The XC2S200-6FGG1186C is a high-density Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a large 1,186-ball Fine-Pitch BGA (FBGA) package, this device delivers robust programmable logic performance for commercial-grade applications. Whether you’re designing communications equipment, industrial control systems, or high-speed digital processing boards, the XC2S200-6FGG1186C offers a proven, cost-effective alternative to mask-programmed ASICs.
For a broader selection of compatible devices, explore our full range of Xilinx FPGA solutions.
What Is the XC2S200-6FGG1186C? Understanding the Part Number
Before diving into specifications, it helps to decode the part number. Each segment of XC2S200-6FGG1186C carries critical ordering information:
| Segment |
Meaning |
| XC |
Xilinx product prefix |
| 2S |
Spartan-II FPGA family |
| 200 |
200,000 system gates (device density) |
| -6 |
Speed grade (fastest available: -6) |
| FGG |
Pb-Free Fine-Pitch Ball Grid Array package |
| 1186 |
Number of package pins/balls |
| C |
Commercial temperature range (0°C to +85°C) |
The -6 speed grade is the fastest offered for the Spartan-II family and is exclusively available in the commercial temperature range. The “G” in FGG confirms this is a Pb-free (RoHS-compliant) package variant.
XC2S200-6FGG1186C Key Specifications at a Glance
Core Logic & Memory Resources
| Parameter |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array (Rows × Columns) |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O Pins |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Delay-Locked Loops (DLLs) |
4 |
Electrical & Process Characteristics
| Parameter |
Value |
| Core Supply Voltage |
2.5V |
| Process Technology |
0.18 µm (180nm) |
| Max System Clock Frequency |
263 MHz |
| I/O Standards Supported |
LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL |
| Configuration Bits |
1,335,840 |
Package & Ordering Information
| Parameter |
Value |
| Package Type |
FGG (Fine-Pitch Ball Grid Array, Pb-Free) |
| Number of Balls |
1,186 |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Yes (Pb-Free “G” designation) |
| Speed Grade |
-6 (fastest available) |
XC2S200-6FGG1186C Architecture Overview
Configurable Logic Blocks (CLBs)
The heart of the XC2S200-6FGG1186C is its 1,176 Configurable Logic Blocks arranged in a 28×42 grid. Each CLB contains:
- Four logic-function generators (LUTs): Each LUT can implement any 4-input Boolean function, serve as 16-bit shift register, or operate as a 16×1-bit synchronous RAM.
- Flip-flops and latches: Each CLB includes storage elements that support both edge-triggered D flip-flops and level-sensitive latches.
- Fast carry logic: Dedicated carry chains enable efficient implementation of arithmetic circuits such as adders, accumulators, and counters.
- Wide-function multiplexers: Internal muxes allow the CLB to implement functions of up to 9 inputs, improving logic density.
Block RAM
The XC2S200-6FGG1186C integrates 56K bits of dual-port block RAM organized in two columns on opposite sides of the die. Each block RAM is 4K bits in size and can be configured in multiple aspect ratios (4K×1, 2K×2, 1K×4, 512×8, or 256×16 bits), making it ideal for FIFOs, line buffers, lookup tables, and data caches.
Input/Output Blocks (IOBs)
The device provides up to 284 user-configurable I/O pins, each backed by a full-featured IOB that supports:
Supported I/O Standards
| I/O Standard |
Type |
| LVTTL |
Single-ended |
| LVCMOS 3.3V / 2.5V / 1.8V |
Single-ended |
| PCI (3.3V, 33/66 MHz) |
Single-ended |
| GTL / GTL+ |
Single-ended |
| HSTL Class I / II / III / IV |
Single-ended |
| SSTL2 Class I / II |
Single-ended |
| SSTL3 Class I / II |
Single-ended |
Each IOB includes optional programmable pull-up/pull-down resistors, a slew-rate controller, and input delay elements for timing-critical interfaces.
Delay-Locked Loops (DLLs)
Four DLLs — one at each corner of the die — deliver:
- Clock deskew: Eliminates clock distribution delay across the device.
- Frequency synthesis: Multiply or divide input clock frequencies.
- Phase shifting: Generate phase-shifted clock outputs (0°, 90°, 180°, 270°).
This makes the XC2S200-6FGG1186C well-suited for designs requiring precise, multi-phase clocking without external PLL components.
Configuration Modes for the XC2S200-6FGG1186C
The Spartan-II FPGA supports multiple configuration methods to suit various system architectures:
| Configuration Mode |
CCLK Direction |
Data Width |
DOUT Support |
| Master Serial |
Output (from FPGA) |
1-bit |
Yes |
| Slave Serial |
Input (to FPGA) |
1-bit |
Yes |
| Slave Parallel |
Input (to FPGA) |
8-bit |
No |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
No |
During power-on and throughout configuration, all I/O drivers remain in a high-impedance state, protecting connected circuitry. Configuration data can be stored in Xilinx Platform Flash PROMs, standard serial EEPROMs, or loaded from a microprocessor.
XC2S200-6FGG1186C vs. Other XC2S200 Package Variants
The XC2S200 die is available in multiple packages. Understanding the differences helps you select the right variant for your PCB layout and I/O requirements:
| Part Number |
Package |
Balls/Pins |
Pb-Free |
User I/O |
Speed Grade |
| XC2S200-6FGG1186C |
FBGA |
1,186 |
Yes |
284 |
-6 |
| XC2S200-6FGG456C |
FBGA |
456 |
Yes |
284 |
-6 |
| XC2S200-6FG456C |
FBGA |
456 |
No |
284 |
-6 |
| XC2S200-6FGG256C |
FBGA |
256 |
Yes |
176 |
-6 |
| XC2S200-6PQG208C |
PQFP |
208 |
Yes |
140 |
-6 |
| XC2S200-5FGG456C |
FBGA |
456 |
Yes |
284 |
-5 |
The FGG1186 package provides the maximum I/O density and is designed for applications requiring a large number of simultaneous signal connections on high-density PCB designs.
Typical Applications of the XC2S200-6FGG1186C
Communications & Networking
The combination of 263 MHz clock performance, 284 user I/O pins, and robust multi-standard I/O support makes this FPGA ideal for:
- Protocol bridging (e.g., PCI to custom interfaces)
- Network line cards and packet processing
- High-speed serial data framing and serialization
Industrial Automation & Motor Control
The XC2S200-6FGG1186C’s reconfigurability and reliable commercial-grade performance are well-suited for:
- Servo and stepper motor control
- Real-time process monitoring
- Programmable logic controller (PLC) replacement designs
Medical & Diagnostic Equipment
Its high logic capacity and flexible I/O support applications such as:
- Medical imaging signal processing
- Diagnostic equipment front-end interfaces
- Patient monitoring systems requiring high channel counts
Test & Measurement
Engineers use this FPGA for:
- Logic analyzers and signal generators
- Automated test equipment (ATE) interfaces
- High-speed data acquisition systems
Embedded Processing & Co-Processing
With 5,292 logic cells and distributed RAM resources, the device can implement:
- Soft-core processor architectures (e.g., PicoBlaze)
- Custom DSP pipelines
- Hardware accelerators alongside microcontrollers
Why Choose the XC2S200-6FGG1186C Over an ASIC?
The Spartan-II family was designed as a direct alternative to mask-programmed ASICs, offering several practical advantages:
| Factor |
ASIC |
XC2S200-6FGG1186C |
| Non-Recurring Engineering (NRE) Cost |
High (tooling fees) |
None |
| Time to Market |
Months |
Days/Weeks |
| Field Upgradability |
Not possible |
Yes (reconfigurable) |
| Minimum Order Quantity |
Often high |
Flexible |
| Design Risk |
High (re-spin costly) |
Low (reprogrammable) |
This makes the XC2S200-6FGG1186C particularly attractive for low-to-medium volume production, prototyping, and any application where design revisions in the field may be required.
Development Tools & Software Support
Xilinx (now AMD) supports the Spartan-II family through its legacy design toolchain:
- ISE Design Suite: The primary tool for Spartan-II synthesis, place and route, timing analysis, and bitstream generation. ISE 14.7 is the final version and supports Windows and Linux.
- CORE Generator: Instantiate pre-verified IP cores (memory controllers, FIFOs, DSP blocks) to accelerate development.
- iMPACT: Programming and configuration tool for downloading bitstreams via JTAG or PROM.
- ModelSim / ISE Simulator: RTL and gate-level simulation for functional and timing verification.
Hardware description languages supported include VHDL, Verilog, and schematic entry.
Ordering & Availability Information
When sourcing the XC2S200-6FGG1186C, verify the following to ensure authenticity and compliance:
- Manufacturer: Xilinx, Inc. (now AMD Xilinx)
- Full Part Number: XC2S200-6FGG1186C
- RoHS Status: Compliant (Pb-Free “G” package)
- Temperature Grade: Commercial (0°C to +85°C)
- Recommended Distributors: Authorized distributors or reputable component specialists with traceable supply chains
⚠️ Counterfeit Warning: Due to its legacy status, the XC2S200-6FGG1186C is sometimes counterfeited in the open market. Always purchase from authorized or reputable distributors and request test/inspection documentation when sourcing from independent channels.
Frequently Asked Questions (FAQ)
Q: What is the maximum operating frequency of the XC2S200-6FGG1186C? The -6 speed grade supports system clock frequencies up to 263 MHz, making it the fastest variant in the Spartan-II family.
Q: Is the XC2S200-6FGG1186C RoHS compliant? Yes. The “G” in the package designator (FGG) confirms it is a Pb-free, RoHS-compliant package.
Q: What is the difference between FGG1186 and FGG456 packages? Both use the same XC2S200 die and offer 284 user I/O pins. The FGG1186 has a larger ball array with 1,186 total balls, allowing for more relaxed PCB design rules and improved signal routing in dense multilayer boards.
Q: Can the XC2S200-6FGG1186C be programmed using JTAG? Yes. Boundary-Scan (JTAG) configuration mode is fully supported, enabling in-circuit programming without a dedicated PROM.
Q: What tools are needed to design with this FPGA? Xilinx ISE Design Suite (version 14.7 recommended) is the primary design environment. It is available as a free WebPACK license for Spartan-II devices.
Q: Is the XC2S200-6FGG1186C suitable for new designs in 2025? While the Spartan-II family is mature, it remains a valid choice for legacy system maintenance, industrial replacement boards, and designs that specifically require a proven 2.5V FPGA platform. For new designs, Xilinx recommends evaluating the Spartan-7 or Artix-7 families.
Summary: XC2S200-6FGG1186C Complete Specifications Table
| Specification |
Value |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56,000 bits |
| User I/O |
284 (max) |
| DLLs |
4 |
| Max Clock Frequency |
263 MHz |
| Core Voltage |
2.5V |
| Process Node |
0.18 µm |
| Package |
FGG1186 (Fine-Pitch BGA, Pb-Free) |
| Pin Count |
1,186 balls |
| Temperature Range |
Commercial (0°C to +85°C) |
| Speed Grade |
-6 (fastest) |
| Configuration Bits |
1,335,840 |
| RoHS Compliant |
Yes |
| Design Tools |
Xilinx ISE 14.7 |
| HDL Support |
VHDL, Verilog |