The XC2S200-6FGG1189C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, offering 200,000 system gates, 5,292 logic cells, and a 1,189-pin Fine-Pitch Ball Grid Array (FBGA) package. Designed for commercial-grade applications, this device combines programmable flexibility, a fast -6 speed grade, and a robust 2.5V architecture — making it one of the most capable components in the Spartan-II lineup. Whether you’re building telecommunications equipment, embedded systems, or digital signal processing (DSP) solutions, the XC2S200-6FGG1189C delivers a cost-effective alternative to mask-programmed ASICs.
What Is the XC2S200-6FGG1189C?
The XC2S200-6FGG1189C is part of Xilinx’s Spartan-II FPGA family — a series engineered to balance performance, I/O density, and low cost for high-volume production environments. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II device, 200K system gates |
| -6 |
Speed grade (-6 is the fastest commercial grade) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-free package |
| 1189 |
1,189 total pin count |
| C |
Commercial temperature range (0°C to +85°C) |
For engineers sourcing Xilinx FPGA components, understanding the part number is critical for selecting the correct speed, package, and temperature variant for your design.
XC2S200-6FGG1189C Key Specifications
Core Logic Resources
| Specification |
Value |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O Pins |
284 |
| Total Distributed RAM |
75,264 bits |
| Total Block RAM |
56K bits |
Electrical & Timing Specifications
| Specification |
Value |
| Core Supply Voltage |
2.5V |
| Speed Grade |
-6 (fastest commercial) |
| Max Operating Frequency |
Up to 263 MHz |
| Process Technology |
0.18 µm |
| I/O Standard Support |
LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL |
Package Information
| Specification |
Value |
| Package Type |
FGG – Fine-Pitch Ball Grid Array (FBGA), Pb-free |
| Total Pin Count |
1,189 |
| Temperature Range |
Commercial: 0°C to +85°C |
| Mounting Type |
Surface Mount |
XC2S200-6FGG1189C Architecture & Features
Configurable Logic Blocks (CLBs)
The XC2S200 organizes its logic into 1,176 Configurable Logic Blocks arranged in a 28×42 grid. Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops. This structure enables efficient implementation of combinational logic, shift registers, and small distributed memory.
Input/Output Blocks (IOBs)
The device features 284 user-configurable I/O pins, each supported by a flexible IOB that supports multiple I/O standards. The IOBs include programmable pull-up, pull-down, and keeper circuits, as well as optional output slew rate control — all essential for signal integrity in high-speed board designs.
Block RAM
The XC2S200-6FGG1189C includes 56K bits of dedicated Block RAM, organized in two columns on opposite sides of the die. Block RAM can be configured in various aspect ratios, supporting dual-port operation for high-bandwidth data buffering between logic modules.
Distributed RAM
With 75,264 bits of distributed RAM available across the CLB fabric, designers can implement fast on-chip lookup tables, FIFOs, and shift registers without consuming dedicated block RAM resources.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) are integrated — one at each corner of the die. The DLLs enable clock deskewing, frequency synthesis, and phase shifting, which are critical for synchronous system designs operating at high clock frequencies.
Configuration Modes
The XC2S200-6FGG1189C supports multiple configuration modes for flexible system integration:
| Configuration Mode |
CCLK Direction |
Data Width |
Serial DOUT |
| Master Serial |
Output |
1-bit |
Yes |
| Slave Serial |
Input |
1-bit |
Yes |
| Slave Parallel |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
No |
XC2S200-6FGG1189C vs. Other Spartan-II Family Members
The table below compares the XC2S200 with other devices in the Spartan-II family, helping engineers select the right density for their design:
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
284 |
56K |
The XC2S200 is the largest and highest-density device in the Spartan-II family, offering the most CLBs, the highest I/O count, and the most on-chip memory — making it the top choice when logic density matters most.
Applications of the XC2S200-6FGG1189C
The XC2S200-6FGG1189C is widely used across multiple industries due to its combination of high logic density and cost-effective programmability:
Telecommunications & Networking
- Line card logic and protocol bridging
- Framing and synchronization for SONET/SDH
- High-speed serial interface management
Digital Signal Processing (DSP)
- FIR and IIR filter implementations
- FFT accelerators for radar and imaging
- Real-time data path processing
Embedded Systems & SoC Prototyping
- Custom peripheral controllers
- Glue logic replacement for legacy ASICs
- Rapid system-on-chip prototyping
Industrial & Automotive Electronics
- Motor control state machines
- Sensor data aggregation and processing
- Automotive bus interface logic (CAN, LIN)
Consumer Electronics
- Video processing and display controllers
- Smart home device logic
- Wireless communication front-end logic
Why Choose the XC2S200-6FGG1189C Over an ASIC?
| Factor |
ASIC |
XC2S200-6FGG1189C (FPGA) |
| NRE (Non-Recurring Engineering) Cost |
High (tooling, masks) |
None |
| Development Time |
Months to years |
Days to weeks |
| Design Modifications |
Requires re-spin |
Reprogrammable in the field |
| Volume Economics |
Cost-effective at millions of units |
Competitive at lower volumes |
| Risk |
High (single shot) |
Low (iterative design) |
The XC2S200-6FGG1189C’s in-field reprogrammability means product firmware and logic updates can be deployed after manufacturing — a major advantage in applications where standards evolve or bugs need patching post-deployment.
Ordering & Part Number Guide
When sourcing the XC2S200-6FGG1189C, verify all segments of the part number to ensure compatibility with your design:
| Field |
Options Available |
| Device |
XC2S200 |
| Speed Grade |
-5 (slower), -6 (fastest commercial) |
| Package |
FG256, FGG256, FGG456, FGG1189, PQ208, PQG208 |
| Pb-Free Indicator |
FGG = Pb-Free; FG = standard |
| Temperature |
C = Commercial (0°C to +85°C); I = Industrial (-40°C to +100°C) |
Note: The -6 speed grade is exclusively available in the Commercial temperature range. If your application requires industrial temperature operation, select the -5 speed grade with the “I” suffix.
XC2S200-6FGG1189C: Frequently Asked Questions (FAQ)
Q: What software tools are used to program the XC2S200-6FGG1189C?
The XC2S200-6FGG1189C is supported by Xilinx ISE Design Suite (the legacy toolchain for Spartan-II). Designs are written in VHDL or Verilog, synthesized, placed and routed, and then Q: Is the XC2S200-6FGG1189C still in production?
The Spartan-II family has reached end-of-life status for new production, but the XC2S200-6FGG1189C remains widely available through authorized distributors and component brokers for maintenance, repair, and legacy system support.
Q: What are common substitutes for the XC2S200-6FGG1189C?
Functional equivalents within the same family include other XC2S200 variants (same core, different packages). For new designs, Xilinx’s Spartan-6 or Spartan-7 families offer significantly higher performance and current production status.
Q: What configuration memory is required?
The XC2S200-6FGG1189C requires 1,335,840 configuration bits and is typically configured using Xilinx XCF PROM series devices or a host microcontroller via JTAG/SelectMAP.
Summary
The XC2S200-6FGG1189C remains a highly capable FPGA for engineers working on legacy system support, high-density commercial prototyping, and cost-sensitive designs that require maximum I/O in the Spartan-II family. Its 1,189-pin FBGA package, -6 speed grade, 200K system gates, and 284 user I/Os make it the flagship device of the Spartan-II series.
For a broader selection of programmable logic devices and support, explore our full range of Xilinx FPGA products — from legacy Spartan-II components to the latest UltraScale+ devices.
