The XC2S200-6FGG1181C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, offering 200,000 system gates, 5,292 logic cells, and an ultra-fast -6 speed grade in a lead-free 1181-ball Fine Pitch Ball Grid Array (FGG1181) package. Designed for commercial-temperature applications, this device delivers the reprogrammable logic density and I/O flexibility that engineers need for communications, signal processing, industrial control, and embedded systems design.
Whether you’re sourcing the XC2S200-6FGG1181C for a new PCB design, replacement, or legacy system maintenance, this guide covers every specification, feature, and application detail you need to make an informed purchasing decision.
What Is the XC2S200-6FGG1181C? – Part Number Breakdown
Understanding the Xilinx part numbering convention helps decode exactly what this device offers:
| Part Number Segment |
Meaning |
| XC2S200 |
Xilinx Spartan-II family, 200K system gates |
| -6 |
Speed grade -6 (fastest available; Commercial range only) |
| FGG |
Fine Pitch Ball Grid Array, Pb-free (lead-free “G” suffix) |
| 1181 |
1181 solder ball count |
| C |
Commercial temperature range: 0°C to +85°C |
Key takeaway: The “-6” speed grade is exclusively available in the Commercial temperature range, making the XC2S200-6FGG1181C the fastest and highest-pin-count variant in the XC2S200 lineup.
XC2S200-6FGG1181C Key Specifications at a Glance
Core Device Specifications
| Parameter |
Value |
| Manufacturer |
Xilinx (now AMD) |
| Product Family |
Spartan-II FPGA |
| Part Number |
XC2S200-6FGG1181C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Technology Node |
0.18 µm CMOS |
| Core Supply Voltage |
2.5V |
| Maximum System Frequency |
263 MHz |
| Speed Grade |
-6 (Fastest) |
Package & Physical Specifications
| Parameter |
Value |
| Package Type |
Fine Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG1181 |
| Ball Count |
1,181 |
| Lead (Pb) Free |
Yes (RoHS-compliant Pb-free packaging) |
| Temperature Range |
Commercial: 0°C to +85°C |
| Mounting Type |
Surface Mount Technology (SMT) |
Spartan-II Family Comparison – Where XC2S200 Ranks
The XC2S200 is the largest device in the Spartan-II family, offering the most gates, CLBs, and block RAM of any device in the series.
| Device |
Logic Cells |
System Gates |
CLB Array |
Total CLBs |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
96 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
216 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
384 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
600 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
864 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
1,176 |
284 |
75,264 bits |
56K |
The XC2S200 is clearly the top-tier choice when your design demands maximum logic density, the most available I/O pins, and the largest on-chip memory within the Spartan-II portfolio.
XC2S200-6FGG1181C Architecture & Internal Features
Configurable Logic Blocks (CLBs)
The heart of the XC2S200 is its array of 1,176 CLBs arranged in a 28 × 42 matrix. Each CLB contains:
- Two Slices, each holding two 4-input Look-Up Tables (LUTs) and two flip-flops
- Dedicated fast carry logic for arithmetic operations
- Wide-function multiplexers for combining logic across slices
- Support for distributed RAM mode – LUTs can be configured as 16×1 synchronous RAM
Input/Output Blocks (IOBs)
The XC2S200-6FGG1181C supports up to 284 user I/O pins, each served by a fully programmable IOB featuring:
- Multi-voltage I/O standards: LVTTL, LVCMOS2, LVCMOS18, SSTL2, SSTL3, GTL, GTL+, HSTL, CTT, AGP
- Programmable pull-up, pull-down, and keeper circuitry
- Slew-rate control (fast and slow modes)
- Input delay to eliminate hold-time issues
- Optional output inversion
Block RAM
The XC2S200 includes 56K bits of dedicated dual-port block RAM, organized in two columns along the device perimeter. Each block RAM can be independently configured for:
- True dual-port operation
- Asymmetric read/write widths
- Optional output register pipeline
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs), one at each corner of the die, provide:
- Clock deskew to eliminate clock distribution delays
- Frequency synthesis (2×, 1.5×, divide modes)
- Phase-shifted clock outputs (0°, 90°, 180°, 270°)
- Jitter reduction for high-frequency clock domains
Speed Grade -6 Performance – XC2S200 Timing Parameters
The -6 speed grade is the fastest offered for the XC2S200 and is reserved exclusively for Commercial temperature range devices. Here is a summary of critical timing parameters:
| Timing Parameter |
Value (Speed Grade -6) |
| Maximum System Frequency |
263 MHz |
| CLB-to-CLB Logic Delay |
Fastest in the Spartan-II family |
| Setup Time (tSU) |
Minimized for high-speed synchronous designs |
| Clock-to-Output (tCO) |
Optimized for low-latency interfaces |
| DLL Lock Time |
Fast power-up lock acquisition |
For designs operating at maximum throughput, always select the -6 speed grade to minimize routing delays and maximize operational frequency margins.
XC2S200-6FGG1181C Applications & Use Cases
The XC2S200-6FGG1181C’s combination of 200K gates, 284 I/O pins, and 263 MHz performance makes it an excellent fit across a broad range of industries:
#### Communications & Networking
- High-speed data path processing in routers and switches
- SONET/SDH framer and mapper logic
- Wireless base station signal processing
- Protocol conversion and bridging (PCI, USB, Ethernet)
#### Industrial & Embedded Control
- Motor drive control with real-time feedback loops
- Industrial automation PLC co-processing
- Sensor fusion and data aggregation
- Machine vision preprocessing
#### Defense & Aerospace (Commercial Variant)
- Signal intelligence (SIGINT) pre-processing
- Radar and sonar digital front-end logic (commercial temperature systems)
- Ruggedized communications equipment
#### Consumer & Medical Electronics
- Medical imaging data pipeline acceleration
- High-definition video processing
- Diagnostic instrument logic control
- Portable test and measurement equipment
XC2S200-6FGG1181C vs. Similar Xilinx FPGA Variants
If you are evaluating alternatives within the XC2S200 family or considering a replacement, the table below compares the most popular variants:
| Part Number |
Speed Grade |
Package |
Balls/Pins |
Temp Range |
Pb-Free |
| XC2S200-5FGG256C |
-5 |
FBGA |
256 |
Commercial |
Yes |
| XC2S200-6FGG256C |
-6 |
FBGA |
256 |
Commercial |
Yes |
| XC2S200-5FGG456C |
-5 |
FBGA |
456 |
Commercial |
Yes |
| XC2S200-6FGG456C |
-6 |
FBGA |
456 |
Commercial |
Yes |
| XC2S200-5FGG456I |
-5 |
FBGA |
456 |
Industrial |
Yes |
| XC2S200-6FGG1181C |
-6 |
FBGA |
1,181 |
Commercial |
Yes |
| XC2S200-6PQG208C |
-6 |
PQFP |
208 |
Commercial |
Yes |
The FGG1181 package provides the highest ball count available for the XC2S200, giving board designers maximum routing flexibility, improved thermal dissipation, and lower per-ball inductance compared to smaller BGA packages.
Design Tools & Programming Support
The XC2S200-6FGG1181C is supported by Xilinx (AMD) design tools. While the Spartan-II is a mature family, existing designs can still be maintained using:
- Xilinx ISE Design Suite – The primary legacy tool for Spartan-II device targeting; supports synthesis, implementation, and device programming
- JTAG Boundary Scan – Full IEEE 1149.1 JTAG support for in-system programming and debug
- SelectMAP & Serial Modes – Multiple configuration modes for system integration flexibility
- XCF Platform Flash PROMs – Recommended companion configuration memory devices
For new FPGA designs, Xilinx recommends migrating to newer families such as Spartan-6, Artix-7, or Artix UltraScale+. For existing systems requiring XC2S200-6FGG1181C replacements, the device continues to be available through authorized distributors.
For a broader look at the full range of programmable logic solutions from Xilinx, visit our Xilinx FPGA resource page for part comparisons, sourcing guides, and design tips.
Electrical Characteristics & Absolute Maximum Ratings
DC Operating Conditions
| Parameter |
Min |
Typical |
Max |
Unit |
| VCCINT (Core Voltage) |
2.375 |
2.5 |
2.625 |
V |
| VCCIO (I/O Voltage) |
1.14 |
— |
3.465 |
V |
| VIN (Input Voltage) |
−0.5 |
— |
VCCIO + 0.5 |
V |
| IIK (Input Clamp Current) |
— |
— |
±50 |
mA |
| IOK (Output Clamp Current) |
— |
— |
±50 |
mA |
Thermal & Environmental Ratings
| Parameter |
Value |
| Commercial Temperature Range |
0°C to +85°C (ambient) |
| Storage Temperature |
−65°C to +150°C |
| Junction Temperature (Tj max) |
85°C |
| ESD Protection |
Human Body Model (HBM) compliant |
Ordering Information – XC2S200-6FGG1181C
When placing an order or requesting a quote for the XC2S200-6FGG1181C, ensure you verify the following:
| Field |
Detail |
| Manufacturer |
Xilinx / AMD |
| Manufacturer Part Number (MPN) |
XC2S200-6FGG1181C |
| Product Category |
Embedded FPGAs – Field Programmable Gate Array |
| RoHS Status |
Pb-free / RoHS compliant (FGG = lead-free package) |
| Recommended Distributors |
Authorized AMD/Xilinx distributors |
| Minimum Order Quantity (MOQ) |
Varies by distributor |
| Lifecycle Status |
Not Recommended for New Designs (NRND) |
Important Note: As a Not Recommended for New Designs (NRND) component, the XC2S200-6FGG1181C is primarily sourced for system maintenance, legacy board repair, and production continuation. Always request a Certificate of Conformance (CoC) and verify supply chain authenticity when purchasing from non-authorized sources.
Frequently Asked Questions (FAQ)
What is the XC2S200-6FGG1181C used for?
The XC2S200-6FGG1181C is a programmable logic device used in communications equipment, industrial automation, embedded processing, and signal processing applications. Its 200,000 system gates and 284 I/O pins make it suitable for complex, multi-interface digital designs.
What is the difference between XC2S200-5FGG1181C and XC2S200-6FGG1181C?
The primary difference is speed grade. The -6 variant operates at a higher maximum frequency (up to 263 MHz) compared to the -5 grade, making the -6 the preferred choice for high- Is the XC2S200-6FGG1181C lead-free?
Yes. The “G” in “FGG” indicates that this package uses Pb-free (lead-free) solder balls, making it compliant with RoHS environmental directives.
What configuration mode does the XC2S200-6FGG1181C support?
The device supports multiple configuration modes including Master Serial, Slave Serial, Slave Parallel (SelectMAP), JTAG (Boundary Scan), and Master Parallel modes.
Can I replace an XC2S200-6FGG456C with an XC2S200-6FGG1181C?
These two parts share the same die and logic but use different BGA packages (456 balls vs. 1,181 balls). They are not pin-compatible — a PCB redesign would be required to use a different package variant.
What software do I use to program the XC2S200-6FGG1181C?
Use Xilinx ISE Design Suite (legacy) for synthesis and implementation. The device is programmed via a JTAG cable (e.g., Xilinx Platform Cable USB) or through a companion PROM configuration device.
Summary – Why Choose the XC2S200-6FGG1181C?
The XC2S200-6FGG1181C delivers a proven, mature FPGA platform with the following standout characteristics:
- ✅ Highest gate density in the Spartan-II family (200K system gates)
- ✅ Fastest speed grade available (-6, up to 263 MHz)
- ✅ Largest BGA package for maximum routing flexibility (1,181 balls)
- ✅ RoHS-compliant Pb-free construction
- ✅ Rich I/O support with 284 user pins and multi-voltage standards
- ✅ On-chip DLLs for zero-skew clock management
- ✅ Dual-port block RAM for high-bandwidth data buffering
For legacy system maintenance, production continuation, or designs where the Spartan-II architecture is already validated, the XC2S200-6FGG1181C remains a reliable, well-characterized choice backed by comprehensive Xilinx documentation and widespread distributor availability.
