The XC2S200-6FGG1172C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Manufactured by AMD Xilinx using advanced 0.18µm process technology, this device delivers 200,000 system gates, 5,292 logic cells, and a rich set of I/O and memory resources — all housed in a Pb-free 1172-ball Fine-Pitch Ball Grid Array (FGG1172) package. Designed for commercial-temperature applications, the -6 speed grade makes the XC2S200-6FGG1172C the fastest variant in the XC2S200 lineup.

Whether you are a hardware engineer sourcing components for a new design, maintaining legacy systems, or replacing discontinued parts, this guide covers everything you need to know about the XC2S200-6FGG1172C — including full specs, pinout details, ordering information, and supported applications. For a broader selection of compatible devices, visit Xilinx FPGA.

What Is the XC2S200-6FGG1172C? – Overview and Part Number Breakdown

The XC2S200-6FGG1172C belongs to the Xilinx Spartan-II FPGA series, a cost-optimized family built on 0.18µm, 6-layer-metal process technology. It serves as a programmable alternative to mask-programmed ASICs, enabling field reconfigurability without hardware replacement.

XC2S200-6FGG1172C Part Number Decoder

Understanding the part number is essential for procurement and cross-referencing.

Note: The “G” in “FGG” specifically designates the Pb-free (RoHS-compliant) package variant, which distinguishes it from the standard “FG” package.

XC2S200-6FGG1172C Key Specifications

Core Electrical and Logic Specifications

Package and Physical Specifications

XC2S200-6FGG1172C Architecture and Internal Structure

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1172C is organized around a 28×42 array of Configurable Logic Blocks (CLBs). Each CLB contains:

• Look-Up Tables (LUTs): Implement combinatorial logic functions up to 4 inputs
• Flip-Flops: Store state information for sequential logic
• Multiplexers: Enable flexible routing and function selection
• Carry Logic: Accelerates arithmetic operations

With 1,176 total CLBs, the XC2S200-6FGG1172C supports complex digital designs well beyond what smaller Spartan-II members can handle.

Block RAM and Distributed Memory

Block RAM modules are dual-port and can be configured as 16K×1, 8K×2, 4K×4, 2K×9, 1K×18 bit widths. Distributed RAM is embedded within CLB slices and is ideal for small lookup tables, FIFOs, and shift registers.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1172C features four on-chip DLLs, one at each corner of the die. These DLLs provide:

• Zero-delay clock distribution
• Clock edge alignment with external signals
• Clock frequency synthesis (2×, 1.5×, and other multiples)
• Clock deskewing across the device

Input/Output Blocks (IOBs)

The device offers up to 284 user-configurable I/O pins, supporting the following I/O standards:

Each IOB includes programmable slew rate control, optional pull-up/pull-down resistors, and input hysteresis for reliable signal integrity.

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The table below shows the complete Xilinx Spartan-II FPGA family, helping you compare the XC2S200 against other members:

The XC2S200 is the largest device in the Spartan-II family, offering the maximum logic, I/O, and memory resources available in this series.

XC2S200-6FGG1172C Speed Grade and Timing Performance

The -6 speed grade is the highest-performance option in the XC2S200 lineup and is exclusively available in the commercial temperature range (suffix “C”). This makes the XC2S200-6FGG1172C ideal for applications that demand the fastest signal propagation and tightest timing margins.

Speed Grade Comparison for XC2S200

The -6 speed grade supports system performance up to 200 MHz with the fastest pin-to-pin propagation delays, making it best suited for high-throughput data processing, fast communication interfaces, and time-critical control loops.

Applications and Use Cases for the XC2S200-6FGG1172C

The XC2S200-6FGG1172C’s combination of high gate count, abundant I/O, and fast speed grade makes it suitable for a wide range of demanding applications:

## Communications and Networking

• Protocol bridging: Implements high-speed serial/parallel protocol converters (SPI, I2C, UART, Ethernet MAC)
• Network switching: Used in routers, switches, and network interface cards requiring fast packet processing
• Wireless base stations: Enables signal processing in 2G/3G infrastructure

## Industrial Automation and Control

• Motor control: Real-time PWM generation and feedback processing for servo and stepper motors
• Process automation: Implements state machines for PLC-equivalent logic
• Sensor interfacing: High-density I/O supports multi-axis sensor integration

## Video and Image Processing

• Frame buffering: Block RAM enables on-chip pixel storage for real-time video pipelines
• Image filtering: CLB-based DSP functions support convolution kernels and spatial filters
• Display interfaces: Generates VGA, DVI timing with programmable resolution support

## Embedded Systems and SoC Design

• Soft-core processors: Host MicroBlaze-equivalent soft processors for embedded control
• Custom peripherals: Acts as a programmable peripheral controller in multi-chip designs
• Coprocessor functions: Offloads compute-intensive tasks from a host CPU

## Medical and Defense Electronics

• Diagnostic imaging: High-bandwidth logic supports ultrasound and X-ray data capture
• Secure data processing: Implements encryption/decryption pipelines (AES, DES)
• Signal acquisition: Fast DLL-synchronized sampling for precision measurement systems

Configuration and Programming the XC2S200-6FGG1172C

Spartan-II FPGAs including the XC2S200-6FGG1172C use SRAM-based configuration, meaning the bitstream must be loaded at power-up every time. Configuration options include:

Recommended Design Tools

XC2S200-6FGG1172C vs. Alternative FPGAs – Competitive Comparison

If you are evaluating alternatives or upward migrations, the table below compares the XC2S200-6FGG1172C with related FPGAs:

Migration Note: For new designs, AMD Xilinx recommends migrating to the Spartan-3 or Spartan-6 series for improved power efficiency and updated toolchain support. The XC2S200-6FGG1172C remains widely used in legacy system maintenance and repair.

Ordering Information and Naming Convention

Xilinx uses a standardized ordering code that encodes device, speed, package, and temperature in a single part number. The full ordering structure for the XC2S200-6FGG1172C is:

XC  2S200  -6  FGG  1172  C
|   |       |   |    |     |
|   |       |   |    |     └─ Temperature: C = Commercial (0°C to +85°C)
|   |       |   |    └─────── Pin count: 1172 balls
|   |       |   └──────────── Package: FGG = Fine-Pitch BGA, Pb-free
|   |       └──────────────── Speed grade: -6 (fastest)
|   └──────────────────────── Device: 2S200 = Spartan-II, 200K gates
└──────────────────────────── Manufacturer prefix: Xilinx

Available Package Options for XC2S200

Frequently Asked Questions (FAQ) About XC2S200-6FGG1172C

Q: What does the -6 speed grade mean for the XC2S200-6FGG1172C?
A: The -6 speed grade indicates the fastest timing performance tier in the XC2S200 lineup. It is exclusively available in the commercial temperature range (0°C to +85°C) and supports system clock frequencies up to 200 MHz.

Q: Is the XC2S200-6FGG1172C RoHS compliant?
A: Yes. The “G” in the “FGG” package designation confirms this is the Pb-free, RoHS-compliant version of the 1172-ball Fine-Pitch BGA package.

Q: Can the XC2S200-6FGG1172C be used in industrial temperature ranges?
A: No. The “C” suffix designates a commercial temperature range (0°C to +85°C). For industrial use (-40°C to +100°C), you would need the “I” suffix variant with a -5 speed grade.

Q: What configuration memory is compatible with the XC2S200-6FGG1172C?
A: Xilinx Platform Flash PROMs (XCF01S, XCF02S, XCF04S) are recommended for serial configuration. SPI and parallel NOR Flash devices are also supported.

Q: Is the XC2S200-6FGG1172C still in production?
A: The Spartan-II family has reached end-of-life status. The XC2S200-6FGG1172C is available through authorized distributors and excess inventory channels for legacy system support and maintenance.

Q: What software tools are needed to program the XC2S200-6FGG1172C?
A: Xilinx ISE Design Suite (version 14.7 is the final release) is the primary tool for synthesis, implementation, and bitstream generation. Xilinx Vivado does not directly support the Spartan-II family.

Why Choose the XC2S200-6FGG1172C for Your Design?

The XC2S200-6FGG1172C offers a compelling combination of features that made the Spartan-II family one of the most widely deployed FPGA generations:

• ✅ Highest performance in the Spartan-II family (-6 speed grade)
• ✅ Maximum resource density – largest device in the Spartan-II series (200K gates, 5,292 cells)
• ✅ Wide I/O support – up to 284 user I/Os with multi-volt interface compatibility
• ✅ Pb-free packaging – FGG1172 package meets RoHS environmental standards
• ✅ Proven reliability – extensive field deployment across communications, industrial, and medical markets
• ✅ Cost-effective ASIC replacement – eliminates NRE costs and enables field reprogramming

For engineers seeking a complete line of programmable logic solutions, including newer Spartan-6, Artix-7, and Kintex-7 FPGAs, explore the full catalog at Xilinx FPGA.

Summary Specifications Table