The XC2S200-6FGG1187C is a high-capacity, commercial-grade Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, a 1187-ball Fine-Pitch Ball Grid Array (FBGA) package, and a -6 speed grade, this device is engineered for demanding digital design applications where high I/O density and proven reliability are non-negotiable. Whether you are designing for telecommunications, industrial control, or high-performance computing, the XC2S200-6FGG1187C delivers the programmable logic resources you need.

For engineers looking to source or evaluate the broader Spartan-II product line, visit our comprehensive guide to Xilinx FPGA solutions.

What Is the XC2S200-6FGG1187C? An Overview

The XC2S200-6FGG1187C belongs to Xilinx’s Spartan-II FPGA family, one of the most widely adopted cost-effective programmable logic platforms built on 0.18 µm CMOS process technology. The device operates at a 2.5V core voltage and targets the commercial temperature range (0°C to +85°C), making it suitable for a broad range of end-use environments.

Decoding the Part Number

Understanding the part number helps engineers quickly identify the device’s key parameters:

XC2S200-6FGG1187C Key Specifications

Core Logic Resources

I/O and Package Information

Performance and Electrical

XC2S200-6FGG1187C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1187C is its array of 1,176 Configurable Logic Blocks arranged in a 28×42 grid. Each CLB contains:

• Four logic cells, each with a 4-input Look-Up Table (LUT) and a D-type flip-flop
• Dedicated fast carry logic for arithmetic operations
• Support for both synchronous and asynchronous set/reset
• Distributed RAM functionality (each LUT can act as 16×1 or 32×1 RAM)

Block RAM Modules

The XC2S200-6FGG1187C includes 14 block RAM modules, providing 56K bits of dedicated on-chip memory. These dual-port memories support:

• Configurable aspect ratios (16K×1, 8K×2, 4K×4, 2K×9, 1K×18)
• Simultaneous independent read and write operations
• First-In First-Out (FIFO) buffer implementations
• Look-up table and ROM applications

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops — positioned at each corner of the die — provide:

• Zero-delay clock buffering across the device
• Clock frequency synthesis and multiplication
• Phase-shifted clock generation
• Eliminates clock skew in high-speed designs

Input/Output Blocks (IOBs)

With up to 284 user-configurable I/O pins, the XC2S200-6FGG1187C supports a wide range of interface standards in independently configurable voltage banks, including PCI (3.3V), LVTTL, LVCMOS, GTL/GTL+, HSTL, SSTL-2, SSTL-3, and AGP.

XC2S200-6FGG1187C vs. Other XC2S200 Package Variants

Engineers often need to compare the FGG1187 package against other available options for the same die. The table below provides a direct comparison:

Note: The FGG1187 package provides the highest available I/O density for the XC2S200 die, making it the preferred choice for designs requiring maximum pin-out flexibility.

Spartan-II Family Comparison: Where Does XC2S200 Fit?

The XC2S200 is the largest device in the Spartan-II family, offering the highest logic density, I/O count, and embedded memory capacity of any device in the series.

Supported Configuration Modes

The XC2S200-6FGG1187C supports multiple configuration methods to accommodate diverse system architectures:

Typical Application Areas for XC2S200-6FGG1187C

#### Telecommunications & Networking

The device’s high I/O count (284 user pins) and fast -6 speed grade make it well-suited for protocol processing, line card logic, and signal routing in telecom infrastructure equipment.

#### Industrial Automation & Control

The XC2S200-6FGG1187C’s reconfigurability allows engineers to update control logic in the field without hardware replacement — a major advantage over mask-programmed ASICs in industrial machinery and process control systems.

#### High-Speed Data Acquisition

With 263 MHz maximum clock rates and on-chip DLLs for precise clock management, the device suits ADC/DAC interface logic, data buffering, and real-time digital signal processing pipelines.

#### Embedded Processing Systems

The 1,176 CLBs combined with 56K bits of block RAM enable full soft-processor implementations (MicroBlaze, PicoBlaze) alongside peripheral I/O controllers in a single device.

#### Prototyping and ASIC Replacement

Spartan-II FPGAs are a well-established platform for ASIC prototyping and bridge production runs, eliminating NRE costs and enabling faster time-to-market.

Design Tools and Software Support

The XC2S200-6FGG1187C is fully supported by Xilinx ISE Design Suite (legacy), which includes:

• XST (Xilinx Synthesis Technology) for HDL synthesis
• ISE Simulator for functional and timing simulation
• PACE / PlanAhead for pin assignment and floorplanning
• BitGen for bitstream generation and configuration file creation
• iMPACT for JTAG-based device programming and configuration

Ordering and Availability Information

Part Number Breakdown Reference

XC2S200 - 6 - FGG - 1187 - C
  │         │    │     │     └── Temperature: C = Commercial (0°C to +85°C)
  │         │    │     └──────── Pin Count: 1187 balls
  │         │    └────────────── Package: FGG = Fine-Pitch BGA (Pb-free)
  │         └─────────────────── Speed Grade: -6 (fastest)
  └───────────────────────────── Device: Spartan-II 200K gates

Key Purchasing Considerations

Frequently Asked Questions (FAQ)

Q: What is the difference between XC2S200-6FGG1187C and XC2S200-6FGG456C? Both use the same Spartan-II XC2S200 die and -6 speed grade, but the 1187-ball package provides additional routing channels and PCB design flexibility with the same maximum 284 user I/O. The FGG1187 is preferred when board layout requires distributed pin placement or thermal spreading.

Q: Is the -6 speed grade available in industrial temperature range? No. The -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C). Industrial temperature range (-40°C to +100°C) devices are available only in the -5 speed grade and below.

Q: Can I replace an XC2S200-6FGG1187C with a Spartan-3 device? The Spartan-3 family is the direct successor with improved density and performance, but it uses a 1.2V core and different configuration sequences, requiring hardware and firmware changes. A direct drop-in replacement within the same form factor is not possible.

Q: What HDL languages are supported for design entry? The XC2S200-6FGG1187C supports both VHDL and Verilog HDL through Xilinx ISE, as well as schematic-based entry.

Summary: Why Choose the XC2S200-6FGG1187C?

The XC2S200-6FGG1187C stands out as the top-tier configuration of the Spartan-II XC2S200 die, combining:

• ✅ 200,000 system gates — the largest device in the Spartan-II series
• ✅ 1,187-ball FGG package — maximum I/O routing flexibility
• ✅ -6 speed grade — fastest commercially rated performance up to 263 MHz
• ✅ Pb-free construction — RoHS-compliant for global regulatory compliance
• ✅ 56K bits block RAM + 75K bits distributed RAM — substantial on-chip memory
• ✅ 4 on-chip DLLs — precise, zero-skew clock management
• ✅ JTAG boundary scan — simplified board-level testing and programming

For engineers and procurement teams sourcing Spartan-II or evaluating the full range of programmable logic options from Xilinx, explore our complete Xilinx FPGA catalog for pricing, availability, and technical documentation.