What Is the XCKU035-L1FBVA676I?
The XCKU035-L1FBVA676I is a high-performance Field Programmable Gate Array (FPGA) manufactured by AMD (formerly Xilinx), belonging to the Kintex® UltraScale™ family. This device is engineered to deliver the best price-performance-per-watt ratio at 20nm process technology. If you are looking for a mid-range FPGA that balances capability and cost-effectiveness, the XCKU035-L1FBVA676I is an excellent choice.
Built on AMD’s UltraScale™ architecture — the first ASIC-class all-programmable architecture — this IC supports multi-hundred Gbps levels of system performance. It achieves this while efficiently routing and processing data on-chip. Furthermore, the device is RoHS3 compliant and rated for industrial temperature ranges, making it suitable for demanding environments.
For a broader overview of the complete product family, visit our Xilinx FPGA resource page.
XCKU035-L1FBVA676I Key Specifications at a Glance
The table below summarizes the most critical technical parameters of the XCKU035-L1FBVA676I:
| Parameter |
Value |
| Part Number |
XCKU035-L1FBVA676I |
| Manufacturer |
AMD (Xilinx) |
| Series |
Kintex® UltraScale™ |
| Technology Node |
20nm |
| Logic Cells |
444,343 |
| Logic Blocks (CLBs) |
203,128 |
| Total RAM Bits |
19,456,000 bits (19,456 Kb) |
| Number of I/Os |
312 |
| Package Type |
676-BBGA / FCBGA (FBVA676) |
| Package Pin Count |
676 Pins |
| Speed Grade |
-L1 (Low Power Grade 1) |
| Core Supply Voltage (VCCINT) |
0.95V |
| Operating Temperature |
–40°C to +100°C (Industrial) |
| Product Status |
Active |
| RoHS Compliance |
RoHS3 Compliant |
| Packaging |
Bulk |
XCKU035-L1FBVA676I Logic and Memory Resources
Understanding the on-chip resources of the XCKU035-L1FBVA676I helps engineers plan design utilization accurately. The table below breaks down the internal fabric resources:
Fabric Resource Summary
| Resource |
Quantity |
| Logic Cells (Macrocells) |
444,343 |
| Configurable Logic Blocks (CLBs) |
203,128 |
| Block RAM (BRAM) Total |
19,456,000 bits |
| DSP Slices |
1,046 |
| GTH Transceivers |
20 (up to 16.3 Gb/s each) |
| PCIe Hard Blocks |
2 |
| CMAC (100G Ethernet MAC) |
1 |
| PLL / MMCM |
Yes |
| UltraRAM (URAM) |
N/A (UltraScale, not UltraScale+) |
The XCKU035-L1FBVA676I offers a high DSP-to-logic ratio, which makes it particularly well-suited for compute-intensive signal processing workloads. In addition, the on-chip BRAM provides ample storage for intermediate data without requiring external memory in many design scenarios.
Package and Pinout Details
The XCKU035-L1FBVA676I uses the FBVA676 flip-chip ball grid array (FCBGA) package. This package is compact yet provides sufficient I/O density for a wide range of system designs. Key package details are listed below:
Package Specifications
| Parameter |
Detail |
| Package Code |
FBVA676 |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
676 |
| User I/O Pins |
312 |
| Differential I/O Pairs |
144 |
| I/O Standards Supported |
LVDS, SSTL, HSTL, LVCMOS, and more |
| Max. I/O Banks |
6 HP (High Performance) I/O Banks |
The 676-ball FCBGA footprint enables a relatively small PCB footprint while still exposing 312 user I/O pins. Therefore, this package is an ideal choice for designs where board space is constrained but I/O requirements remain significant.
Speed Grade and Power Profile: The “-L1” Designation
The -L1 speed grade in the XCKU035-L1FBVA676I part number indicates a Low-Power Grade 1 device. This is an important distinction compared to standard -1, -2, or -3 speed grades:
- Lower VCCINT voltage (0.95V): The -L1 grade operates at a reduced core supply voltage compared to the standard -1 grade (typically 1.0V). As a result, dynamic power consumption is reduced.
- Performance trade-off: The -L1 speed grade offers slightly reduced maximum operating frequency compared to -2 or -3 grades. However, it still provides excellent performance for most mid-range applications.
- Ideal for power-sensitive systems: Applications such as wireless base stations, remote radio units, and battery-backed equipment benefit significantly from the lower power profile.
XCKU035 Speed Grade Comparison
| Speed Grade |
VCCINT |
Max Frequency |
Power Profile |
| -L1 (this device) |
0.95V |
~600 MHz typical |
Lowest power |
| -1 |
1.0V |
~600 MHz |
Standard |
| -2 |
1.0V |
~650 MHz |
Higher performance |
| -3 |
1.0V |
~700 MHz |
Highest performance |
Transceiver Architecture and High-Speed Connectivity
One of the most compelling features of the XCKU035-L1FBVA676I is its GTH transceiver architecture. This device includes 20 GTH transceivers, each capable of data rates up to 16.3 Gb/s in full-duplex operation. Consequently, the XCKU035-L1FBVA676I is well-positioned for high-bandwidth communication applications.
Supported High-Speed Protocols
| Protocol |
Notes |
| PCIe Gen3 x8 |
Up to 64 Gb/s aggregate bandwidth |
| 100G Ethernet (CAUI-4) |
Via integrated CMAC hard block |
| Interlaken |
Up to 150 Gb/s |
| JESD204B |
High-speed ADC/DAC interface |
| Aurora |
High-speed chip-to-chip link |
| CPRI / eCPRI |
Wireless fronthaul |
The integrated PCIe Gen3 hard block eliminates the need to implement PCIe in soft logic, freeing up fabric resources for the application itself.
Target Applications for the XCKU035-L1FBVA676I
The XCKU035-L1FBVA676I is specifically designed for mid-range applications that demand high signal processing bandwidth at an optimized power envelope. Below are the primary application domains:
Networking and Data Centers
The device’s 100G Ethernet MAC and GTH transceivers make it suitable for line-card FPGAs, traffic management engines, and network function virtualization (NFV) acceleration. Additionally, the integrated Interlaken support enables high-bandwidth chip-to-chip communication in chassis-based systems.
Wireless Infrastructure
The XCKU035-L1FBVA676I supports heterogeneous wireless infrastructure, including TD-LTE remote radio heads (RRH), digital front-end (DFE) processing, and massive MIMO beamforming. Its CPRI/eCPRI support makes it a strong candidate for 4G and 5G base station designs.
Medical Imaging
With over 1,000 DSP slices and high memory bandwidth, the device handles demanding signal processing pipelines used in CT, MRI, and ultrasound imaging systems. Its industrial temperature rating also meets the reliability standards required in medical-grade equipment.
Video Processing
The XCKU035-L1FBVA676I supports 8K/4K video processing pipelines. It provides sufficient logic and memory resources to implement video scalers, encoders, and format converters in broadcast and professional video systems.
Defense and Aerospace
The industrial temperature range (–40°C to +100°C) and robust UltraScale architecture make this FPGA well-suited for radar signal processing, electronic warfare, and ruggedized embedded computing systems.
UltraScale Architecture Advantages
The XCKU035-L1FBVA676I is based on AMD’s UltraScale architecture, which introduced several industry-leading innovations compared to the previous 7 Series generation:
Key Architectural Innovations
| Feature |
UltraScale Benefit |
| Next-Generation Routing |
Eliminates routing bottlenecks at high utilization |
| ASIC-Like Clocking |
Fine-grained clock gating for power savings |
| SSI Technology |
Stacked Silicon Interconnect for larger devices |
| Vivado Design Suite |
Modern synthesis, P&R, and verification tools |
| Power Reduction |
Up to 40% lower power vs. 7 Series generation |
| BOM Cost Reduction |
System integration cuts BOM cost by up to 60% |
Furthermore, the UltraScale architecture supports 3D-on-3D IC integration, enabling the construction of very large designs across multiple stacked silicon dies — a capability unavailable in previous FPGA generations.
Design Tool Support
The XCKU035-L1FBVA676I is fully supported by the AMD Vivado Design Suite, which provides an integrated development environment for synthesis, implementation, simulation, and device programming. Vivado supports:
- HDL design entry (VHDL / Verilog / SystemVerilog)
- High-level synthesis (HLS) via Vitis HLS
- IP integrator for block-diagram-based design
- Timing-driven place and route
- Bitstream generation and in-system debugging (ILA, VIO)
Vivado’s UltraFast design methodology ensures that designers can achieve timing closure efficiently, even at high device utilization levels.
Ordering and Compliance Information
| Parameter |
Detail |
| Manufacturer Part Number |
XCKU035-L1FBVA676I |
| Manufacturer |
AMD (previously Xilinx) |
| Product Status |
Active |
| RoHS Status |
RoHS3 Compliant |
| REACH Status |
Compliant |
| Packaging |
Bulk (Tray) |
| Manufacturer Lead Time |
~30 weeks (varies by distributor) |
| Authorized Distributors |
DigiKey, Mouser, Arrow, Avnet, Newark |
Note: The -I suffix in XCKU035-L1FBVA676I denotes Industrial temperature range (–40°C to +100°C), as opposed to the -C suffix which denotes Commercial range (0°C to +85°C).
XCKU035-L1FBVA676I vs. Similar Devices
Engineers often compare the XCKU035-L1FBVA676I against neighboring devices in the Kintex UltraScale family. The table below provides a quick comparison:
| Part Number |
Logic Cells |
I/Os |
Package |
Speed Grade |
Temperature |
| XCKU035-L1FBVA676I |
444,343 |
312 |
676 FCBGA |
-L1 (Low Power) |
Industrial |
| XCKU035-1FBVA676I |
444,343 |
312 |
676 FCBGA |
-1 (Standard) |
Industrial |
| XCKU035-2FBVA676I |
444,343 |
312 |
676 FCBGA |
-2 |
Industrial |
| XCKU040-L1FBVA676I |
530,250 |
312 |
676 FCBGA |
-L1 (Low Power) |
Industrial |
| XCKU035-L1FBVA900I |
444,343 |
468 |
900 FCBGA |
-L1 (Low Power) |
Industrial |
The XCKU035-L1FBVA676I occupies the low-power, cost-optimized segment of the KU035 device family. If a design requires more I/Os, the FBVA900 package variant is available. Alternatively, if higher logic density is needed with the same package, the XCKU040-L1FBVA676I provides approximately 20% more logic cells.
Frequently Asked Questions (FAQ)
What does the “L1” mean in XCKU035-L1FBVA676I?
The “L” stands for Low Power, and “1” is the speed grade. The -L1 device operates at a reduced core supply voltage of 0.95V, which lowers dynamic power consumption compared to the standard -1 grade while maintaining comparable logic performance.
Is the XCKU035-L1FBVA676I pin-compatible with other KU035 packages?
No. The FBVA676 package is specific to the 676-pin footprint. It is not pin-compatible with FBVA900 or FFVA1156 package variants, even within the same KU035 device family.
What programming tools support the XCKU035-L1FBVA676I?
The device is fully supported by the AMD Vivado Design Suite (version 2014.1 and later). The legacy ISE Design Suite does not support UltraScale devices.
What is the core supply voltage of the XCKU035-L1FBVA676I?
The VCCINT (core supply voltage) for the -L1 speed grade is 0.95V. This is lower than the 1.0V used by the standard -1 and higher speed grades.
What is the maximum transceiver data rate?
The integrated GTH transceivers support line rates up to 16.3 Gb/s (full-duplex). The device includes 20 GTH transceiver channels in total.
Summary
The XCKU035-L1FBVA676I is a production-active, RoHS3-compliant AMD Kintex UltraScale FPGA that delivers an outstanding combination of logic density, DSP performance, high-speed connectivity, and power efficiency. With 444,343 logic cells, 20 GTH transceivers at up to 16.3 Gb/s, and a compact 676-pin FCBGA package, this device addresses a broad range of demanding applications — from 100G networking and 5G wireless infrastructure to medical imaging and defense systems.
Its -L1 speed grade makes it the preferred choice in designs where minimizing power consumption is as important as achieving high system throughput. As a result, the XCKU035-L1FBVA676I remains one of the most versatile and cost-effective mid-range FPGAs available today.
