Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XCKU040-2FBVA676E: AMD Kintex UltraScale FPGA – Complete Specifications & Guide

Product Details

The XCKU040-2FBVA676E is a high-performance field programmable gate array (FPGA) from AMD (formerly Xilinx), belonging to the Kintex® UltraScale™ family. Built on advanced 20nm process technology, this device delivers an exceptional balance of signal processing power, energy efficiency, and mid-range pricing. Whether you are designing for wireless communications, video processing, or high-performance computing, the XCKU040-2FBVA676E is engineered to meet demanding requirements.

For engineers and procurement teams seeking a powerful mid-range programmable logic solution, this Xilinx FPGA represents one of the most capable options in its class.


What Is the XCKU040-2FBVA676E?

The XCKU040-2FBVA676E is part of AMD’s Kintex UltraScale product line — a family designed to deliver the highest signal processing bandwidth in a cost-optimized mid-range device. The part number breaks down as follows:

Part Number Segment Meaning
XCKU040 Kintex UltraScale, 040 density variant
-2 Speed grade 2 (mid-tier performance)
FBVA676 Flip-chip BGA, 676-pin, 1mm pitch package
E Extended temperature range (0°C to 100°C TJ)

XCKU040-2FBVA676E Key Specifications

The table below provides a full overview of the device’s core technical parameters.

Parameter Value
Manufacturer AMD (Xilinx)
Series Kintex® UltraScale™
Part Number XCKU040-2FBVA676E
Logic Cells 530,250
CLB Flip-Flops 21,606,000
Process Technology 20nm
Core Supply Voltage (VCCINT) 0.95V (0.922V – 0.979V range)
Package Type 676-BBGA, FCBGA (Flip-Chip BGA)
Pin Count 676
Pin Pitch 1.0mm
I/O Count 312
Speed Grade -2
Temperature Grade Extended (E): 0°C to 100°C TJ
Mounting Type Surface Mount
Packaging / Case Tray

XCKU040-2FBVA676E Programmable Logic Resources

One of the key strengths of the XCKU040-2FBVA676E is its rich on-chip logic and memory fabric. The table below details the internal programmable resources available to designers.

Resource Quantity
Logic Cells 530,250
CLB Flip-Flops 21,606,000
CLB LUTs ~242,400 (6-input)
Block RAM (36Kb tiles) 600
DSP Slices 1,920
CMTs (Clock Management Tiles) 8
GTH Transceivers 20 (up to 16.375 Gb/s)
PCIe Gen3 x8 Blocks 2
CMAC (100G Ethernet) Blocks 0
I/O Banks 10
User I/O 312

Package & Physical Dimensions

The XCKU040-2FBVA676E comes in a compact and industry-standard flip-chip ball grid array package.

Physical Attribute Detail
Package FBVA676 (Flip-Chip BGA)
Ball Count 676
Ball Pitch 1.0mm
Package Body Size 27mm × 27mm
Height (max) 2.71mm
Mounting Surface Mount Technology (SMT)

Power Supply Requirements

Proper power sequencing is critical for reliable FPGA operation. The XCKU040-2FBVA676E requires multiple supply rails as outlined below.

Supply Rail Voltage Purpose
VCCINT 0.95V Core logic
VCCBRAM 0.95V Block RAM
VCCAUX 1.8V Auxiliary circuits
VCCO (per bank) 1.0V – 3.3V I/O banks
VCCAUX_IO 1.8V High-performance I/O

Speed Grade and Temperature Grades Explained

Understanding the -2 Speed Grade

The XCKU040-2FBVA676E carries a -2 speed grade, which sits between the maximum-performance -3 and the standard -1 grades. The Kintex UltraScale family supports -3, -2, -1, and -1L speed grades:

  • -3: Highest performance, highest power
  • -2: High performance with improved power efficiency
  • -1: Standard performance
  • -1L: Low-power variant (VCCINT 0.90V or 0.95V)

For most high-throughput applications — including 5G baseband processing, radar, and video — the -2 grade provides an optimal balance of performance and power.

Extended Temperature Grade (E Suffix)

The “E” suffix designates the Extended commercial temperature range, specifying junction temperatures from 0°C to 100°C TJ. This makes the device suitable for:

  • Industrial control environments
  • Telecom equipment operating over wide ambient ranges
  • Defense-adjacent commercial applications
  • High-power density PCB assemblies where junction temperatures must be managed

Transceiver Capabilities: GTH High-Speed Serial

The XCKU040-2FBVA676E integrates 20 GTH (Gigabit Transceiver High) channels, each capable of line rates up to 16.375 Gb/s. These transceivers support a wide range of serial protocols:

Protocol Max Line Rate Typical Use Case
PCIe Gen3 x8 8 Gb/s per lane High-speed CPU/FPGA interconnects
10GbE / XAUI 10.3125 Gb/s Ethernet networking
Interlaken 12.5 Gb/s Chip-to-chip interconnect
CPRI / eCPRI Configurable Wireless fronthaul
SATA / SAS 6 / 12 Gb/s Storage interfaces
Custom SerDes Up to 16.375 Gb/s Proprietary high-speed links

This makes the XCKU040-2FBVA676E a highly versatile device for any application requiring multi-protocol, high-bandwidth serial communication.


UltraScale Architecture Advantages

Why UltraScale Outperforms Previous Generations

The XCKU040-2FBVA676E is built on AMD’s UltraScale™ architecture, which introduced several key innovations over the previous 7-series devices:

  • ASMBL Architecture: Allows more efficient resource utilization across all FPGA types
  • SSI Technology Ready: Scalable design for larger devices in the family
  • Advanced Clocking: 8 CMTs with enhanced jitter and phase management
  • High-Density I/O: HP (High Performance) and HR (High Range) banks for mixed-voltage system integration
  • Vivado Design Suite Support: Full compatibility with AMD’s most advanced synthesis, P&R, and verification tools

DSP Performance for Signal Processing

With 1,920 DSP48E2 slices, the XCKU040-2FBVA676E delivers exceptional fixed-point and floating-point arithmetic performance. Each DSP48E2 slice supports:

  • 27×18 two’s complement multiplier
  • Pre-adder for efficient filtering
  • Cascadable for building complex signal chains
  • Optional pipeline registers for maximum clock frequency

This DSP density makes the device ideal for FIR/IIR filtering, FFT engines, convolutional neural network acceleration, and software-defined radio (SDR) workloads.


XCKU040-2FBVA676E Applications

Primary Application Areas

The XCKU040-2FBVA676E is deployed across a wide range of industries and use cases:

#### Wireless Communications & 5G

High transceiver count and DSP density make this FPGA well-suited for 5G baseband unit (BBU) implementations, digital front-end (DFE) processing, and beamforming algorithms.

#### Defense & Aerospace (Commercial Grade)

Extended temperature range combined with the reliability of the UltraScale platform supports radar signal processing, electronic warfare signal analysis, and secure communication gateways in commercial-defense hybrid programs.

#### Broadcast & Video Processing

The device supports high-resolution video capture, 4K/8K format conversion, multi-channel encoding/decoding, and broadcast switching fabric designs.

#### Data Center Acceleration

PCIe Gen3 integration enables FPGA-based accelerator cards for database offload, network packet processing, and machine learning inference at the edge of data centers.

#### High-Performance Computing (HPC)

The large logic fabric and high-speed transceivers support custom compute engines, algorithm acceleration, and inter-node communication in research computing platforms.

#### Test & Measurement

The device’s precision clocking, high I/O count, and logic capacity make it popular in protocol analyzers, automated test equipment (ATE), and signal generator implementations.


Ordering Information and Variants

The XCKU040 device is available in multiple package and temperature configurations. The table below compares common variants to help identify the right part for your design.

Part Number Speed Grade Package Pins Temperature
XCKU040-2FBVA676E -2 FBVA676 676 Extended (0–100°C TJ)
XCKU040-2FBVA676I -2 FBVA676 676 Industrial (-40–100°C TJ)
XCKU040-1FBVA676I -1 FBVA676 676 Industrial
XCKU040-2FBVA900E -2 FBVA900 900 Extended
XCKU040-2FFVA1156E -2 FFVA1156 1156 Extended
XCKU040-3FFVA1156E -3 FFVA1156 1156 Extended

Note: The “E” suffix denotes Extended commercial temperature range (0°C to 100°C TJ). For industrial designs requiring operation below 0°C, select the “I” suffix variant.


Development Tools and Design Support

Vivado Design Suite

The XCKU040-2FBVA676E is fully supported by AMD’s Vivado Design Suite, the primary toolchain for UltraScale FPGA development. Vivado provides:

  • RTL synthesis (VHDL, Verilog, SystemVerilog)
  • IP Integrator for block-diagram-based designs
  • Implementation (placement and routing)
  • Timing analysis and power estimation
  • On-chip debugging (Integrated Logic Analyzer)

Minimum recommended version: Vivado 2016.4 or later for full production support of the XCKU040.

Xilinx Power Estimator (XPE)

For thermal management and power supply design, AMD provides the Xilinx Power Estimator (XPE) tool to accurately estimate VCCINT, VCCAUX, and VCCO current requirements based on actual resource utilization and switching activity.

IP Core Ecosystem

The device benefits from AMD’s extensive IP portfolio available through the Vivado IP Catalog, including:

  • PCIe endpoint cores (Gen3 x8)
  • Ethernet MACs (1GbE, 10GbE)
  • DDR4/DDR3 memory controllers
  • High-speed serial protocol cores (CPRI, Interlaken, JESD204B)
  • Video processing IP (HDMI, SDI, video scaler)

Frequently Asked Questions

What does the “2” in XCKU040-2FBVA676E mean?

The -2 refers to the speed grade. In the Kintex UltraScale family, speed grades range from -1 (lowest) to -3 (highest). The -2 grade offers high performance with good power efficiency.

What is the operating temperature range of the XCKU040-2FBVA676E?

The “E” suffix indicates the Extended temperature grade, specifying a junction temperature (TJ) range of 0°C to 100°C. This is suitable for most industrial and commercial environments but not for sub-zero operation; the “I” (industrial) suffix variant is required for that.

How many user I/O pins does the XCKU040-2FBVA676E have?

The 676-pin package provides 312 user I/O pins, supporting multiple I/O standards including LVDS, SSTL, HSTL, LVCMOS, and others through configurable HP and HR I/O banks.

Is the XCKU040-2FBVA676E RoHS compliant?

Yes, the device is manufactured in compliance with RoHS (Restriction of Hazardous Substances) directives, consistent with AMD’s standard product requirements.

What software is used to program the XCKU040-2FBVA676E?

The device is programmed using AMD Vivado Design Suite. Programming can be performed via JTAG using the Xilinx Platform Cable or through dedicated configuration memories (QSPI Flash, BPI Flash) for production deployment.


Summary

The XCKU040-2FBVA676E is a powerful, versatile, and cost-effective mid-range FPGA that brings the full capability of AMD’s UltraScale architecture to designs requiring high DSP throughput, multi-protocol serial connectivity, and extended temperature reliability. With 530,250 logic cells, 1,920 DSP slices, 20 GTH transceivers, and PCIe Gen3 integration — all in a compact 676-pin surface-mount package — it is a compelling choice across wireless, broadcast, defense, and data center acceleration markets.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.