Meta Description: The XC2S200-6FGG1161C is a Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, and a 1161-pin Pb-free BGA package. Explore full specs, pinout, and applications in this detailed guide.

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What Is the XC2S200-6FGG1161C?

The XC2S200-6FGG1161C is a high-performance, cost-optimized Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Built on advanced 0.18µm process technology and powered by a 2.5V supply, this device delivers up to 200,000 system gates and 5,292 logic cells in a robust 1161-pin Fine-Pitch Ball Grid Array (FGG BGA) Pb-free package.

Designed for high-volume, cost-sensitive applications, the XC2S200-6FGG1161C is a proven alternative to mask-programmed ASICs — eliminating the high NRE costs and long design cycles associated with conventional fixed-logic devices. For a broader look at Xilinx programmable solutions, visit our Xilinx FPGA resource page.

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XC2S200-6FGG1161C Part Number Breakdown

Understanding the ordering code helps engineers quickly identify the exact variant they need.

Note: The “G” suffix in “FGG” indicates a Pb-free (RoHS-compliant) package. The -6 speed grade is exclusively available in the commercial temperature range.

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XC2S200-6FGG1161C Key Specifications

Core Logic Resources

Electrical & Performance Parameters

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XC2S200-6FGG1161C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1161C is built around a matrix of 1,176 Configurable Logic Blocks arranged in a 28×42 grid. Each CLB contains four logic cells (slices), each with two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture enables the efficient implementation of combinatorial logic, arithmetic functions, and registered designs within a single unified fabric.

Block RAM and Distributed RAM

The device provides two types of on-chip memory:

• Distributed RAM (75,264 bits): Implemented within the CLB LUT fabric. Suitable for small, fast lookup tables and shift registers.
• Block RAM (56K bits): Dedicated synchronous dual-port RAM blocks arranged in two columns on opposite sides of the die. Ideal for FIFOs, data buffers, and packet memories.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — enable clock phase adjustment, frequency synthesis, and jitter reduction. The DLLs are essential for high-speed synchronous designs that demand precise timing closure.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1161C provides 284 maximum user I/O pins (excluding the four dedicated global clock inputs). Each IOB supports multiple I/O standards, making it compatible with a wide range of memory interfaces, buses, and peripheral logic families.

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XC2S200-6FGG1161C vs. Spartan-II Family Comparison

The table below shows where the XC2S200 sits within the complete Spartan-II product family, helping designers select the right device density for their design.

The XC2S200-6FGG1161C represents the largest and most capable device in the Spartan-II family, making it ideal for complex, logic-intensive applications that require the maximum number of I/O and on-chip memory resources.

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Key Features of the XC2S200-6FGG1161C

• ✅ 200,000 System Gates for complex logic designs
• ✅ -6 Speed Grade — the fastest available in the Spartan-II family
• ✅ 1161-pin Pb-Free FGG BGA package for high I/O density and RoHS compliance
• ✅ Four on-chip DLLs for clock management and phase alignment
• ✅ 284 user I/Os supporting multiple I/O standards
• ✅ 75,264 bits of distributed RAM for fast on-fabric memory
• ✅ 56K bits of block RAM for deeper buffering and packet storage
• ✅ 0.18µm technology enabling low power and high performance
• ✅ 2.5V core supply reducing overall system power consumption
• ✅ JTAG Boundary Scan (IEEE 1149.1) for in-system testing
• ✅ Re-programmable in-field — no hardware replacement required

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Typical Applications

The XC2S200-6FGG1161C is commonly used across a wide range of industries and design domains:

Industrial & Embedded Control

High-density I/O and on-chip memory make this device suitable for motor control systems, industrial automation logic, and sensor interface hubs.

Communications & Networking

The 284 user I/Os, block RAM FIFOs, and 200 MHz system performance support packet processing, framing logic, and protocol bridging in telecom and networking equipment.

Consumer Electronics

The Spartan-II family’s low unit cost and small 0.18µm die make the XC2S200-6FGG1161C a popular choice for high-volume consumer designs where BOM cost is critical.

Test & Measurement

DLL-based clock management and precise timing make this FPGA well-suited for logic analyzers, data acquisition systems, and automated test equipment (ATE).

Rapid Prototyping and ASIC Replacement

Because the XC2S200-6FGG1161C is fully reprogrammable, engineering teams use it as an ASIC prototype vehicle, shortening development cycles and enabling iterative hardware design without costly mask respins.

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Ordering and Availability Information

When sourcing the XC2S200-6FGG1161C, engineers should verify the following details with their distributor:

⚠️ Important Note: The Xilinx Spartan-II family is a mature product line. Designers starting new projects should evaluate current Xilinx/AMD FPGA families for long-term supply chain support. However, the XC2S200-6FGG1161C remains widely available through authorized distributors for legacy and sustaining engineering programs.

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Design Tools and Programming Support

The XC2S200-6FGG1161C is fully supported by Xilinx’s legacy ISE Design Suite, which provides:

• HDL synthesis (VHDL, Verilog)
• Place-and-route for Spartan-II architectures
• Timing analysis and constraint management
• BitGen configuration file generation
• iMPACT for JTAG-based programming

Configuration can be loaded via JTAG, Master Serial, Slave Serial, or SelectMAP modes, giving designers flexible options for production programming and in-field updates.

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Frequently Asked Questions (FAQ)

What does the -6 speed grade mean for the XC2S200-6FGG1161C?

The -6 speed grade is the fastest available within the Spartan-II family and is exclusively offered in the commercial temperature range (0°C to +85°C). It enables the highest clock frequencies and tightest timing margins for performance-critical designs.

Is the XC2S200-6FGG1161C RoHS compliant?

Yes. The “FGG” designation in the part number includes a “G” suffix indicating a Pb-free, RoHS-compliant package, meeting international environmental regulations.

What is the difference between FG and FGG packages?

The FG package uses standard (leaded) solder balls, while the FGG package uses lead-free (Pb-free) solder balls. Both have the same pin count and are mechanically compatible, but the FGG variant is required for RoHS compliance.

Can the XC2S200-6FGG1161C be used in new designs?

While fully functional, the Spartan-II family is a mature product line. Xilinx recommends migrating new designs to current-generation FPGA families for better long-term availability and support. The XC2S200-6FGG1161C is best suited for sustaining engineering, legacy replacement, and system repair.

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Summary

The XC2S200-6FGG1161C is a powerful, Pb-free Xilinx Spartan-II FPGA offering 200K system gates, 5,292 logic cells, four DLLs, and 284 user I/Os in a 1161-pin fine-pitch BGA package. With the fastest -6 speed grade and commercial temperature support, it is a proven solution for communications, industrial control, and consumer electronics designs. Whether for legacy system support or rapid prototyping, the XC2S200-6FGG1161C continues to be a reliable and accessible programmable logic device.

For more information about Xilinx programmable devices and sourcing options, visit our Xilinx FPGA catalog page.