The XC2S200-6FGG1197C is a high-density, cost-optimized Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and an impressive 1,197-pin Fine-Pitch Ball Grid Array (FGG BGA) package — making it one of the most pin-rich variants in the XC2S200 lineup. Whether you’re building telecommunications equipment, industrial control systems, or consumer electronics, the XC2S200-6FGG1197C offers the programmable logic density and I/O flexibility your design demands.
What Is the XC2S200-6FGG1197C? – Part Number Breakdown
Understanding the part number helps engineers quickly identify the exact device variant before purchasing or designing.
| Code Segment |
Meaning |
| XC2S200 |
Xilinx Spartan-II family, 200K system gates |
| -6 |
Speed grade 6 (fastest available for Spartan-II; commercial range only) |
| FGG |
Fine-Pitch Ball Grid Array (Pb-free package, “G” denotes lead-free) |
| 1197 |
1,197 total ball/pin count |
| C |
Commercial temperature range (0°C to +85°C) |
Note: The “-6” speed grade is exclusively available in the Commercial temperature range, per the official Spartan-II datasheet.
XC2S200-6FGG1197C Key Specifications
The table below summarizes the core technical parameters of the XC2S200-6FGG1197C FPGA.
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Spartan-II |
| Part Number |
XC2S200-6FGG1197C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 (+ 4 global clock inputs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Delay-Locked Loops (DLLs) |
4 |
| Technology Node |
0.18 µm |
| Core Voltage (VCCINT) |
2.5V |
| Speed Grade |
-6 (fastest) |
| Package |
FGG BGA, 1,197 pins |
| Temperature Range |
Commercial: 0°C to +85°C |
| RoHS Compliance |
Pb-free (G suffix) |
Spartan-II Family Overview – Where XC2S200 Stands
The XC2S200 is the largest and most capable device in the Spartan-II family. The table below positions it within the complete family lineup so engineers can compare logic density and I/O counts across all members.
| Device |
Logic Cells |
System Gates |
CLB Array (R×C) |
Total CLBs |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
96 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
216 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
384 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
600 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
864 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
1,176 |
284 |
75,264 bits |
56K |
The XC2S200 variant offers the largest CLB array, the highest I/O count, and the most embedded memory — ideal for designs that have outgrown smaller Spartan-II devices.
XC2S200-6FGG1197C Architecture & Internal Features
Configurable Logic Blocks (CLBs)
The CLB array sits at the heart of this FPGA. Each CLB contains four slices, and each slice includes two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry logic. With 1,176 total CLBs, the XC2S200-6FGG1197C provides 5,292 usable logic cells, enabling the implementation of complex state machines, arithmetic pipelines, and multi-channel data paths.
Block RAM
The device includes 56K bits of dual-port Block RAM organized in two columns on opposite sides of the die. These dedicated memory blocks operate independently of the logic array, making them ideal for FIFOs, lookup tables, and data buffers in high-throughput designs.
Distributed RAM
Beyond Block RAM, the LUT-based fabric provides 75,264 bits of distributed RAM. This resource is seamlessly integrated into the CLB fabric, enabling single-cycle read access and low-latency storage for small data sets, shift registers, and scratchpad memory.
Delay-Locked Loops (DLLs)
Four DLLs — one at each corner of the die — provide clock distribution, duty-cycle correction, frequency synthesis, and phase shifting. DLLs eliminate clock skew across the device and allow engineers to derive multiple clock domains from a single input.
Input/Output Blocks (IOBs)
The XC2S200-6FGG1197C supports up to 284 user I/Os across the 1,197-pin BGA package. Each IOB supports a wide range of single-ended and differential I/O standards, including LVTTL, LVCMOS, PCI, GTL, SSTL, and more. The large pin count of the FGG1197 package maximizes available user I/O for complex, multi-bus system designs.
XC2S200-6FGG1197C Package Information
FGG1197 Ball Grid Array Package Details
| Package Attribute |
Detail |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Ball Count |
1,197 |
| Lead Finish |
Pb-free (RoHS compliant) |
| Package Designation |
FGG (Pb-free BGA) |
| Mounting Style |
Surface Mount (SMT) |
The large 1,197-ball BGA footprint of the XC2S200-6FGG1197C is one of the largest available in the Spartan-II series. This package is best suited for high-density PCB designs where maximum I/O expansion is a priority. For a full range of Xilinx FPGA options across generations and families, including compatible packages and alternatives, a comprehensive selection is available to help match the right device to your design.
Speed Grade -6: What It Means for Your Design
The -6 speed grade is the fastest speed grade offered in the Spartan-II family and is available exclusively in the Commercial temperature range (0°C to +85°C). A higher speed grade number indicates faster propagation delays and higher achievable clock frequencies.
| Speed Grade |
Temperature Range |
Max System Performance |
| -5 |
Commercial & Industrial |
Standard |
| -6 |
Commercial only |
Fastest (best timing) |
Designers targeting high clock frequencies in commercial-environment equipment — such as networking switches, video processing units, and digital communication interfaces — should strongly consider the -6 speed grade for maximum timing margin.
Supported I/O Standards
The XC2S200-6FGG1197C input/output blocks support a comprehensive set of I/O standards, enabling seamless interfacing with a broad spectrum of peripheral devices and buses.
| I/O Standard |
Type |
Use Case |
| LVTTL |
Single-ended |
General-purpose logic |
| LVCMOS2 |
Single-ended |
2.5V logic interfaces |
| PCI / PCI-X |
Single-ended |
PCI bus expansion |
| GTL / GTL+ |
Single-ended |
Backplane interfaces |
| SSTL2 / SSTL3 |
Single-ended |
SDRAM/DDR interfaces |
| AGP |
Single-ended |
Graphics bus interfaces |
| LVDS |
Differential |
High-speed serial links |
| BLVDS |
Differential |
Multi-drop bus |
| ULVDS |
Differential |
Ultra-low-voltage differential |
Configuration Modes for XC2S200-6FGG1197C
The Spartan-II FPGA family supports multiple configuration modes, giving engineers flexibility in how the bitstream is loaded into the device at power-up.
| Configuration Mode |
Description |
| Master Serial |
FPGA drives the configuration clock; data loaded from serial PROM |
| Slave Serial |
External host drives both clock and data |
| Master Parallel (SelectMAP) |
High-speed 8-bit parallel configuration |
| Slave Parallel (SelectMAP) |
Parallel configuration driven by host processor |
| Boundary Scan (JTAG) |
IEEE 1149.1 JTAG-based configuration and test |
JTAG boundary scan support is particularly valuable for in-system debugging and production board testing.
Typical Applications for the XC2S200-6FGG1197C
The XC2S200-6FGG1197C is deployed across a broad range of industries and application categories:
Telecommunications & Networking
- Line cards and protocol bridges
- Packet switching and routing logic
- Synchronous digital hierarchy (SDH/SONET) framing
Industrial Automation
- Programmable motion control
- Sensor fusion and real-time I/O
- Machine vision preprocessing
Consumer Electronics
- Set-top box control planes
- Digital display controllers
- Audio/video signal routing
Embedded Systems & Computing
- Custom co-processor acceleration
- Memory bus arbitration
- FPGA-based soft-processor implementations (e.g., PicoBlaze)
Test & Measurement
- Logic analysis front-end interfaces
- Pattern generation
- Protocol emulation
XC2S200-6FGG1197C vs. Comparable Variants
When selecting a Spartan-II device for your design, it is useful to compare the XC2S200-6FGG1197C against other popular variants with different packages or speed grades.
| Part Number |
Speed Grade |
Package |
Pins |
Temp Range |
Pb-Free |
| XC2S200-6FGG1197C |
-6 |
FGG BGA |
1,197 |
Commercial |
Yes |
| XC2S200-6FGG456C |
-6 |
FGG BGA |
456 |
Commercial |
Yes |
| XC2S200-6FG256C |
-6 |
FG BGA |
256 |
Commercial |
No |
| XC2S200-5FGG456C |
-5 |
FGG BGA |
456 |
Commercial |
Yes |
| XC2S200-5PQ208I |
-5 |
PQFP |
208 |
Industrial |
No |
The FGG1197 package variant provides the highest pin count and maximum user I/O availability, making it the preferred choice for pin-constrained designs requiring the broadest bus connectivity.
Design Tools & Software Support
The XC2S200-6FGG1197C is supported by Xilinx’s legacy ISE Design Suite, which includes:
- XST – Xilinx Synthesis Technology for RTL synthesis
- ISE Implementation Tools – Place and route, timing analysis
- ChipScope Pro – In-system logic analysis via JTAG
- Impact – Configuration and bitstream programming
- CORE Generator – IP core instantiation for common functions
Note: As a legacy Spartan-II device, this FPGA is not supported in AMD’s current Vivado Design Suite. ISE 14.7 is the recommended and final supported toolchain for all Spartan-II designs.
Ordering & Availability
The XC2S200-6FGG1197C can be sourced through authorized and independent component distributors globally. When purchasing from secondary market suppliers, always verify:
- Date code and lot traceability
- RoHS/Pb-free certification (confirmed by the “G” in FGG)
- Counterfeit mitigation documentation for high-reliability applications
Frequently Asked Questions (FAQ)
What does the “G” in FGG mean on the XC2S200-6FGG1197C?
The “G” in the package designation indicates a Pb-free (lead-free) BGA package, compliant with RoHS environmental regulations. Standard (non-Pb-free) packages use the “FG” designation without the extra “G.”
Is the XC2S200-6FGG1197C still in production?
The Spartan-II family has been issued a Product Discontinuation Notice (PDN). Engineers designing new systems should evaluate migration to more current Xilinx FPGA families. However, the XC2S200-6FGG1197C remains available through authorized component distributors for legacy board builds and replacement supply.
Can I use Vivado with the XC2S200-6FGG1197C?
No. The XC2S200-6FGG1197C is not supported in Vivado. Use ISE Design Suite 14.7, which is the final version supporting Spartan-II devices.
What is the core operating voltage of the XC2S200-6FGG1197C?
The device operates with a core supply voltage (VCCINT) of 2.5V. The I/O supply voltage (VCCO) varies by bank and I/O standard used.
How many user I/Os does the XC2S200-6FGG1197C have?
The XC2S200 supports up to 284 user I/Os. Note that four additional global clock/user input pins are not included in this count.
Conclusion
The XC2S200-6FGG1197C remains one of the most capable Spartan-II FPGAs ever produced, combining 200K system gates, 5,292 logic cells, 75,264 bits of distributed RAM, 56K bits of block RAM, and four DLLs in a 1,197-pin Pb-free BGA package. The -6 speed grade delivers the best timing performance available within the family, while the large FGG1197 package maximizes I/O density for complex multi-bus system designs. Whether sourced for new commercial builds or legacy system maintenance, the XC2S200-6FGG1197C continues to deliver reliable, programmable logic performance across demanding embedded applications.
