The XC2S200-6FGG1159C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates in a large 1159-ball Fine-Pitch BGA (FBGA) package, operating at a commercial temperature range with the fastest -6 speed grade. Whether you are designing communication systems, industrial controllers, or embedded processing solutions, the XC2S200-6FGG1159C offers the programmable logic performance and I/O flexibility your project demands.

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What Is the XC2S200-6FGG1159C?

The XC2S200-6FGG1159C is a member of the Xilinx Spartan-II FPGA product line — a 2.5V programmable logic device built on 0.18 µm CMOS technology. The part number breaks down as follows:

As a Xilinx FPGA, the XC2S200-6FGG1159C is a proven solution for engineers seeking the flexibility of programmable hardware without the non-recurring engineering (NRE) costs and long lead times associated with mask-programmed ASICs.

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XC2S200-6FGG1159C Key Specifications

Core Logic Resources

Electrical & Performance Characteristics

Package Information

Note: The “G” in FGG indicates this is the Pb-free variant of the FG package. The double “GG” designation confirms lead-free, RoHS-compliant packaging with a green solder ball composition.

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XC2S200-6FGG1159C Architecture Overview

#### Configurable Logic Blocks (CLBs)

The XC2S200 core is built around a 28 × 42 array of Configurable Logic Blocks. Each CLB contains four logic cells (slices), and each slice includes two 4-input look-up tables (LUTs), two D flip-flops, and dedicated carry and control logic. This architecture enables efficient implementation of both combinational and sequential logic functions.

#### Block RAM

Fourteen dedicated 4K-bit block RAM modules provide 56K bits of on-chip memory. Each block RAM can be independently configured as single-port or simple dual-port memory, supporting a variety of data widths. Block RAM is critical for FIFO buffers, lookup tables, and local data storage in high-bandwidth designs.

#### Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — provide zero-skew clock distribution, frequency synthesis, and phase shifting. DLLs eliminate clock insertion delay and allow the designer to multiply or divide the input clock frequency, greatly simplifying board-level timing closure.

#### SelectIO™ Technology

The XC2S200-6FGG1159C supports multiple programmable I/O standards through Xilinx’s SelectIO technology. Each I/O bank can be independently powered via its VCCO supply rail, enabling mixed-voltage designs on a single device.

Supported I/O Standards

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Spartan-II Family Comparison Table

The XC2S200 is the largest member of the Spartan-II family. The table below places it in context with other family members to help engineers select the right device for their design.

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XC2S200 Speed Grade Comparison

The -6 speed grade in the XC2S200-6FGG1159C is the fastest available, and it is exclusively offered in the Commercial temperature range. The table below compares speed grades available for the XC2S200.

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Typical Applications for the XC2S200-6FGG1159C

The XC2S200-6FGG1159C is an ideal fit for applications that require high gate counts, rich I/O resources, and fast clock speeds in a commercial environment. Common use cases include:

• Telecommunications equipment – line card control, protocol bridging, and framing logic
• Industrial automation – motor control, programmable PLCs, and real-time sensor interfaces
• Embedded processing – custom co-processors and hardware accelerators
• Consumer electronics – digital video processing and display controllers
• Test and measurement instruments – data capture, signal routing, and stimulus generation
• Networking equipment – packet processing, switching logic, and interface bridging
• Automotive electronics – body control modules and infotainment signal processing (Note: consult Xilinx automotive-grade datasheets for AEC-Q100 requirements)

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Configuration and Programming

#### Supported Configuration Modes

The XC2S200-6FGG1159C supports five standard configuration modes, providing flexibility for board-level integration:

#### Recommended Configuration Devices

Xilinx Spartan-II FPGAs are typically configured using Xilinx Platform Flash PROMs (XCF series) for production designs, or via JTAG for prototyping and in-system updates.

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Design Tools and Software Support

The XC2S200-6FGG1159C is supported by the Xilinx ISE Design Suite, which includes:

• XST (Xilinx Synthesis Technology) for HDL synthesis
• ISE Implementation Tools for place-and-route
• iMPACT for device configuration and programming
• ChipScope Pro for in-system logic analysis

Developer Note: Xilinx ISE is the legacy toolchain for Spartan-II. Vivado Design Suite does not support the Spartan-II family. Designers should use ISE 14.7, the final release, which remains available from the AMD/Xilinx download center.

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Why Choose the XC2S200-6FGG1159C Over an ASIC?

The XC2S200-6FGG1159C eliminates the upfront investment and schedule risk of custom silicon while delivering deterministic, parallel hardware performance that no software-based microcontroller can match.

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Ordering Information & Part Number Decoder

When sourcing the XC2S200-6FGG1159C, confirm the following attributes to ensure you receive the correct part:

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Frequently Asked Questions (FAQ)

Q: Is the XC2S200-6FGG1159C still in production? The Spartan-II family has been subject to product discontinuation notices from Xilinx/AMD. Always verify current availability with your authorized distributor before designing this part into new products. For new designs, consider evaluating the Spartan-6 or Artix-7 family as replacements.

Q: What is the difference between FGG1159 and FG456 packages for the XC2S200? Both are Fine-Pitch BGA packages. The FGG1159 has 1,159 balls and provides more routing flexibility and I/O access on the PCB, while the FG456 has 456 balls. The die and logic resources are identical — only the package differs.

Q: Can the XC2S200-6FGG1159C be used in industrial temperature applications? The “-6” speed grade is only available in the Commercial temperature range (0°C to +85°C). For industrial temperature range (-40°C to +85°C), the -5 speed grade variants must be used.

Q: What configuration PROM is compatible with the XC2S200-6FGG1159C? Xilinx XCF01S, XCF02S, and XCF04S Platform Flash PROMs are compatible. The XC2S200 bitstream is approximately 559K bits, so the XCF01S (1Mbit) is the minimum suitable device.

Q: Does the XC2S200-6FGG1159C support partial reconfiguration? No. The Spartan-II family does not support partial reconfiguration. The entire device must be reconfigured to update the design.

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Summary

The XC2S200-6FGG1159C delivers 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and 284 user I/O pins in Xilinx’s highest-performance commercial speed grade. Its 1159-ball FBGA package makes it suitable for dense PCB designs requiring rich connectivity. As a Spartan-II flagship device, it remains a reliable choice for legacy system maintenance, prototyping, and applications where reconfigurability and zero NRE cost provide a competitive advantage.

For a broader selection of programmable logic devices and technical support, explore our full range of Xilinx FPGA products.