCKU035-2FBVA676E is built on Xilinx’s UltraScale architecture, which delivers ASIC-like clocking and routing for reduced latency and predictable performance. Key logic resources include:
- 1,700 CLBs with dual-register flip-flops per LUT for efficient pipelining
- 25,391 6-input LUTs configurable as logic or distributed RAM/shift registers
- 444,343 effective logic cells for complex design implementation
- Dedicated carry chains for high-speed arithmetic operations
#### Memory Resources
| Memory Type |
Specification |
| Block RAM (BRAM) |
36Kb dual-port BRAM tiles |
| Total BRAM |
~17 Mb |
| FIFO Capable |
Yes |
| Cascade Support |
Yes (large memories without LUT overhead) |
#### DSP Processing Capabilities
With 1,080 DSP48E2 slices, the XCKU035-2FBVA676E is purpose-built for high-throughput signal processing. Each DSP48E2 slice supports:
- 27×18 multiplier with 48-bit accumulator
- Pre-adder for FIR filter efficiency
- Dynamic operation mode switching
- Cascaded DSP for wide arithmetic without routing overhead
#### Clocking Architecture
| Clock Resource |
Detail |
| Mixed-Mode Clock Managers (MMCM) |
Yes |
| Phase-Locked Loops (PLL) |
Yes |
| Global Clock Buffers |
24 |
| Max Clock Frequency |
725 MHz |
The UltraScale clocking architecture uses ASIC-like global clock distribution that eliminates clock skew and supports multiple independent clock domains — critical for multi-protocol, mixed-rate designs.
#### I/O and Connectivity
| I/O Feature |
Specification |
| Maximum User I/O |
312 |
| HP (High-Performance) I/O Banks |
Yes |
| HR (High-Range) I/O Banks |
Yes |
| Differential I/O Pairs |
Yes (LVDS, RSDS, etc.) |
| SelectIO Standards Supported |
LVCMOS, LVDS, SSTL, POD, HSTL, and more |
#### Transceiver Performance
Kintex UltraScale devices are known for their next-generation serial transceivers, offering some of the highest bandwidth in the mid-range FPGA segment:
| Transceiver Spec |
Value |
| Transceiver Type |
GTH |
| Per-Lane Line Rate |
Up to 16.375 Gb/s |
| Supported Protocols |
PCIe Gen3, 100G Ethernet, JESD204B, CPRI, SRIO |
XCKU035-2FBVA676E Power Specifications
| Power Rail |
Voltage |
Purpose |
| VCCINT |
0.95V (nominal) |
Core logic supply |
| VCCO |
1.2V – 3.3V |
I/O bank output supply |
| VCCAUX |
1.8V |
Auxiliary circuits |
| VCCBRAM |
0.95V |
Block RAM supply |
The 20nm process enables up to 40% lower power consumption compared to previous-generation 28nm devices, with fine-grained clock gating reducing dynamic power during idle periods.
XCKU035-2FBVA676E Package Information
| Package Parameter |
Value |
| Package Type |
FCBGA (Fine-Pitch Ceramic Ball Grid Array) |
| Package Code |
FBVA676 |
| Ball Count |
676 |
| Ball Pitch |
1.0mm |
| Package Size |
23mm × 23mm |
| Mounting |
Surface Mount |
| Board Assembly |
Lead-free, RoHS3 compliant |
The compact FBVA676 footprint is well-suited for high-density PCBs where space constraints require a smaller package while retaining full device capabilities.
Supported Applications
The XCKU035-2FBVA676E targets a wide range of compute-intensive and bandwidth-critical applications:
| Application Area |
Use Case |
| 100G Networking |
Packet processing, traffic management, line card acceleration |
| Data Center |
FPGA-accelerated offload, SmartNIC, storage controllers |
| Medical Imaging |
MRI/CT reconstruction, ultrasound DSP, real-time image processing |
| Wireless Infrastructure |
DFE, CPRI/eCPRI fronthaul, 5G baseband processing |
| Video & Broadcasting |
8K/4K video processing, frame buffering, format conversion |
| Defense & Aerospace |
Radar/sonar signal processing, secure communications |
| Test & Measurement |
High-speed data acquisition, protocol analysis |
Development Tools and Ecosystem
#### Vivado Design Suite
The XCKU035-2FBVA676E is fully supported by Xilinx Vivado Design Suite, providing:
- Synthesis, implementation, place-and-route
- IP Integrator for block design methodology
- Integrated simulation and verification flows
- Power analysis and optimization
#### Supported IP Cores
- AXI4, AXI4-Lite, AXI4-Stream interconnect fabric
- PCIe Gen3 endpoint and root port
- 100G Ethernet MAC (CMAC)
- DDR3/DDR4 memory controllers
- JESD204B ADC/DAC interfaces
- Video codec units (VCU)
XCKU035-2FBVA676E Compared to Similar Devices
| Part Number |
Logic Cells |
I/Os |
Speed Grade |
Package |
| XCKU035-1FBVA676E |
444,343 |
312 |
-1 (slower) |
FBVA676 |
| XCKU035-2FBVA676E |
444,343 |
312 |
-2 (standard) |
FBVA676 |
| XCKU035-3FBVA676E |
444,343 |
312 |
-3 (fastest) |
FBVA676 |
| XCKU035-2FBVA900E |
444,343 |
468 |
-2 |
FBVA900 |
| XCKU040-2FBVA676E |
530,250 |
312 |
-2 |
FBVA676 |
The -2 speed grade in the XCKU035-2FBVA676E represents the best combination of timing headroom and availability for most commercial designs. The -3 grade is reserved for applications with extremely tight timing requirements, while -1 offers lower power at reduced maximum frequencies.
Ordering and Compliance Information
| Detail |
Value |
| Manufacturer Part Number |
XCKU035-2FBVA676E |
| Manufacturer |
Xilinx / AMD |
| DigiKey Part Number |
6132062 |
| RoHS Status |
RoHS3 Compliant |
| REACH Compliant |
Yes |
| Moisture Sensitivity Level |
MSL 3 |
| Warranty |
12 months from date of purchase |
| Packaging |
Tray |
| Lead-Free |
Yes |
Frequently Asked Questions
Q: What does the “E” suffix mean in XCKU035-2FBVA676E? A: The “E” denotes an Extended commercial temperature range (0°C to 100°C junction temperature), distinct from industrial (“I”) or military grade variants.
Q: Is the XCKU035-2FBVA676E pin-compatible with larger Kintex UltraScale devices? A: Devices sharing the same FBVA676 package footprint (such as XCKU040-2FBVA676E) are designed for migration compatibility, allowing design scalability with minimal PCB changes.
Q: What memory interfaces does the XCKU035-2FBVA676E support? A: The device supports DDR3, DDR4, LPDDR3, QDR II+, and RLDRAM 3 external memory interfaces via the MIG (Memory Interface Generator) IP.
Q: What is the maximum PCIe lane configuration? A: The XCKU035 supports PCIe Gen3 x8, which provides up to 64 Gb/s of aggregate bandwidth for high-throughput host interface designs.
Q: Which Vivado version should I use for XCKU035-2FBVA676E development? A: Xilinx recommends Vivado 2019.1 or later for full production support of Kintex UltraScale devices. Using the latest stable Vivado release ensures access to current IP cores and security patches.
Summary
The XCKU035-2FBVA676E is a mid-range, high-performance Xilinx Kintex UltraScale FPGA that delivers exceptional compute density, signal processing bandwidth, and I/O flexibility in a compact 676-pin FCBGA package. With 444K logic cells, 1,080 DSP slices, 312 user I/Os, and next-generation GTH transceivers running at up to 16.375 Gb/s, it is an ideal solution for 100G networking, 5G wireless infrastructure, advanced medical imaging, and data center acceleration workloads.
Its 20nm architecture provides substantial power savings over previous FPGA generations, while full support in the Vivado Design Suite ensures a streamlined design and verification flow. For engineers seeking a scalable, cost-effective FPGA platform with proven performance at mid-range price points, the XCKU035-2FBVA676E is a compelling choice.
