Meta Description: Looking for the XC2S200-6FGG1166C? Read the full specs, pinout, configuration modes, and key features of this Xilinx Spartan-II FPGA with 200K gates in a 1166-ball FGG BGA package.

The XC2S200-6FGG1166C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Built on a 0.18µm, eight-layer metal process and operating at a 2.5V core voltage, this device delivers 200,000 system gates and 5,292 logic cells — making it a proven, versatile solution for high-volume embedded, communications, and consumer electronics designs. For engineers seeking a reliable and reprogrammable alternative to mask-programmed ASICs, the XC2S200-6FGG1166C remains one of the most recognized parts in the Xilinx FPGA product line.

What Is the XC2S200-6FGG1166C?

The XC2S200-6FGG1166C is the commercial-temperature, speed-grade -6 variant of the XC2S200, housed in a 1166-ball Fine-Pitch BGA (FGG) package. The part number breaks down as follows:

This device is JEDEC-compliant and available in Pb-free (RoHS-compatible) packaging, indicated by the double “G” in the FGG package designator.

XC2S200-6FGG1166C Key Specifications

Core Logic Resources

Electrical & Timing Characteristics

Package Information

XC2S200-6FGG1166C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 is organized around a 28 × 42 array of Configurable Logic Blocks (CLBs), totaling 1,176 CLBs. Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry and control logic. This architecture enables highly efficient implementation of both combinational and sequential logic functions.

Distributed RAM

The LUTs within each CLB can be repurposed as distributed synchronous RAM, providing 75,264 bits of total distributed RAM. This is especially useful for small, fast FIFOs and shift registers that would otherwise consume block RAM resources.

Block RAM

Two dedicated columns of block RAM flank the CLB array on each side of the die, offering 56K bits of synchronous dual-port block RAM. Each block RAM module can be independently configured as simple dual-port or true dual-port memory with programmable width and depth.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops are embedded in the device, one at each corner of the die. The DLLs eliminate clock distribution delay, allow clock multiplication and division, and support phase-shifted clocking for high-speed source-synchronous interfaces.

Input/Output Blocks (IOBs)

The XC2S200 provides up to 284 user-configurable I/O pins, supporting a wide range of single-ended and differential I/O standards including LVCMOS, LVTTL, PCI, GTL, HSTL, and SSTL. Each IOB contains a programmable input delay element, output drive control, and optional pull-up/pull-down resistors.

Configuration Modes of the XC2S200-6FGG1166C

The XC2S200-6FGG1166C supports four standard configuration modes, selected via the M0, M1, and M2 mode pins:

During power-on and throughout configuration, all I/O pins are held in a high-impedance state to prevent bus contention. After successful configuration, unused I/Os remain high-impedance by default.

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The XC2S200 is the largest member of the Spartan-II FPGA family. The table below compares all family members:

The XC2S200 offers the most logic resources, the highest I/O count, and the largest memory capacity across the entire Spartan-II family.

Why Choose the XC2S200-6FGG1166C?

#### Cost-Effective Alternative to ASICs

The Spartan-II family was specifically engineered as a cost-optimized replacement for mask-programmed ASICs. The XC2S200-6FGG1166C eliminates NRE (non-recurring engineering) costs, avoids long ASIC development cycles, and removes the risk of costly silicon re-spins — while still delivering ASIC-level performance and gate density.

#### Field Upgradability

Unlike ASICs or OTP devices, the XC2S200-6FGG1166C can be reconfigured in the field at any time. This allows firmware updates, bug fixes, and feature enhancements without any hardware replacement — a critical advantage in industrial, aerospace, and communications infrastructure applications.

#### Speed Grade -6: Maximum Performance

The -6 speed grade is the fastest available in the Spartan-II family and is exclusive to the commercial temperature range. It is the ideal choice for timing-critical designs requiring maximum clock frequencies, minimal propagation delays, and tight setup/hold margins.

#### Pb-Free (RoHS) Packaging

The double-G “FGG” package designator confirms this part meets Pb-free (lead-free) requirements, making it compatible with modern RoHS directives and suitable for applications that require environmentally compliant components.

Typical Applications for the XC2S200-6FGG1166C

The XC2S200-6FGG1166C is well-suited for a broad range of applications:

XC2S200-6FGG1166C Design Tool Support

Xilinx Spartan-II devices are supported by the following EDA tools:

Note: While Xilinx’s newer Vivado Design Suite is optimized for UltraScale and 7-Series devices, Spartan-II designs are best handled using the ISE Design Suite (version 14.7 or earlier).

Ordering Information & Part Number Decoder

When ordering the XC2S200-6FGG1166C, it is important to verify the complete part number to ensure you receive the exact device, speed grade, package, and temperature range required:

XC2S200 - 6 - FGG - 1166 - C
  │         │    │      │    └── C = Commercial (0°C to +85°C)
  │         │    │      └─────── 1166 = Number of BGA balls
  │         │    └────────────── FGG = Pb-Free Fine-Pitch BGA
  │         └─────────────────── 6 = Speed Grade (fastest)
  └───────────────────────────── XC2S200 = Spartan-II, 200K gates

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1166C used for?

The XC2S200-6FGG1166C is a general-purpose FPGA used for digital logic implementation, protocol bridging, embedded co-processing, and custom hardware acceleration across industrial, communications, and consumer electronics applications.

What is the difference between XC2S200-5 and XC2S200-6?

The -6 speed grade offers faster timing performance (lower propagation delays, higher maximum clock frequencies) than the -5. However, -6 is only available in the commercial temperature range (0°C to +85°C), while -5 is available in both commercial and industrial ranges.

Is the XC2S200-6FGG1166C Pb-free?

Yes. The “FGG” (double-G) suffix in the package designator confirms this is a Pb-free, RoHS-compliant package.

What configuration files does the XC2S200 require?

The XC2S200 requires a 1,335,840-bit bitstream for full configuration, which can be stored in external serial PROMs or loaded via JTAG.

Can the XC2S200 be used with Vivado?

The Spartan-II family is not supported in Xilinx Vivado. Design entry and implementation must be performed using the Xilinx ISE Design Suite.

Summary

The XC2S200-6FGG1166C is the top-of-the-line member of the Xilinx Spartan-II FPGA family, combining 5,292 logic cells, 200K system gates, 284 user I/O pins, and 56K bits of block RAM in a Pb-free 1166-ball FGG BGA package. Its -6 speed grade delivers maximum performance for commercial-temperature applications, while its reprogrammable architecture makes it far more flexible than traditional ASICs. Whether you are designing communication systems, industrial controllers, or embedded logic accelerators, the XC2S200-6FGG1166C provides a proven, cost-effective solution backed by decades of Xilinx silicon expertise.