The XC2S200-6FGG1167C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for engineers and system architects who demand reliable, cost-effective programmable logic, the XC2S200-6FGG1167C delivers 200,000 system gates, 5,292 logic cells, and blazing-fast -6 speed grade performance — all in a large 1167-pin Pb-free Fine-Pitch Ball Grid Array (FBGA) package. Whether you’re building communication systems, industrial automation controllers, or embedded processing platforms, this device offers a compelling balance of logic density, I/O flexibility, and design reusability.

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What Is the XC2S200-6FGG1167C?

The XC2S200-6FGG1167C belongs to the Xilinx Spartan-II FPGA family, a 2.5V programmable logic device series built on Xilinx’s advanced 0.18-micron process technology. The part number breaks down as follows:

The Spartan-II family was introduced as a direct alternative to mask-programmed ASICs. Unlike ASICs, the XC2S200-6FGG1167C eliminates non-recurring engineering (NRE) costs, accelerates time-to-market, and allows in-field design updates without hardware replacement.

XC2S200-6FGG1167C Key Specifications

Core Logic and Memory

Performance and Electrical

Package and I/O

XC2S200-6FGG1167C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1167C organizes its logic resources into 1,176 Configurable Logic Blocks arranged in a 28-column by 42-row matrix. Each CLB contains:

• Four-input Look-Up Tables (LUTs) for combinational logic
• Flip-flops for sequential logic
• Carry and arithmetic logic for efficient math operations
• Multiplexers for flexible routing

This architecture allows engineers to implement complex digital circuits ranging from simple state machines to full DSP pipelines.

Block RAM

The XC2S200-6FGG1167C includes 56K bits of dedicated block RAM spread across two columns of RAM blocks positioned on opposite sides of the die. Block RAM supports:

• Dual-port access for simultaneous read/write operations
• Configurable data width and depth (up to 4K × 1 to 256 × 16)
• Use as FIFOs, data buffers, or lookup tables

Input/Output Blocks (IOBs) and I/O Standards

With 284 maximum user I/O pins, the XC2S200-6FGG1167C supports a broad range of programmable I/O standards, making it highly versatile for interfacing with external components.

Each IOB also provides optional slew rate control, drive strength control, and pull-up / pull-down resistors for signal integrity management.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops — one at each corner of the die — provide precise clock management. The DLLs enable:

• Clock deskewing across the device
• Frequency synthesis and clock multiplication
• Phase shifting for timing-critical applications

XC2S200-6FGG1167C vs. Other Spartan-II Devices

The table below compares the XC2S200 against other members of the Spartan-II family to help engineers select the right device for their design:

The XC2S200 is the largest and most capable device in the Spartan-II family, making the XC2S200-6FGG1167C ideal for designs that demand maximum logic density and I/O count.

Why Choose the XC2S200-6FGG1167C?

✅ Fastest Speed Grade Available

The -6 speed grade is the highest performance option in the Spartan-II lineup. It is exclusively available in the Commercial temperature range and supports system operation up to 200 MHz, making it the right choice for latency-sensitive and high-throughput designs.

✅ Pb-Free (RoHS Compliant) Packaging

The double “G” in FGG1167 denotes Xilinx’s lead-free packaging option, meeting global RoHS environmental compliance standards. This is essential for products sold in the EU, and increasingly a requirement across global supply chains.

✅ Superior ASIC Replacement

The XC2S200-6FGG1167C eliminates the need for costly mask-programmed ASICs. Engineers gain the ability to update logic in the field without hardware swaps — a critical advantage for products with evolving firmware requirements.

✅ Rich Memory Resources

With 75,264 bits of distributed RAM and 56K bits of block RAM, the XC2S200-6FGG1167C provides ample on-chip storage for buffering, protocol stacks, and data-intensive algorithms.

✅ Flexible I/O with Wide Voltage Support

Support for over ten I/O standards, combined with 284 user I/O pins across a 1167-ball package, allows designers to connect this FPGA to virtually any peripheral, memory bus, or communication interface in use today.

XC2S200-6FGG1167C Applications

The XC2S200-6FGG1167C is suitable for a broad range of end markets and application domains:

Configuration and Programming

Supported Configuration Modes

The XC2S200-6FGG1167C supports multiple configuration modes to suit different system architectures:

Recommended Design Tools

Xilinx Spartan-II devices are supported by the following design environments:

• Xilinx ISE Design Suite – The legacy toolchain for all Spartan-II development (recommended for XC2S200-based designs)
• ModelSim / Questa – For RTL simulation
• Synopsis / Mentor HDL Tools – For third-party synthesis flows
• IMPACT – Xilinx programming and configuration software

Ordering Information and Part Decode

XC2S200-6FGG1167C Ordering Code Breakdown

XC2S200  -  6  -  FGG  -  1167  -  C
  |          |     |        |       |
Device    Speed  Package  Pin    Temp
Type      Grade  (Pb-free) Count  Range

Available Package Options for XC2S200

Frequently Asked Questions (FAQ)

What is the difference between XC2S200-6FGG1167C and XC2S200-6FG456C?

The primary difference is the package. The FGG1167 is a 1,167-pin Pb-free (lead-free) Fine-Pitch BGA, while the FG456 is a 456-pin standard (leaded) Fine-Pitch BGA. Both share identical core logic and performance specifications; the larger FGG1167 package provides more PCB routing flexibility and is RoHS compliant.

Is the XC2S200-6FGG1167C still in production?

The Spartan-II family has reached end-of-life status with Xilinx (now AMD). However, the XC2S200-6FGG1167C remains available through authorized distributors and component brokers for maintenance and legacy system support. Always verify stock availability before committing to a design.

What is the maximum clock frequency for the XC2S200-6FGG1167C?

The -6 speed grade supports internal clock frequencies up to 263 MHz via the on-chip DLLs, with system-level performance up to 200 MHz depending on the design.

Can I replace XC2S200-6FGG1167C with a newer Xilinx device?

Yes. For new designs, Xilinx recommends migrating to the Spartan-6 or Artix-7 FPGA families, which offer significantly higher logic density, lower power, and improved tool support while maintaining design portability for many logic structures.

What programming language is used with XC2S200-6FGG1167C?

The XC2S200-6FGG1167C is programmed using VHDL or Verilog HDL. Schematic-based entry is also supported through Xilinx ISE Design Suite.

Summary

The XC2S200-6FGG1167C is the top-tier configuration of Xilinx’s Spartan-II FPGA line — combining the largest logic density in the family (200K gates, 5,292 cells), the fastest speed grade (-6), and a 1,167-pin Pb-free BGA package that maximizes routing options on complex PCB designs. Its 0.18µm process, four on-chip DLLs, support for over ten I/O voltage standards, and 131K bits of combined on-chip RAM make it a robust solution for legacy system support, prototyping, and volume production in telecommunications, industrial, and embedded applications.

For a comprehensive selection of Xilinx programmable logic devices, visit our Xilinx FPGA catalog.