Meta Description: Buy XC2S200-6FGG1191C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, 1191-pin FGG BGA package, -6 speed grade, 2.5V commercial temp. Full specs, pinout, and applications.

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What Is the XC2S200-6FGG1191C? A Complete Overview of This Xilinx Spartan-II FPGA

The XC2S200-6FGG1191C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s industry-proven Spartan-II family. Manufactured on a 0.18 µm CMOS process and powered at 2.5V, it delivers 200,000 system gates, 5,292 Configurable Logic Block (CLB) cells, and a generous 1191-pin Fine-Pitch Ball Grid Array (FGG BGA) package — one of the largest pin-count variants in the XC2S200 lineup.

Whether you’re a hardware engineer designing a high-I/O communication system, an embedded developer building industrial control logic, or a procurement specialist sourcing programmable logic devices for legacy or new-build systems, the XC2S200-6FGG1191C offers a proven, flexible, and field-upgradeable solution backed by decades of Xilinx reliability.

For a broader look at compatible devices, see the full range of Xilinx FPGA products available for your next design.

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XC2S200-6FGG1191C Key Specifications at a Glance

Note: The “-6” speed grade on XC2S200 devices is exclusively available in the Commercial temperature range. For Industrial temperature requirements, consult alternative speed grades.

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Understanding the Part Number: XC2S200-6FGG1191C Decoded

Breaking down the ordering code helps engineers quickly validate compatibility:

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XC2S200-6FGG1191C Core Architecture & Internal Resources

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1191C is its 28 × 42 array of 1,176 CLBs, yielding 5,292 logic cells in total. Each CLB contains:

• Two Slices, each with two 4-input Look-Up Tables (LUTs)
• Dedicated carry logic for fast arithmetic operations
• Flip-flops for sequential design
• Wide function multiplexers enabling complex combinational logic

This architecture gives designers the ability to implement state machines, data paths, custom buses, and DSP-like functions within a single reconfigurable device.

Block RAM and Distributed RAM

Block RAM columns are placed on both sides of the CLB array, enabling high-bandwidth local data storage for FIFOs, buffers, lookup tables, and embedded data structures — a critical advantage for signal processing and communication applications.

Delay-Locked Loops (DLLs)

Four on-chip DLLs, one at each corner of the die, provide:

• Zero-skew clock distribution across the device
• Clock frequency multiplication and division
• Phase shifting for source-synchronous interface timing
• Duty-cycle correction

This makes the XC2S200-6FGG1191C highly suitable for high-speed I/O applications and multi-clock-domain designs.

Input/Output Blocks (IOBs)

The device supports up to 284 user I/O pins (the FGG1191 package accommodates the full 284 I/O maximum for the XC2S200 die). Each IOB supports:

• Programmable input delay
• Optional output slew-rate control
• 3-state output enable
• Pull-up/pull-down resistors
• Multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL, etc.)

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XC2S200-6FGG1191C Package Information: The FGG1191 BGA

The FGG1191 package is a Fine-Pitch Ball Grid Array with 1,191 solder balls. This large-body BGA format offers several advantages for high-density PCB designs:

The FGG1191 is one of the largest available packages for the XC2S200 die, making it the preferred choice when maximum I/O access is required in a production system.

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XC2S200-6FGG1191C vs. Other XC2S200 Package Variants

Choosing the right package variant depends on your I/O requirements, PCB density, and manufacturing process. The table below compares the main XC2S200 ordering options:

The XC2S200-6FGG1191C uses the same XC2S200 die as all other variants. The 1191-pin package does not add logic resources — it provides a specific mechanical and electrical footprint optimized for certain PCB designs requiring very fine pitch ball spacing across a large substrate.

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XC2S200 Spartan-II Family Comparison

To help place the XC2S200 within the broader Spartan-II lineup:

The XC2S200 is the highest-density device in the Spartan-II family, offering the most logic resources, maximum I/O, and the largest memory capacity — making it the top choice when full Spartan-II performance is required.

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Top Applications for the XC2S200-6FGG1191C FPGA

The XC2S200-6FGG1191C’s high gate count, generous I/O, large memory, and -6 speed grade make it well-suited for a wide range of demanding applications:

#### Communications & Networking

• Protocol bridging (UART, SPI, I2C, PCIe bridging logic)
• Network packet processing and routing logic
• Wireless baseband signal processing
• Ethernet MAC layer implementation

#### Industrial Automation & Control

• PLC (Programmable Logic Controller) expansion logic
• Motor control with real-time feedback loops
• Sensor fusion and multi-axis control
• Industrial Ethernet (PROFINET, EtherCAT) interfaces

#### Signal Processing & Test Equipment

• Digital filter banks (FIR/IIR)
• High-speed ADC/DAC interface logic
• Radar and sonar front-end processing
• Waveform generation and capture

#### Embedded Systems & PCB Co-Processing

• ASIC prototyping and hardware emulation
• Custom CPU bus glue logic
• Memory interface controllers (SDRAM, SRAM)
• Real-time image processing pipelines

#### Defense, Aerospace & Medical

• Ruggedized digital interface logic (with appropriate support components)
• Medical imaging data pipelines
• Secure data processing with reconfigurable encryption engines
• High-reliability control systems

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Design Tools & Configuration for XC2S200-6FGG1191C

Supported EDA Toolchains

The Xilinx ISE Design Suite remains the primary recommended toolchain for Spartan-II devices. ISE supports full synthesis, place-and-route, static timing analysis, and bitstream generation for the XC2S200 device family.

Configuration Modes Supported

The XC2S200-6FGG1191C supports multiple configuration interfaces:

• JTAG (IEEE 1149.1) — Boundary scan and direct programming
• Master Serial — External SPI flash or serial PROM
• Slave Serial — Controlled by an external host processor
• SelectMAP (Parallel) — High-speed parallel configuration for fast boot times

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Electrical Characteristics & Power Specifications

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Why Choose the XC2S200-6FGG1191C for Your Design?

✅ Proven Spartan-II Architecture

Xilinx’s Spartan-II platform has been deployed in millions of units across industrial, communications, and embedded applications worldwide. Its architecture is stable, well-documented, and extensively supported.

✅ Maximum I/O Accessibility in FGG1191 Package

The 1191-ball package provides routing flexibility and specific PCB-level footprint requirements for dense, high-layer-count board designs where package-to-board trace routing benefits from the finer ball pitch geometry.

✅ Field Reconfigurability

Unlike ASICs, the XC2S200-6FGG1191C can be reprogrammed in the field without hardware replacement — reducing time-to-market risk and enabling post-deployment feature updates.

✅ Cost-Effective ASIC Alternative

The Spartan-II series was explicitly designed as a cost-optimized ASIC replacement. It eliminates NRE (Non-Recurring Engineering) costs, avoids ASIC mask charges, and reduces development cycle times.

✅ -6 Speed Grade Performance

The -6 speed grade is the fastest commercial speed grade in the XC2S200 lineup, delivering the lowest propagation delays and highest achievable operating frequencies for timing-critical designs.

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Frequently Asked Questions About the XC2S200-6FGG1191C

What is the difference between XC2S200-6FGG1191C and XC2S200-6FGG456C?

Both devices use the same XC2S200 die with identical logic resources (5,292 cells, 200K gates, 284 I/O, 56K block RAM). The primary difference is the package: FGG1191 uses a 1,191-ball BGA footprint versus the 456-ball footprint of FGG456. The larger package may be specified for specific PCB form-factor or mechanical footprint requirements.

Is the XC2S200-6FGG1191C still in production?

The Spartan-II family is considered a mature/legacy product line by AMD (Xilinx). While no longer recommended for new designs (NRND), the XC2S200-6FGG1191C remains available through authorized distributors and specialty component suppliers for legacy system support and maintenance.

What replaces the XC2S200-6FGG1191C?

For new designs, AMD recommends migrating to newer Xilinx FPGA families such as the Spartan-6, Artix-7, or Spartan-7 series, which offer higher performance, lower power consumption, and modern tool support.

What programming software do I need?

The Xilinx ISE Design Suite (version 14.7 is the final release) is the standard tool for XC2S200 device programming and bitstream generation. It supports VHDL, Verilog, and schematic entry.

Can the XC2S200-6FGG1191C operate at industrial temperatures?

No. The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial temperature operation (-40°C to +85°C), use the -5 or -4 speed grade variants with the “I” suffix (e.g., XC2S200-5FG456I).

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Summary: XC2S200-6FGG1191C Specifications Quick Reference