Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1186C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1186C is a high-density Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a large 1,186-ball Fine-Pitch BGA (FBGA) package, this device delivers robust programmable logic performance for commercial-grade applications. Whether you’re designing communications equipment, industrial control systems, or high-speed digital processing boards, the XC2S200-6FGG1186C offers a proven, cost-effective alternative to mask-programmed ASICs.

For a broader selection of compatible devices, explore our full range of Xilinx FPGA solutions.


What Is the XC2S200-6FGG1186C? Understanding the Part Number

Before diving into specifications, it helps to decode the part number. Each segment of XC2S200-6FGG1186C carries critical ordering information:

Segment Meaning
XC Xilinx product prefix
2S Spartan-II FPGA family
200 200,000 system gates (device density)
-6 Speed grade (fastest available: -6)
FGG Pb-Free Fine-Pitch Ball Grid Array package
1186 Number of package pins/balls
C Commercial temperature range (0°C to +85°C)

The -6 speed grade is the fastest offered for the Spartan-II family and is exclusively available in the commercial temperature range. The “G” in FGG confirms this is a Pb-free (RoHS-compliant) package variant.


XC2S200-6FGG1186C Key Specifications at a Glance

Core Logic & Memory Resources

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array (Rows × Columns) 28 × 42
Total CLBs 1,176
Maximum User I/O Pins 284
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Delay-Locked Loops (DLLs) 4

Electrical & Process Characteristics

Parameter Value
Core Supply Voltage 2.5V
Process Technology 0.18 µm (180nm)
Max System Clock Frequency 263 MHz
I/O Standards Supported LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL
Configuration Bits 1,335,840

Package & Ordering Information

Parameter Value
Package Type FGG (Fine-Pitch Ball Grid Array, Pb-Free)
Number of Balls 1,186
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Yes (Pb-Free “G” designation)
Speed Grade -6 (fastest available)

XC2S200-6FGG1186C Architecture Overview

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1186C is its 1,176 Configurable Logic Blocks arranged in a 28×42 grid. Each CLB contains:

  • Four logic-function generators (LUTs): Each LUT can implement any 4-input Boolean function, serve as 16-bit shift register, or operate as a 16×1-bit synchronous RAM.
  • Flip-flops and latches: Each CLB includes storage elements that support both edge-triggered D flip-flops and level-sensitive latches.
  • Fast carry logic: Dedicated carry chains enable efficient implementation of arithmetic circuits such as adders, accumulators, and counters.
  • Wide-function multiplexers: Internal muxes allow the CLB to implement functions of up to 9 inputs, improving logic density.

Block RAM

The XC2S200-6FGG1186C integrates 56K bits of dual-port block RAM organized in two columns on opposite sides of the die. Each block RAM is 4K bits in size and can be configured in multiple aspect ratios (4K×1, 2K×2, 1K×4, 512×8, or 256×16 bits), making it ideal for FIFOs, line buffers, lookup tables, and data caches.

Input/Output Blocks (IOBs)

The device provides up to 284 user-configurable I/O pins, each backed by a full-featured IOB that supports:

Supported I/O Standards

I/O Standard Type
LVTTL Single-ended
LVCMOS 3.3V / 2.5V / 1.8V Single-ended
PCI (3.3V, 33/66 MHz) Single-ended
GTL / GTL+ Single-ended
HSTL Class I / II / III / IV Single-ended
SSTL2 Class I / II Single-ended
SSTL3 Class I / II Single-ended

Each IOB includes optional programmable pull-up/pull-down resistors, a slew-rate controller, and input delay elements for timing-critical interfaces.

Delay-Locked Loops (DLLs)

Four DLLs — one at each corner of the die — deliver:

  • Clock deskew: Eliminates clock distribution delay across the device.
  • Frequency synthesis: Multiply or divide input clock frequencies.
  • Phase shifting: Generate phase-shifted clock outputs (0°, 90°, 180°, 270°).

This makes the XC2S200-6FGG1186C well-suited for designs requiring precise, multi-phase clocking without external PLL components.


Configuration Modes for the XC2S200-6FGG1186C

The Spartan-II FPGA supports multiple configuration methods to suit various system architectures:

Configuration Mode CCLK Direction Data Width DOUT Support
Master Serial Output (from FPGA) 1-bit Yes
Slave Serial Input (to FPGA) 1-bit Yes
Slave Parallel Input (to FPGA) 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

During power-on and throughout configuration, all I/O drivers remain in a high-impedance state, protecting connected circuitry. Configuration data can be stored in Xilinx Platform Flash PROMs, standard serial EEPROMs, or loaded from a microprocessor.


XC2S200-6FGG1186C vs. Other XC2S200 Package Variants

The XC2S200 die is available in multiple packages. Understanding the differences helps you select the right variant for your PCB layout and I/O requirements:

Part Number Package Balls/Pins Pb-Free User I/O Speed Grade
XC2S200-6FGG1186C FBGA 1,186 Yes 284 -6
XC2S200-6FGG456C FBGA 456 Yes 284 -6
XC2S200-6FG456C FBGA 456 No 284 -6
XC2S200-6FGG256C FBGA 256 Yes 176 -6
XC2S200-6PQG208C PQFP 208 Yes 140 -6
XC2S200-5FGG456C FBGA 456 Yes 284 -5

The FGG1186 package provides the maximum I/O density and is designed for applications requiring a large number of simultaneous signal connections on high-density PCB designs.


Typical Applications of the XC2S200-6FGG1186C

Communications & Networking

The combination of 263 MHz clock performance, 284 user I/O pins, and robust multi-standard I/O support makes this FPGA ideal for:

  • Protocol bridging (e.g., PCI to custom interfaces)
  • Network line cards and packet processing
  • High-speed serial data framing and serialization

Industrial Automation & Motor Control

The XC2S200-6FGG1186C’s reconfigurability and reliable commercial-grade performance are well-suited for:

  • Servo and stepper motor control
  • Real-time process monitoring
  • Programmable logic controller (PLC) replacement designs

Medical & Diagnostic Equipment

Its high logic capacity and flexible I/O support applications such as:

  • Medical imaging signal processing
  • Diagnostic equipment front-end interfaces
  • Patient monitoring systems requiring high channel counts

Test & Measurement

Engineers use this FPGA for:

  • Logic analyzers and signal generators
  • Automated test equipment (ATE) interfaces
  • High-speed data acquisition systems

Embedded Processing & Co-Processing

With 5,292 logic cells and distributed RAM resources, the device can implement:

  • Soft-core processor architectures (e.g., PicoBlaze)
  • Custom DSP pipelines
  • Hardware accelerators alongside microcontrollers

Why Choose the XC2S200-6FGG1186C Over an ASIC?

The Spartan-II family was designed as a direct alternative to mask-programmed ASICs, offering several practical advantages:

Factor ASIC XC2S200-6FGG1186C
Non-Recurring Engineering (NRE) Cost High (tooling fees) None
Time to Market Months Days/Weeks
Field Upgradability Not possible Yes (reconfigurable)
Minimum Order Quantity Often high Flexible
Design Risk High (re-spin costly) Low (reprogrammable)

This makes the XC2S200-6FGG1186C particularly attractive for low-to-medium volume production, prototyping, and any application where design revisions in the field may be required.


Development Tools & Software Support

Xilinx (now AMD) supports the Spartan-II family through its legacy design toolchain:

  • ISE Design Suite: The primary tool for Spartan-II synthesis, place and route, timing analysis, and bitstream generation. ISE 14.7 is the final version and supports Windows and Linux.
  • CORE Generator: Instantiate pre-verified IP cores (memory controllers, FIFOs, DSP blocks) to accelerate development.
  • iMPACT: Programming and configuration tool for downloading bitstreams via JTAG or PROM.
  • ModelSim / ISE Simulator: RTL and gate-level simulation for functional and timing verification.

Hardware description languages supported include VHDL, Verilog, and schematic entry.


Ordering & Availability Information

When sourcing the XC2S200-6FGG1186C, verify the following to ensure authenticity and compliance:

  • Manufacturer: Xilinx, Inc. (now AMD Xilinx)
  • Full Part Number: XC2S200-6FGG1186C
  • RoHS Status: Compliant (Pb-Free “G” package)
  • Temperature Grade: Commercial (0°C to +85°C)
  • Recommended Distributors: Authorized distributors or reputable component specialists with traceable supply chains

⚠️ Counterfeit Warning: Due to its legacy status, the XC2S200-6FGG1186C is sometimes counterfeited in the open market. Always purchase from authorized or reputable distributors and request test/inspection documentation when sourcing from independent channels.


Frequently Asked Questions (FAQ)

Q: What is the maximum operating frequency of the XC2S200-6FGG1186C? The -6 speed grade supports system clock frequencies up to 263 MHz, making it the fastest variant in the Spartan-II family.

Q: Is the XC2S200-6FGG1186C RoHS compliant? Yes. The “G” in the package designator (FGG) confirms it is a Pb-free, RoHS-compliant package.

Q: What is the difference between FGG1186 and FGG456 packages? Both use the same XC2S200 die and offer 284 user I/O pins. The FGG1186 has a larger ball array with 1,186 total balls, allowing for more relaxed PCB design rules and improved signal routing in dense multilayer boards.

Q: Can the XC2S200-6FGG1186C be programmed using JTAG? Yes. Boundary-Scan (JTAG) configuration mode is fully supported, enabling in-circuit programming without a dedicated PROM.

Q: What tools are needed to design with this FPGA? Xilinx ISE Design Suite (version 14.7 recommended) is the primary design environment. It is available as a free WebPACK license for Spartan-II devices.

Q: Is the XC2S200-6FGG1186C suitable for new designs in 2025? While the Spartan-II family is mature, it remains a valid choice for legacy system maintenance, industrial replacement boards, and designs that specifically require a proven 2.5V FPGA platform. For new designs, Xilinx recommends evaluating the Spartan-7 or Artix-7 families.


Summary: XC2S200-6FGG1186C Complete Specifications Table

Specification Value
Manufacturer Xilinx (AMD)
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 CLBs)
Distributed RAM 75,264 bits
Block RAM 56,000 bits
User I/O 284 (max)
DLLs 4
Max Clock Frequency 263 MHz
Core Voltage 2.5V
Process Node 0.18 µm
Package FGG1186 (Fine-Pitch BGA, Pb-Free)
Pin Count 1,186 balls
Temperature Range Commercial (0°C to +85°C)
Speed Grade -6 (fastest)
Configuration Bits 1,335,840
RoHS Compliant Yes
Design Tools Xilinx ISE 14.7
HDL Support VHDL, Verilog

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.