Meta Description: The XC2S200-6FGG1182C is a Xilinx Spartan-II FPGA featuring 200K system gates, 5,292 logic cells, and a 1182-ball Pb-free BGA package. Read full specs, pinout details, and applications.

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What Is the XC2S200-6FGG1182C?

The XC2S200-6FGG1182C is a high-performance Field-Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD) as part of the Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and operates at up to 200 MHz — all within a compact 2.5V power envelope using proven 0.18µm process technology.

Whether you are designing embedded systems, communications hardware, or industrial control equipment, the XC2S200-6FGG1182C offers a compelling balance of logic density, I/O flexibility, and programmability. Its 1182-ball Fine-Pitch BGA (FGG1182) Pb-free package makes it ideal for space-constrained PCB layouts that demand high pin counts and RoHS compliance.

For engineers sourcing Xilinx programmable logic solutions, explore the full range at Xilinx FPGA.

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XC2S200-6FGG1182C Part Number Decode

Understanding the part number helps engineers quickly identify key parameters before diving into the datasheet.

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XC2S200-6FGG1182C Key Specifications

General Electrical Specifications

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Package & Physical Specifications

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XC2S200-6FGG1182C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1182C is built around 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains four logic cells, with every logic cell consisting of:

• A 4-input Look-Up Table (LUT) for combinational logic
• A D-type flip-flop for sequential logic
• Fast carry chain logic for efficient arithmetic operations

This structure allows engineers to implement complex Boolean functions, counters, state machines, and DSP-like operations directly in fabric.

Block RAM (BRAM) Architecture

The device provides 56K bits of on-chip block RAM, organized into dedicated dual-port SRAM blocks located on opposing sides of the die. Block RAM in the XC2S200-6FGG1182C supports:

• True dual-port operation — simultaneous read/write from two independent ports
• Configurable width and depth configurations
• Use as FIFOs, data buffers, or lookup tables

Distributed RAM Capabilities

Beyond block RAM, the 75,264 bits of distributed RAM embedded within CLB LUTs provides fast, low-latency storage that integrates tightly with combinational logic — ideal for small FIFOs, shift registers, and local data caching.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (one per corner of the die) enable precise clock management, including:

• Clock deskewing and phase alignment
• Frequency synthesis (multiply/divide)
• Clock domain crossing support

Input/Output Blocks (IOBs)

The 284 maximum user I/O pins in the XC2S200-6FGG1182C are fully configurable and support multiple I/O standards:

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XC2S200-6FGG1182C vs Other Spartan-II Family Members

The table below positions the XC2S200 within the full Spartan-II lineup so engineers can evaluate whether this device offers the right logic density for their design:

The XC2S200 is the highest-density device in the Spartan-II family, offering the maximum logic resources, I/O count, and RAM capacity available in this generation.

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XC2S200-6FGG1182C Speed Grade Comparison

The -6 speed grade designates the fastest performance tier in the Spartan-II family. Importantly, the -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C), making it best suited for non-industrial environments requiring maximum clock performance.

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Applications of the XC2S200-6FGG1182C

The combination of 200K system gates, abundant I/O, and a high-pin-count Pb-free BGA package makes the XC2S200-6FGG1182C a strong fit across a broad set of industries and use cases:

#### Communications & Networking

Protocol bridging, line card logic, data serialization/deserialization (SERDES emulation), and packet processing at the edge.

#### Embedded Systems & SoC Prototyping

Acting as a co-processor or peripheral controller alongside microprocessors (ARM, RISC-V, x86 embedded) for custom logic offloading.

#### Industrial Control Systems

Motor controllers, PLCs, sensor fusion, and timing-critical automation logic where glue logic would otherwise require multiple discrete ICs.

#### Consumer Electronics

Set-top boxes, display controllers, audio/video processing pipelines, and interface bridging between legacy and modern buses.

#### Test & Measurement Equipment

Pattern generators, logic analyzers, signal conditioning, and instrument-grade timing circuits.

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Design Tools & Programming Support

The XC2S200-6FGG1182C is supported by Xilinx ISE Design Suite (the primary development environment for Spartan-II devices). Key design flow steps include:

1. RTL Design — VHDL or Verilog HDL entry
2. Synthesis — via XST (Xilinx Synthesis Technology) or third-party tools (Synplify, Precision)
3. Implementation — map, place-and-route within ISE
4. Configuration — bitstream generation via JTAG, Slave Serial, Master Serial, or Peripheral mode using Xilinx PROMs

Note: Vivado Design Suite does not support Spartan-II devices. ISE 14.7 is the recommended final version for XC2S200 designs.

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XC2S200-6FGG1182C Configuration & Programming Modes

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Ordering Information & Part Variants

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Frequently Asked Questions About the XC2S200-6FGG1182C

What does the “6” speed grade mean in XC2S200-6FGG1182C?

The -6 speed grade indicates the fastest timing performance available within the Spartan-II XC2S200 family. It is only available in the commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1182C RoHS compliant / Pb-free?

Yes. The double “G” in FGG1182 denotes that this part uses a Pb-free (lead-free) package, making it RoHS compliant and suitable for environmentally regulated applications.

What is the maximum I/O count of the XC2S200-6FGG1182C?

The XC2S200 supports up to 284 maximum user I/O pins. Note that the four global clock/user input pins are not counted in this figure.

What design software should I use for the XC2S200-6FGG1182C?

Use Xilinx ISE Design Suite 14.7, as Vivado does not support legacy Spartan-II devices. ISE supports VHDL, Verilog, and schematic-based design entry.

What is the core supply voltage for the XC2S200-6FGG1182C?

The device operates at a 2.5V core supply voltage (VCCINT). I/O banks support 2.5V and 3.3V signaling levels depending on VCCO configuration.

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Conclusion: Is the XC2S200-6FGG1182C Right for Your Design?

The XC2S200-6FGG1182C remains one of the most capable devices in the Spartan-II generation, offering the largest logic capacity in the family paired with the fastest commercial speed grade and a high-density Pb-free BGA footprint. While it is not recommended for new designs (as Xilinx has moved to newer families like Spartan-6, Artix-7, and beyond), it continues to serve engineers in legacy system maintenance, production continuity, and retrofit applications.

For engineers evaluating programmable logic options across multiple Xilinx families and generations, explore a curated selection at Xilinx FPGA.