Meta Description: The XC2S200-6FGG1196C is a Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, speed grade -6, and a 1196-pin Pb-free FBGA package. Learn full specs, features, and applications.

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What Is the XC2S200-6FGG1196C? Overview of the Xilinx Spartan-II FPGA

The XC2S200-6FGG1196C is a high-capacity Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family, now under the AMD Xilinx brand. This device delivers 200,000 system gates in a large 1196-pin Fine-Pitch Ball Grid Array (FBGA) Pb-free package — making it one of the most I/O-rich configurations available in the XC2S200 device series.

The part number decodes as follows:

As a member of the Xilinx FPGA Spartan-II family, the XC2S200-6FGG1196C is designed as a cost-effective alternative to mask-programmed ASICs, offering reconfigurability, rapid time-to-market, and high logic density on a 0.18µm process node.

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XC2S200-6FGG1196C Key Specifications at a Glance

The table below summarizes the most important technical parameters for the XC2S200-6FGG1196C:

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Detailed Architecture: Inside the XC2S200-6FGG1196C FPGA

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1196C features a 28×42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that work together to implement virtually any combinational or sequential digital logic function. This architecture provides the flexibility to map complex algorithms directly into silicon without custom mask tooling.

Embedded Memory Resources

Block RAM

The device includes 57,344 bits of dedicated block RAM, organized as fully synchronous dual-ported memory cells. Each block RAM port can be independently configured for different data widths, enabling efficient FIFO buffers, lookup tables, and data caches within a single device.

Distributed RAM

In addition to block RAM, the XC2S200 architecture supports 75,264 bits of distributed RAM embedded within the CLB fabric. This resource is ideal for shallow, high-speed storage requirements such as shift registers and small data buffers.

Input/Output Blocks (IOBs) and I/O Flexibility

The XC2S200-6FGG1196C supports up to 284 user I/O pins (not including the four global clock/user input pins). The IOBs support 16 selectable I/O standards, making it straightforward to interface with a wide range of digital peripherals, buses, and communication protocols.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) — positioned at each corner of the die — provide precise clock management. The DLLs can eliminate clock skew, generate phase-shifted clocks, and even deskew board-level clocks across multiple Spartan-II devices in a multi-chip system.

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XC2S200-6FGG1196C Package Details: 1196-Pin Pb-Free FBGA

The FGG1196 package suffix indicates a 1196-ball Fine-Pitch Ball Grid Array in Pb-free (RoHS-compliant) form. The “G” in “FGG” distinguishes this variant from the standard (non-Pb-free) FG1196 package.

This large-pin-count package is specifically suited for applications requiring maximum I/O connectivity, such as high-channel-count data acquisition, multi-bus interface boards, and complex embedded systems where many external signals must be routed to the FPGA simultaneously.

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Configuration Modes Supported by the XC2S200-6FGG1196C

The XC2S200-6FGG1196C supports multiple configuration modes, allowing flexible system integration:

During power-on and throughout the configuration process, all I/O drivers remain in a high-impedance state, protecting downstream circuitry. After configuration is complete, unused I/O pins remain in high-impedance unless otherwise specified in the bitstream.

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Speed Grade -6: What It Means for Your Design

The -6 speed grade is the highest (fastest) commercial speed grade available in the Spartan-II family. It offers the lowest propagation delays and the highest maximum operating frequencies, making the XC2S200-6FGG1196C ideal for timing-critical applications.

Note: The -6 speed grade is exclusively available for the commercial temperature range (0°C to +85°C).

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Top Applications for the XC2S200-6FGG1196C FPGA

High-Speed Digital Signal Processing (DSP)

With 200,000 gates and a maximum clock frequency of 263 MHz, the XC2S200-6FGG1196C handles computationally intensive DSP workloads — including FIR/IIR filters, FFT engines, and real-time audio/video pipelines — efficiently and with predictable latency.

Telecommunications and Networking

The combination of high I/O count (284 user I/Os), 16 I/O standard support, and DLL-managed clocking makes this FPGA well-suited for telecom line cards, network protocol processing, and multi-channel serial/parallel data interfaces.

Industrial Automation and Control

The device’s reconfigurability and real-time processing capability make it a strong choice for motor drive controllers, process automation platforms, and machine vision systems where deterministic timing is critical.

Embedded Systems and Prototyping

As a programmable alternative to fixed-function ASICs, the XC2S200-6FGG1196C accelerates product development cycles. Engineers can prototype entire systems on a single chip, iterate designs without hardware respins, and update firmware even after deployment.

Medical Imaging and Diagnostics

The FPGA’s parallel processing architecture supports high-throughput data paths required in ultrasound, MRI, and other medical imaging systems, while its reliability meets the demands of safety-critical healthcare applications.

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XC2S200-6FGG1196C vs. Other XC2S200 Package Variants

The XC2S200-6FGG1196C provides the same 284 maximum user I/O pins as the 456-ball variant, but in a larger footprint optimized for board designs requiring extensive signal routing or where pad pitch constraints favor a larger BGA grid.

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XC2S200-6FGG1196C vs. Other Spartan-II Density Options

The XC2S200 is the largest and most capable device in the Spartan-II family, delivering the highest logic density, maximum I/O count, and greatest memory resources across the entire product line.

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Design Tools and Software Support

The XC2S200-6FGG1196C is fully supported by Xilinx (AMD) design software:

• ISE Design Suite – Legacy support with complete HDL synthesis, implementation, and bitstream generation for Spartan-II devices.
• ChipScope Pro – On-chip debug and signal analysis.
• CORE Generator – IP core instantiation for standard functions (UARTs, memory controllers, DSP blocks).
• Vivado Design Suite – While primarily targeting newer architectures, it provides migration and analysis tools for legacy Spartan-II designs.

HDL support includes both VHDL and Verilog, with schematic-based entry also available through ISE.

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Ordering Information and Part Number Breakdown

Full Part Number: XC2S200-6FGG1196C

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Frequently Asked Questions (FAQ)

What does the “G” in FGG1196 mean?

The double “G” (FGG vs. FG) indicates that the package is Pb-free and RoHS-compliant. Standard (non-Pb-free) packages use a single “G” such as FG456 or FG256.

Is the XC2S200-6FGG1196C still in production?

The Spartan-II family has been designated as mature/legacy by AMD Xilinx. Availability is primarily through authorized distributors and component brokers. Engineers requiring long-term supply should confirm stock levels with their preferred distributor.

What is the difference between speed grade -5 and -6?

Speed grade -6 offers lower propagation delays and higher maximum clock frequencies than -5, making it better suited for timing-critical designs. The -6 grade is only available for the commercial temperature range.

Can the XC2S200-6FGG1196C be reconfigured in the field?

Yes. Like all FPGAs, the XC2S200-6FGG1196C supports full in-system reconfiguration. New bitstreams can be loaded via any supported configuration interface, enabling firmware updates without hardware replacement.

What is the maximum user I/O count?

The XC2S200 silicon supports up to 284 user I/O pins, not counting the four dedicated global clock/user input pins.

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Summary: Why Choose the XC2S200-6FGG1196C?

The XC2S200-6FGG1196C combines the full logic resources of the XC2S200 silicon — 200K gates, 5,292 logic cells, 56K bits of block RAM — with the fastest commercial speed grade (-6) and a large Pb-free 1196-pin package ideal for high-I/O system designs. Its mature, well-documented architecture, broad tool support, and proven track record across industrial, telecom, and embedded applications make it a dependable choice for both new development and long-lifecycle production programs.