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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCKU040-2SFVA784I

Product Details

What Is the XCKU040-2SFVA784I?

The XCKU040-2SFVA784I is a high-performance mid-range FPGA from AMD/Xilinx, belonging to the Kintex® UltraScale™ family. Manufactured at 20nm process technology, this device delivers an exceptional balance of logic density, DSP performance, and power efficiency — making it a leading choice for demanding embedded applications in industrial, communications, and data processing markets.

If you are looking for a proven Xilinx FPGA platform that combines high signal processing bandwidth with cost-effective packaging, the XCKU040-2SFVA784I is a top contender in the mid-range segment.


XCKU040-2SFVA784I Key Features

The XCKU040-2SFVA784I stands out for several reasons:

  • UltraScale Architecture — AMD’s advanced monolithic architecture offering increased performance and on-chip UltraRAM to reduce BOM cost.
  • 20nm Process Technology — Delivers optimal performance-per-watt compared to older-generation FPGA families.
  • 530,250 Logic Cells — Sufficient density for complex multi-function designs without moving to a larger, more expensive device.
  • 784-Pin FC-BGA Package — Low-cost, compact footprint suitable for space-constrained PCB designs.
  • Industrial Temperature Grade (“I” suffix) — Rated for –40°C to 100°C junction temperature, enabling deployment in harsh environments.
  • Speed Grade -2 — A balanced mid-range speed grade offering strong performance at production-level availability.
  • Next-Generation Transceivers — High-speed serial I/O enabling PCIe, 10GbE, JESD204B, and other high-bandwidth protocols.

XCKU040-2SFVA784I Full Technical Specifications

General Specifications

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XCKU040-2SFVA784I
FPGA Family Kintex UltraScale
Process Technology 20nm
Speed Grade -2
Temperature Grade Industrial (I)
Operating Voltage (VCCINT) 0.922V – 0.979V (nominal 0.95V)
Package 784-Pin FC-BGA (BFBGA-784)
Package Size 23 × 23 mm
Mounting Type Surface Mount
RoHS Status Compliant
Packaging / Tray Tray

Logic & Memory Resources

Resource Quantity
Logic Cells 530,250
CLBs (Configurable Logic Blocks) 30,300
Total RAM Bits 21,606,000
User I/O 468

Electrical & Thermal Characteristics

Parameter Value
Supply Voltage (VCCINT) 0.922V – 0.979V
Nominal Core Voltage 0.95V
Operating Temperature (TJ) –40°C ~ 100°C
Mounting Surface Mount Technology (SMT)

Package & Physical Details

Parameter Value
Package Type FC-BGA (Flip-Chip Ball Grid Array)
Pin Count 784
Package Code SFVA784
Package Dimensions 23 × 23 mm
Supplier Device Package 784-FCCSPBGA

Part Number Breakdown: Decoding XCKU040-2SFVA784I

Understanding the Xilinx part number structure helps engineers quickly assess the device’s capabilities at a glance:

Segment Meaning
XC Xilinx Commercial/Industrial FPGA
KU Kintex UltraScale family
040 Device size (density tier within family)
-2 Speed grade (-3 fastest, -1 slowest; -2 = mid performance)
S Screened for production
FVA Package type code (FC-BGA)
784 Pin count
I Temperature grade: Industrial (–40°C to 100°C TJ)

XCKU040-2SFVA784I: Target Applications

The XCKU040-2SFVA784I is designed for a wide range of high-performance applications:

Wired Communications & Networking

High DSP-to-logic ratios and next-generation transceivers make this FPGA ideal for line-card processing, packet classification, and 10/40G Ethernet switching applications.

Industrial Automation & Control

The industrial temperature range (–40°C to 100°C TJ) makes the XCKU040-2SFVA784I well-suited for motor control, machine vision, real-time sensor fusion, and PLC acceleration.

Medical & Scientific Imaging

High logic density combined with UltraRAM enables real-time image processing pipelines, ultrasound beamforming, and CT reconstruction accelerators.

Data Center Acceleration

PCIe-connected FPGA cards leverage the XCKU040’s transceivers and DSP blocks for workload acceleration, database offload, and network function virtualization (NFV).

Defense & Aerospace (Industrial Grade)

The wide operating temperature range and high reliability of Kintex UltraScale devices supports ruggedized platforms where COTS industrial parts are acceptable.


XCKU040-2SFVA784I vs. Competing Kintex UltraScale Devices

Part Number Logic Cells I/O Pins Package Pins Speed Grade Temp Grade
XCKU025-2SFVA784I ~332,000 312 784 -2 Industrial
XCKU040-2SFVA784I 530,250 468 784 -2 Industrial
XCKU060-2SFVA784I ~725,400 468 784 -2 Industrial
XCKU085-2FLVA1517I ~1,045,440 832 1517 -2 Industrial

The XCKU040 occupies the sweet spot between the entry-level KU025 and the larger KU060 — offering 530K logic cells and 468 I/O in the same compact 784-pin package as its smaller sibling, at a substantially lower cost than the KU060.


Design Tools & Software Support

The XCKU040-2SFVA784I is fully supported by AMD’s Vivado Design Suite, the industry-standard toolchain for UltraScale family devices:

Tool Purpose
Vivado Design Suite Synthesis, implementation, timing analysis
Xilinx Power Estimator (XPE) Pre-silicon power budgeting
Vivado IP Integrator Block design, IP integration
ChipScope Pro / ILA On-chip debug and signal probing
PetaLinux Tools Embedded Linux for MicroBlaze soft-core

Minimum Vivado Version: The XCKU040 requires Vivado 2015.2 or later for production-level support, with the recommended minimum being Vivado 2016.4 for production speed specification v1.23.


Ordering & Availability Information

Attribute Detail
Manufacturer Part Number XCKU040-2SFVA784I
Manufacturer AMD / Xilinx
DigiKey Part Number 1455-1XCKU040-2SFVA784I-ND
Mouser Part Number Available — search XCKU040-2SFVA784I
Status Active / Production
Packaging Tray
Minimum Order Quantity 1 (varies by distributor)

Tip: For volume pricing and lead time confirmation on the XCKU040-2SFVA784I, always verify stock directly with an authorized AMD/Xilinx distributor such as DigiKey, Mouser, or Avnet.


Frequently Asked Questions (FAQ)

What is the difference between XCKU040-2SFVA784I and XCKU040-1SFVA784I?

The only difference is the speed grade. The -2 variant offers higher maximum operating frequencies compared to the -1 variant. Both share identical logic resources, package, and temperature rating.

Is XCKU040-2SFVA784I RoHS compliant?

Yes, the XCKU040-2SFVA784I carries RoHS compliance status, making it suitable for lead-free designs and products targeting the European market.

What is the core voltage for XCKU040-2SFVA784I?

The device operates with a VCCINT supply range of 0.922V to 0.979V, with a nominal voltage of 0.95V.

What programming file format does the XCKU040-2SFVA784I use?

The XCKU040-2SFVA784I uses AMD/Xilinx bitstream (.bit) files generated by Vivado, and can be configured via JTAG, SPI flash, or BPI flash interfaces.

Can XCKU040-2SFVA784I be used in automotive applications?

The standard “I” suffix denotes industrial-grade screening. For automotive applications, AMD offers separate AEC-Q100-qualified variants (typically “Q” or “XQ” prefix). Always verify the required qualification level for automotive designs.


Summary

The XCKU040-2SFVA784I is a proven, production-grade FPGA that delivers 530,250 logic cells, 21.6 million RAM bits, and 468 user I/Os in a compact 784-pin FC-BGA package, all within an industrial temperature envelope. Built on AMD’s 20nm UltraScale architecture, it provides the processing headroom, I/O flexibility, and long-term availability that demanding embedded applications require.

Whether you’re designing a data center acceleration card, an industrial vision system, or a high-throughput communications platform, the XCKU040-2SFVA784I offers a compelling combination of capability, power efficiency, and cost-effectiveness in the mid-range FPGA segment.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.