XC2S200-6FGG1177C: Complete Guide to Xilinx Spartan-II FPGA

The XC2S200-6FGG1177C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and a -6 speed grade — making it one of the most capable parts in the Spartan-II lineup. Whether you’re designing embedded systems, telecommunications hardware, or industrial controllers, the XC2S200-6FGG1177C offers the flexibility, performance, and reliability engineers demand.

For a broader selection of compatible devices, explore our full range of Xilinx FPGA solutions.

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What Is the XC2S200-6FGG1177C?

Part Number Breakdown

Understanding the XC2S200-6FGG1177C part number is essential for procurement and design planning. Each segment of the part number carries specific information:

Device Family Overview

The XC2S200-6FGG1177C belongs to the Xilinx Spartan-II family, a 2.5V FPGA series built on 0.18µm CMOS process technology. The Spartan-II family was designed as a direct, lower-cost alternative to mask-programmed ASICs, offering full reprogrammability without the NRE costs or development risk of traditional ASICs.

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XC2S200-6FGG1177C Key Specifications

Core Logic and Memory Resources

Electrical and Physical Characteristics

Configuration and Interface Features

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XC2S200-6FGG1177C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1177C is its array of 1,176 Configurable Logic Blocks (CLBs). Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), and fast carry logic. This architecture enables efficient implementation of arithmetic functions, state machines, and complex combinatorial logic.

Input/Output Blocks (IOBs)

The IOBs surrounding the CLB array support a wide range of single-ended and differential I/O standards. Key IOB features include:

• Programmable input delay for setup time optimization
• Optional pull-up, pull-down, and keeper circuits
• Slew rate control for EMI reduction
• Configurable drive strength

Block RAM

The XC2S200-6FGG1177C provides 56Kbits of dedicated block RAM, organized into 14 dual-port RAM blocks of 4Kbits each. This embedded memory is ideal for FIFOs, lookup tables, and temporary data buffers in high-speed designs.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — positioned at each corner of the die — allow designers to eliminate clock skew, multiply or divide clock frequencies, and phase-shift clocks. This enables robust synchronous design without external clock conditioning components.

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Spartan-II Family Comparison Table

The XC2S200 is the largest and most capable device in the Spartan-II family. The table below shows how it compares across the full family:

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Applications of the XC2S200-6FGG1177C

Telecommunications and Networking

The XC2S200-6FGG1177C is widely used in telecommunications infrastructure. Its 263 MHz maximum clock speed and 284 user I/O pins make it suitable for protocol processing, switching fabrics, and line card implementations in routers and switches.

Industrial Automation and Control

With its large I/O count and robust CLB architecture, this FPGA handles real-time motor control, process automation, and machine vision applications. The commercial temperature rating covers standard industrial environments.

Embedded Systems and SoC Prototyping

Engineers use the XC2S200-6FGG1177C for embedded processor implementations and SoC prototyping. The combination of distributed and block RAM supports soft-core processor deployments such as Xilinx’s PicoBlaze.

Signal Processing

The device’s logic density and high-speed clock capability support digital signal processing (DSP) pipelines, including FIR/IIR filters, FFT engines, and modulation/demodulation blocks for wireless baseband applications.

Medical and Security Systems

The reconfigurability of the XC2S200-6FGG1177C makes it valuable in diagnostic imaging equipment, patient monitoring systems, and security access control applications where design updates must be deployed after manufacturing.

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Configuration Modes

The XC2S200-6FGG1177C supports four configuration modes to suit different system architectures:

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Ordering Information and Package Details

Decoding the Part Number

The FGG suffix indicates a Pb-free Fine-Pitch Ball Grid Array package, compliant with RoHS requirements. Pb-free variants include the “G” character in the package suffix per Xilinx ordering conventions.

Available Speed Grades

Note: The -6 speed grade for XC2S200 devices is exclusively available in the Commercial temperature range (suffix “C”).

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XC2S200-6FGG1177C vs. Competing Devices

Why Choose the Spartan-II Over an ASIC?

The XC2S200-6FGG1177C eliminates the major drawbacks of mask-programmed ASICs:

• No NRE costs — skip the multi-million-dollar mask set investment
• No minimum order quantities — order exactly what you need
• Field reprogrammability — update designs post-deployment without hardware replacement
• Faster time to market — move from design to prototype in days, not months

Spartan-II vs. Spartan-3 Considerations

Engineers migrating from Spartan-II should note that the Spartan-3 family offers lower power, higher density, and more advanced I/O standards. However, the Spartan-II remains valuable for legacy designs, long product lifecycles, and supply chain continuity in industrial and mil-aero adjacent applications.

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Development Tools and Support

Xilinx ISE Design Suite

The XC2S200-6FGG1177C is fully supported by the Xilinx ISE Design Suite, which includes synthesis, implementation, timing analysis, and bitstream generation tools. ISE WebPACK provides a free entry point for smaller designs.

Simulation and Verification

Designers can use industry-standard simulators (ModelSim, Vivado Simulator) with Xilinx-provided UNISIM and SIMPRIM libraries for functional and timing simulation of Spartan-II devices.

IP Cores

Xilinx’s IP catalog includes LogiCORE IP modules compatible with the XC2S200, covering interfaces such as UART, SPI, I2C, and soft-core processors, accelerating design development significantly.

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Frequently Asked Questions (FAQ)

What is the maximum frequency of the XC2S200-6FGG1177C?

The XC2S200 at the -6 speed grade achieves a maximum system clock frequency of 263 MHz, making it the highest-performance variant in the Spartan-II family.

Is the XC2S200-6FGG1177C RoHS compliant?

Yes. The “G” in the “FGG” package designation indicates a Pb-free (lead-free) package, meeting RoHS environmental compliance requirements.

What temperature range does the XC2S200-6FGG1177C support?

The “C” suffix specifies the Commercial temperature range: 0°C to +85°C. Industrial-range variants (suffix “I”, -40°C to +100°C) are available at the -5 speed grade.

Can the XC2S200-6FGG1177C replace an ASIC?

Yes. Xilinx designed the Spartan-II family specifically as a flexible, reprogrammable alternative to mask-programmed ASICs, suitable for high-volume production with the added benefit of in-field updates.

What programming software is used for the XC2S200-6FGG1177C?

Xilinx ISE Design Suite is the primary development environment. The device is programmed using the iMPACT tool via JTAG or through a configuration PROM in Master Serial mode.

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Summary Specifications Card