The XC2S200-6FGG1188C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Housed in a large 1188-ball Fine-Pitch BGA (FBGA) package, this commercial-grade device delivers 200,000 system gates, 5,292 logic cells, and operates at speeds up to 263 MHz — making it a reliable choice for engineers working on telecommunications, industrial automation, embedded systems, and signal processing applications.

Whether you are sourcing this component for legacy system maintenance or integrating it into a new design, this guide covers everything you need to know about the XC2S200-6FGG1188C, from key electrical specifications to package details and application use cases.

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What Is the XC2S200-6FGG1188C? Understanding the Part Number

Before diving into the specs, it helps to decode the part number:

The “-6” speed grade is the highest performance tier available in the Spartan-II family and is exclusively offered in the commercial temperature range. The “G” in “FGG” confirms this is a RoHS-compliant, lead-free package variant.

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XC2S200-6FGG1188C Key Specifications at a Glance

Core Electrical & Logic Specifications

Package Specifications

Performance Summary

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XC2S200-6FGG1188C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 features a 28×42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains four logic cells with look-up tables (LUTs), flip-flops, and dedicated carry logic, enabling efficient implementation of arithmetic, state machines, and data path functions.

Input/Output Blocks (IOBs)

The device provides up to 284 user-configurable I/O pins (excluding the four global clock/user input pins). Each IOB supports multiple I/O standards, including LVCMOS, LVTTL, PCI, and more, offering excellent flexibility for system integration.

Block RAM

The XC2S200-6FGG1188C includes 56K bits of dual-port block RAM organized in 8 blocks of 7K bits each. Block RAM is ideal for FIFOs, look-up tables, shift registers, and data buffering in high-speed designs.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — provide precise clock management. DLLs eliminate clock distribution skew, multiply or divide clock frequencies, and shift clock phase, enabling complex clocking schemes without external components.

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Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The table below shows how the XC2S200 compares to other devices in the Spartan-II family:

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the maximum logic resources, I/O count, and memory capacity.

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XC2S200-6FGG1188C vs. Other XC2S200 Package Variants

Xilinx offered the XC2S200 in several package options. The FGG1188 is the largest, providing the most accessible I/O pins for high-density PCB designs:

The FGG1188 package, while physically larger, provides improved thermal dissipation and is often preferred in high-reliability or dense interconnect environments.

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High-Density Logic Capacity

With 5,292 logic cells and 200,000 equivalent system gates, the XC2S200 handles complex digital designs that smaller FPGAs cannot accommodate, including multi-channel DSP pipelines, network interfaces, and image processing cores.

 Fast -6 Speed Grade Performance

The -6 speed grade is the highest available in the Spartan-II family and is exclusively offered in the commercial temperature range. System performance is supported at up to 200 MHz for Abundant On-Chip Memory

The combination of 75,264 bits of distributed SelectRAM+ and 56K bits of dedicated block RAM makes the XC2S200 well-suited for memory-intensive designs, including packet buffering, coefficient storage for DSP, and configuration tables.

 Four On-Chip DLLs for Precision Clocking

The four DLLs enable sophisticated multi-clock domain designs. They support clock multiplication, division, phase shift, and duty-cycle correction — reducing the need for external clock management components.

 ASIC Replacement and Prototyping

The Spartan-II XC2S200 is widely recognized as a cost-effective alternative to mask-programmed ASICs. Its field-programmability eliminates tooling costs and enables in-field design upgrades — something impossible with traditional ASICs.

 Lead-Free (Pb-Free) Packaging

The “G” designation in FGG confirms RoHS compliance, meeting environmental regulations for use in consumer electronics, industrial equipment, and export-controlled markets.

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Typical Applications for the XC2S200-6FGG1188C

The large logic capacity and fast speed grade make this FPGA well-suited for a broad range of applications:

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Programming and Design Tools for the XC2S200-6FGG1188C

Supported Design Software

The XC2S200-6FGG1188C is supported by Xilinx ISE Design Suite, the primary toolchain for Spartan-II devices. ISE includes:

• XST – Xilinx Synthesis Technology for HDL synthesis
• PAR – Place and Route tools
• BitGen – Bitstream generation
• ChipScope Pro – On-chip logic analyzer for debugging

Note: As a legacy device, the XC2S200 is not supported by Vivado Design Suite. ISE 14.7 is the recommended and final version supporting the Spartan-II family.

Supported HDL Languages

 Configuration Modes

The XC2S200-6FGG1188C supports multiple configuration modes:

• Master Serial – Using Xilinx Platform Flash PROMs
• Slave Serial – Driven by an external microprocessor or CPLD
• Slave Parallel (SelectMAP) – High-speed byte-wide configuration
• JTAG – IEEE 1149.1 boundary scan and configuration

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Ordering Information and Part Number Decoder

When purchasing the XC2S200-6FGG1188C, confirm the following details to ensure you receive the correct component:

For a broader selection of Spartan and other Xilinx programmable logic devices, explore the full range at Xilinx FPGA.

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Frequently Asked Questions (FAQ) About the XC2S200-6FGG1188C

What is the difference between XC2S200-6FGG1188C and XC2S200-6FGG456C?

Both parts use the same XC2S200 die with identical logic capacity and speed. The primary difference is the package: the FGG1188 offers a 1,188-ball BGA footprint while the FGG456 has a smaller 456-ball BGA. The FGG1188 provides more PCB routing flexibility for high pin-count board designs.

Is the XC2S200-6FGG1188C still in production?

The Spartan-II family has reached end-of-life status with Xilinx/AMD. However, the XC2S200-6FGG1188C remains available through authorized distributors and specialty component suppliers for legacy system support and maintenance.

Can the XC2S200-6FGG1188C operate in industrial temperature ranges?

No. The “-C” suffix designates commercial temperature range only (0°C to +85°C). For industrial temperature operation (-40°C to +85°C), the “-I” suffix variants (speed grade -5) are required.

What FPGA replaces the XC2S200?

For new designs, Xilinx recommends migrating to more modern families such as Spartan-6, Artix-7, or Spartan-7, which offer significantly more resources, lower power consumption, and ongoing tool support.

Does the XC2S200 support partial reconfiguration?

The Spartan-II family does not support partial reconfiguration. Full device reconfiguration is required when updating the design.

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Summary: Why Choose the XC2S200-6FGG1188C?

The XC2S200-6FGG1188C remains one of the most resource-rich devices in the Spartan-II lineup, combining the maximum logic density of the family with the fastest available speed grade and a large, lead-free BGA package. It is the go-to choice for engineers maintaining legacy telecommunications and industrial systems, or for those requiring a proven, low-cost programmable logic solution with substantial I/O and memory resources.

For sourcing this component or exploring comparable Xilinx FPGA products, contact an authorized distributor and always verify the full part number to ensure correct package, speed grade, and temperature range for your application.