The XC2S200-6FGG1175C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a fast -6 speed grade, this device is engineered for cost-sensitive, high-volume applications that demand real programmable logic performance. Housed in a 1,175-ball Fine-Pitch Ball Grid Array (FGG) package with commercial temperature rating, the XC2S200-6FGG1175C is a proven solution for communication systems, industrial automation, consumer electronics, and embedded design.

Looking for more Xilinx programmable logic products? Explore the full lineup of Xilinx FPGA solutions for your next design project.

What Is the XC2S200-6FGG1175C?

The XC2S200-6FGG1175C belongs to Xilinx’s Spartan-II FPGA family, built on a proven 0.18-micron process technology and operating on a 2.5V core voltage. It sits at the top of the Spartan-II lineup as the highest gate-count device in the family, making it ideal for complex digital designs that require abundant logic resources at a cost-effective price point.

Decoding the Part Number

Understanding the part number helps engineers quickly identify exact device characteristics:

Note: The double “G” in FGG indicates a Pb-Free (RoHS-compliant) packaging option, differentiating it from the standard FG package.

XC2S200-6FGG1175C Key Specifications

Core Technical Specifications

Memory Architecture

The XC2S200-6FGG1175C provides two types of on-chip memory, each suited for different design requirements:

I/O and Clocking Resources

Spartan-II Family Comparison Table

The table below shows how the XC2S200-6FGG1175C compares against other members of the Spartan-II FPGA family:

The XC2S200 is the largest and most capable device in the Spartan-II series, delivering the maximum logic density, I/O count, and RAM resources available within the family.

Key Features of the XC2S200-6FGG1175C

#### Configurable Logic Blocks (CLBs)

Each CLB contains four logic cells, and each logic cell includes a 4-input Look-Up Table (LUT), a flip-flop, and dedicated carry logic. The 28×42 CLB array gives designers 1,176 CLBs, enabling implementation of complex, high-speed digital functions.

#### Delay-Locked Loops (DLLs)

Four on-chip DLLs eliminate clock distribution delays, reduce clock skew, and enable clock frequency synthesis. They are positioned at each corner of the die for optimal distribution, supporting reliable, high-frequency synchronous designs.

#### SelectRAM+ Distributed Memory

Distributed RAM is embedded directly within the CLB structure using the LUT resources. This allows every CLB to double as synchronous or asynchronous RAM, providing fast, fine-grained memory access without dedicated routing.

#### Dual-Port Block RAM

The Spartan-II block RAM supports true dual-port operation, enabling simultaneous read and write access from two independent address buses. This is ideal for FIFOs, ping-pong buffers, and inter-process data sharing in embedded designs.

#### Multi-Standard I/O Blocks (IOBs)

Each I/O block supports a wide range of single-ended and differential signaling standards. The programmable I/O enables seamless interfacing to industry-standard buses, memory devices, and processors.

#### Boundary Scan (JTAG) Support

The XC2S200-6FGG1175C supports IEEE 1149.1 (JTAG) boundary scan for in-system testing and debugging, simplifying board-level verification.

Architecture Overview

The internal architecture of the XC2S200-6FGG1175C is organized as follows:

┌────────────────────────────────────────────────────────┐
│                   Global Clock Network                  │
├────────┬────────────────────────────────────┬──────────┤
│  IOBs  │         CLB Array (28×42)          │   IOBs   │
│        │  ┌──────┐ ┌──────┐ ┌──────┐       │          │
│  DLL   │  │ CLB  │ │ CLB  │ │ CLB  │  ...  │   DLL    │
│        │  └──────┘ └──────┘ └──────┘       │          │
│        │         Block RAM Columns           │          │
│  DLL   │  ┌──────────────────────────────┐  │   DLL    │
│        │  │  Block RAM  │  Block RAM     │  │          │
│  IOBs  │  └──────────────────────────────┘  │   IOBs   │
└────────┴────────────────────────────────────┴──────────┘

Two columns of block RAM are placed on opposite sides of the die, between the CLBs and the IOB columns, for efficient data routing.

XC2S200-6FGG1175C vs. Similar Devices

#### XC2S200-6FGG1175C vs. XC2S200-6FGG456C

#### Speed Grade Comparison for XC2S200

Applications of the XC2S200-6FGG1175C

The XC2S200-6FGG1175C is widely used across multiple industries due to its rich feature set and reprogrammable nature:

Communications & Networking

• Protocol bridging and conversion (UART, SPI, I2C, Ethernet MAC)
• Network switch logic and packet filtering
• Wireless baseband processing

Industrial Automation

• Motor drive and control logic
• PLC (Programmable Logic Controller) replacement
• Sensor fusion and real-time process control

Consumer Electronics & Embedded Systems

• Video processing pipelines
• Display controllers and timing generators
• Embedded processor acceleration (co-processing)

Medical & Scientific Instrumentation

• Medical imaging signal processing
• Patient monitoring device logic
• High-speed data acquisition front-ends

Aerospace & Defense (Commercial Grade Use)

• Signal processing for radar and sonar front-ends
• Reconfigurable test equipment
• Hardware prototype verification platforms

Programming and Design Tools

The XC2S200-6FGG1175C is supported by Xilinx’s legacy ISE Design Suite, which remains the primary toolchain for Spartan-II devices.

Important: The Spartan-II family is not supported by the newer Vivado Design Suite. Engineers must use ISE 14.7 or earlier for XC2S200 device design.

Ordering Information & Naming Convention

Xilinx uses a standardized part number format for all Spartan-II devices:

XC 2S 200 - 6 FGG 1175 C
│   │   │    │   │    │   │
│   │   │    │   │    │   └── Temperature: C = Commercial
│   │   │    │   │    └────── Pin Count: 1175
│   │   │    │   └─────────── Package: FGG = Fine-Pitch BGA (Pb-Free)
│   │   │    └─────────────── Speed Grade: 6 (fastest)
│   │   └──────────────────── Gates: 200K
│   └──────────────────────── Spartan-II Series
└──────────────────────────── Xilinx FPGA

Temperature Range Options

Why Choose the XC2S200-6FGG1175C?

• Maximum Spartan-II Logic Density – 200K gates and 5,292 cells give you headroom for complex designs.
• Fastest Speed Grade – The -6 grade delivers maximum performance within the Spartan-II family.
• Rich I/O – 284 user I/O pins support complex multi-bus board designs.
• On-Chip Memory – 75K bits distributed RAM + 56K bits block RAM eliminates external memory for many applications.
• Pb-Free Packaging – FGG suffix confirms RoHS compliance for modern manufacturing requirements.
• ASIC Alternative – Reprogrammable logic eliminates mask costs and long ASIC development cycles, enabling field updates.
• Proven Technology – The Spartan-II family has decades of deployment history across thousands of designs.

Frequently Asked Questions (FAQ)

What does the -6 speed grade mean for XC2S200-6FGG1175C?

The -6 designation is the fastest commercial speed grade available in the Spartan-II family. It indicates the device meets timing specifications at maximum clock frequencies, up to 200 MHz system performance.

Is the XC2S200-6FGG1175C RoHS compliant?

Yes. The double “G” in FGG indicates a Pb-Free package, making this part RoHS compliant and suitable for lead-free manufacturing processes.

What is the difference between FGG and FG packages?

Both are Fine-Pitch Ball Grid Array (BGA) packages. The FGG (with double G) denotes the Pb-Free variant, while the single FG refers to the standard leaded package. The die and electrical characteristics are identical.

Can I use Vivado for XC2S200-6FGG1175C design?

No. The XC2S200 Spartan-II device is only supported by the Xilinx ISE Design Suite (up to version 14.7). Vivado does not support Spartan-II devices.

What configuration interfaces does the XC2S200-6FGG1175C support?

The device supports Master Serial, Slave Serial, Master Parallel, Slave Parallel (SelectMAP), and JTAG (Boundary Scan) configuration modes.

What are common alternatives to the XC2S200-6FGG1175C?

Common alternatives include other XC2S200 package variants (FGG456, FG256), or upgrading to a newer family such as the Spartan-3 (XC3S200) or Spartan-6 (XC6SLX9) for new designs requiring longer lifecycle support.

Summary

The XC2S200-6FGG1175C is a feature-rich, high-performance Xilinx Spartan-II FPGA that offers the maximum logic density in its family, a fast -6 speed grade, 284 user I/Os, and substantial on-chip memory — all in a Pb-Free 1,175-ball BGA package rated for commercial temperatures. It is an excellent choice for engineers building communication systems, industrial controllers, consumer electronics, and embedded platforms who need proven FPGA performance at a cost-effective price.