The XCKU035-3SFVA784E is a high-performance field-programmable gate array (FPGA) manufactured by AMD (formerly Xilinx), belonging to the Kintex UltraScale family. Built on a cutting-edge 20nm process technology, this device delivers the best price/performance/watt ratio in its class. Whether you are designing 100G networking systems, advanced DSP pipelines, medical imaging hardware, or next-generation wireless infrastructure, the XCKU035-3SFVA784E offers an ideal combination of logic density, memory, and transceiver performance.

This guide covers every key aspect of the XCKU035-3SFVA784E — from core specifications and packaging details to functional features and application use cases — to help engineers and procurement teams make informed decisions.

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What Is the XCKU035-3SFVA784E?

The XCKU035-3SFVA784E is a member of the Xilinx Kintex UltraScale FPGA series, a mid-range family designed to balance high performance with cost efficiency. The “-3” speed grade designates the fastest performance tier available for this device, making it the preferred choice for latency-sensitive and high-throughput applications.

For designers seeking a broad range of programmable logic solutions, you can explore more options on Xilinx FPGA offerings available across the UltraScale product family.

Part Number Breakdown

Understanding the part number helps you quickly identify device characteristics at a glance.

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XCKU035-3SFVA784E Key Specifications

The table below summarizes the most important technical parameters for the XCKU035-3SFVA784E at a glance.

General Device Specifications

Logic Resources

Memory Resources

DSP and Processing

I/O and Connectivity

Clock Management

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XCKU035-3SFVA784E Package and Physical Details

The XCKU035-3SFVA784E comes in the SFVA784 package — a 784-ball Super Fine-pitch Flip-Chip Ball Grid Array (FC-BGA). This compact package is designed for high-density PCB layouts while maintaining full signal integrity. It is footprint-compatible with other SFVA784-packaged UltraScale devices, allowing designers to scale up or down without a full board redesign.

Package Specifications

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Performance Advantages of the -3 Speed Grade

The -3 speed grade in the XCKU035-3SFVA784E signifies the highest performance level available in the Kintex UltraScale KU035 product tier. This grade is particularly important for applications where clock speed and signal propagation delay are critical design constraints.

Speed Grade Comparison: XCKU035 Variants

The -3 grade devices are tested and characterized at 1.0V VCCINT, resulting in faster internal switching speeds, tighter setup/hold times, and higher maximum clock frequencies compared to slower-grade variants.

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Key Features and Architecture of the Kintex UltraScale FPGA

The XCKU035-3SFVA784E is built on AMD’s UltraScale architecture, which was a breakthrough in FPGA design when introduced. Below are the standout architectural features that make this device a strong choice for demanding applications.

ASIC-Like Clocking

The UltraScale architecture incorporates ASIC-like global and regional clocking resources. With 10 Clock Management Tiles (CMTs) — each containing one MMCM and one PLL — designers achieve fine-grained clock domain management with minimal clock skew across the entire device.

Next-Generation GTH Transceivers

The XCKU035-3SFVA784E integrates 16 GTH transceivers, capable of operating at line rates up to 16.3 Gb/s per channel. These transceivers natively support high-bandwidth protocols, including:

• PCIe Gen3 x8 – for high-speed board-level interconnect
• 100G Ethernet (CAUI-4) – for data center and networking applications
• Interlaken – for chip-to-chip and line-card interconnects
• JESD204B – for high-speed ADC/DAC interfacing in wireless and instrumentation designs

High DSP Performance

With 1,080 DSP48E2 slices, the XCKU035-3SFVA784E delivers exceptional signal processing throughput. Each DSP48E2 slice supports cascaded multiply-accumulate operations, making this device highly efficient for FFT engines, FIR filters, matrix operations, and machine learning inference workloads.

UltraRAM-Ready Architecture

The Kintex UltraScale family introduced the concept of UltraRAM in subsequent generations. In the XCKU035, 270 Block RAM tiles provide a combined 19,440 Kbits of on-chip memory, eliminating the need for costly external memory in many embedded processing designs.

Power Efficiency

The 20nm process node delivers up to 40% lower power consumption compared to the previous 28nm generation. The fine-grained clock gating available across the UltraScale fabric further reduces dynamic power, which is critical for systems with strict thermal or power budgets.

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Supported Design Tools

The XCKU035-3SFVA784E is fully supported by AMD’s Vivado Design Suite, the industry-standard environment for UltraScale FPGA development. Vivado provides:

• HDL synthesis and implementation
• Place and route optimization
• Timing closure tools
• IP integrator for pre-validated IP cores
• Power estimation via Xilinx Power Estimator (XPE)
• Simulation and functional verification

The device is also supported by the Vitis platform for high-level synthesis (HLS) and software acceleration workflows, enabling C/C++ or OpenCL-based design entry alongside traditional RTL design.

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Application Use Cases

The XCKU035-3SFVA784E targets a broad range of professional and industrial applications where programmable logic delivers decisive advantages over fixed-function ASICs or microprocessors.

Networking and Data Centers

The 100G Ethernet and PCIe Gen3 support make the XCKU035-3SFVA784E ideal for:

• Network interface cards (NICs)
• Line-rate packet inspection and classification
• 100G optical transport modules
• Data center switching fabrics

Wireless Infrastructure

The high DSP bandwidth supports the computationally intensive processing needed in:

• LTE and 5G baseband processing
• Massive MIMO beamforming algorithms
• Remote radio head digital front-end (DFE)
• TD-LTE 8×8 100 MHz radio unit implementations

Medical Imaging

The combination of high-bandwidth transceivers, DSP slices, and block RAM makes this FPGA well-suited for:

• Ultrasound image reconstruction
• CT and MRI data acquisition
• 3D volume rendering pipelines
• Real-time image processing at high frame rates

Test and Measurement

Engineering teams use Kintex UltraScale FPGAs in high-channel-count digitizers, protocol analyzers, and automated test equipment (ATE) platforms requiring both analog capture and digital processing at high speeds.

Video and Broadcast

The XCKU035-3SFVA784E handles:

• 4K and 8K video processing pipelines
• Multi-channel video scaling and format conversion
• Broadcast-grade SDI interfacing

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XCKU035-3SFVA784E vs. Similar Kintex UltraScale Devices

To help you choose the right device for your project, the table below compares the XCKU035-3SFVA784E against adjacent devices in the Kintex UltraScale family.

The XCKU035-3SFVA784E occupies a strategic position in the family — providing substantially more resources than the KU025 while maintaining the same compact SFVA784 footprint. This makes it an excellent upgrade path for designs that have outgrown the KU025 without requiring a board layout change.

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Ordering and Availability Information

When ordering the XCKU035-3SFVA784E, always confirm the exact speed grade suffix (-3), package code (SFVA784), and temperature suffix (E for extended/commercial) to ensure compatibility with your system requirements and PCB footprint.

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Frequently Asked Questions About the XCKU035-3SFVA784E

What does the “E” suffix mean in XCKU035-3SFVA784E?

The “E” at the end of the part number indicates the extended commercial temperature range, which covers 0°C to +85°C junction temperature. This makes the device suitable for commercial and industrial environments that do not require the full -40°C to +100°C industrial range.

Is the XCKU035-3SFVA784E pin-compatible with other Kintex UltraScale devices?

Yes. Devices sharing the same SFVA784 package — such as the XCKU025 and XCKU040 in the same package — are footprint-compatible. This allows board-level migration between density tiers without PCB redesign, a significant advantage during product development and production scaling.

What programming tool should I use for the XCKU035-3SFVA784E?

AMD recommends using Vivado Design Suite 2015.4 or later for production designs targeting the XCKU035-3SFVA784E. The Vivado ML Edition and Vivado Standard Edition both support this device with full implementation, simulation, and timing analysis capabilities.

Does the XCKU035-3SFVA784E support PCIe?

Yes. The device natively supports PCIe Gen3 x8, enabled through the integrated GTH transceiver hard IP. This makes it suitable for PCIe endpoint or root complex implementations in high-speed computing and data acquisition systems.

What is the core supply voltage for the -3 speed grade?

The -3 speed grade operates at 1.0V VCCINT, slightly higher than the 0.95V used by -2 and -1 speed grade parts. This additional voltage margin enables the higher switching speeds that characterize the -3 grade.

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Summary

The XCKU035-3SFVA784E is a powerful, versatile, and cost-effective FPGA solution for engineers working on high-performance digital design projects. With 355,474 logic cells, 1,080 DSP slices, 19,440 Kbits of block RAM, 16 GTH transceivers at up to 16.3 Gb/s, and PCIe Gen3 x8 support — all packaged in a compact 784-ball FC-BGA — this device delivers exceptional capability within a manageable footprint and power envelope.

Built on the proven UltraScale 20nm architecture and fully supported by AMD Vivado, the XCKU035-3SFVA784E is ready for demanding applications in networking, wireless, medical, and broadcast sectors. Its -3 speed grade ensures the highest available performance within the KU035 family, making it the right choice when timing closure and throughput are non-negotiable requirements.