The XCKU040-3FBVA676E is a field-programmable gate array (FPGA) from AMD’s Kintex® UltraScale™ family — one of the most capable mid-range FPGA platforms available today. Manufactured on a 20nm process node and housed in a compact 676-pin FCBGA package, the XCKU040-3FBVA676E delivers the highest available performance tier in its class with a -3 speed grade and a supply voltage of 1.0V (VCCINT).
Whether you are designing high-throughput DSP pipelines, 100G packet processing systems, next-generation wireless infrastructure, or 8K/4K video processing hardware, the XCKU040-3FBVA676E offers the compute density, I/O bandwidth, and transceiver performance to meet demanding system requirements.
If you are looking for a broader overview of AMD’s programmable logic portfolio, visit our guide to Xilinx FPGA devices to compare families and find the right device for your design.
What Is the XCKU040-3FBVA676E?
The XCKU040-3FBVA676E belongs to AMD’s Kintex UltraScale device family — the first ASIC-class All Programmable Architecture to deliver multi-hundred Gbps system performance from a mid-range price point. The UltraScale architecture introduces next-generation routing, ASIC-like clocking, and advanced power reduction features that go well beyond what earlier 7-Series FPGAs could achieve.
The part number breaks down as follows:
| Segment |
Meaning |
| XC |
Xilinx / AMD Commercial Device |
| KU |
Kintex UltraScale Family |
| 040 |
Device Density (XCKU040) |
| -3 |
Speed Grade (-3 = Highest Performance) |
| FBVA |
Package Type (Flip-Chip BGA) |
| 676 |
Pin Count (676 balls) |
| E |
Temperature Grade (Extended: 0°C to +100°C) |
XCKU040-3FBVA676E Key Specifications
General Device Parameters
| Parameter |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCKU040-3FBVA676E |
| Device Family |
Kintex® UltraScale™ |
| Process Technology |
20nm |
| Speed Grade |
-3 (Highest Performance) |
| Temperature Grade |
Extended (E): 0°C to +100°C |
| VCCINT Supply Voltage |
1.0V |
| Package |
FCBGA (Flip-Chip Ball Grid Array) |
| Package Code |
FBVA676 |
| Pin Count |
676 |
| Lifecycle Status |
Production |
| RoHS Compliance |
Yes |
Logic Resources
| Resource |
XCKU040 Value |
| System Logic Cells |
530,250 |
| CLB LUTs |
242,400 |
| CLB Flip-Flops |
484,800 |
| CLBs (Configurable Logic Blocks) |
30,300 |
| Max Distributed RAM |
3,780 Kb |
| DSP Slices (DSP48E2) |
1,920 |
| Block RAM Tiles |
600 |
| Total Block RAM |
21,150 Kb (~21.1 Mb) |
I/O and Connectivity
| Parameter |
Value |
| User I/O (676 pkg) |
Up to 312 |
| HP I/O Banks |
High Performance (HP) |
| GTH Transceivers |
Up to 20 |
| Max GTH Data Rate |
16.3 Gb/s |
| PCIe Support |
Gen3 x8 Hard IP |
| CMAC / 100G Ethernet |
Yes (Hard IP) |
| MMCM / PLL |
Yes |
| Max Clock Frequency (-3 grade) |
Up to 800 MHz+ (fabric) |
Memory and Clocking
| Feature |
Details |
| Block RAM (RAMB36) |
600 tiles |
| Block RAM (RAMB18) |
1,200 tiles |
| FIFO36 / FIFO18 |
Supported |
| MMCM Count |
8 |
| PLL Count |
8 |
| Global Clock Buffers (BUFG) |
32 |
| Regional Clock Buffers (BUFR) |
48 |
Package & Physical Characteristics
| Parameter |
Value |
| Package Type |
FCBGA (Flip-Chip BGA) |
| Package Dimensions |
27mm × 27mm |
| Ball Pitch |
1.0mm |
| Total Ball Count |
676 |
| Mounting Style |
Surface Mount (SMD) |
Understanding the -3 Speed Grade on the XCKU040-3FBVA676E
The -3 speed grade is the highest performance tier available in the Kintex UltraScale family. Compared to the -2 and -1 speed grades, the -3 designation indicates that the device has been characterized and screened for superior timing margins, enabling higher maximum clock frequencies and shorter propagation delays.
Speed Grade Comparison for XCKU040
| Speed Grade |
VCCINT |
Performance Level |
Typical Use Case |
| -3 |
1.0V |
Highest |
Maximum performance designs |
| -2 |
0.95V |
Mid-High |
Balanced performance/power |
| -1 |
0.95V |
Standard |
General-purpose applications |
| -1L |
0.90–0.95V |
Low Power |
Power-sensitive applications |
The XCKU040-3FBVA676E is the preferred choice when timing closure at high clock rates is a design priority, such as in 100G line-rate networking, high-speed ADC/DAC interfacing, or computationally intensive real-time signal processing.
XCKU040-3FBVA676E vs. Other XCKU040 Package Variants
The XCKU040 die is available in multiple package options. The FBVA676 package offers a compact footprint ideal for space-constrained PCB designs, while larger packages support more I/O pins.
| Part Number |
Package |
Pins |
User I/Os |
Speed Grade |
Temp Grade |
| XCKU040-3FBVA676E |
FBVA676 |
676 |
~312 |
-3 |
Extended |
| XCKU040-2FBVA676E |
FBVA676 |
676 |
~312 |
-2 |
Extended |
| XCKU040-1FBVA676I |
FBVA676 |
676 |
~312 |
-1 |
Industrial |
| XCKU040-2FBVA900E |
FBVA900 |
900 |
~468 |
-2 |
Extended |
| XCKU040-2FFVA1156E |
FFVA1156 |
1156 |
~520 |
-2 |
Extended |
| XCKU040-3SFVA784E |
SFVA784 |
784 |
~400 |
-3 |
Extended |
When selecting between packages, the FBVA676 variant is ideal for designs where PCB real estate is constrained and 312 user I/Os are sufficient for the application.
XCKU040 Architecture Highlights
#### Next-Generation UltraScale Routing
The UltraScale architecture introduces a fundamentally new routing fabric compared to 7-Series devices. Instead of a traditional 2D routing mesh, UltraScale employs a staggered routing topology that reduces the number of routing stages, lowers latency, and improves timing predictability at high utilization.
#### High-Density DSP Processing
With 1,920 DSP48E2 slices, the XCKU040 provides exceptional arithmetic throughput. Each DSP48E2 slice supports 27×18-bit multiplications, cascaded addition/subtraction, pre-adder circuitry, and pattern detection — making it highly efficient for digital filtering, FFT, FIR, and machine learning inference tasks.
#### Block RAM Architecture
The 21.1 Mb of on-chip block RAM is organized as 600 RAMB36 tiles (each configurable as two independent RAMB18 tiles). All block RAM instances support true dual-port access, configurable widths, and optional FIFO operation, providing flexible memory architecture for packet buffers, look-up tables, and cache structures.
#### GTH High-Speed Transceivers
The XCKU040 integrates up to 20 GTH transceivers capable of data rates from 500 Mb/s to 16.3 Gb/s per lane. These transceivers support a wide range of serial protocols including PCIe Gen3, 10GbE, JESD204B, Interlaken, CPRI, and SRIO — making the XCKU040-3FBVA676E a strong choice for high-speed serial connectivity applications.
#### ASIC-Class Clocking
The device includes 8 MMCMs and 8 PLLs, supported by a comprehensive regional and global clock distribution network. This enables precise multi-clock-domain designs with minimal jitter — a critical requirement for high-speed data converters and telecommunications applications.
Target Applications for the XCKU040-3FBVA676E
The XCKU040-3FBVA676E is designed for a wide range of high-performance applications across multiple industries:
#### 100G Networking and Packet Processing
With integrated 100G Ethernet CMAC hard IP and high-speed GTH transceivers, the XCKU040 is purpose-built for line-rate packet processing in switches, routers, and network interface cards.
#### Wireless Infrastructure
The device’s high DSP density and transceiver bandwidth support CPRI/eCPRI fronthaul and baseband processing in 4G/5G base stations, remote radio units (RRUs), and small cell platforms.
#### High-Performance Computing and Data Centers
The XCKU040-3FBVA676E enables hardware acceleration of machine learning inference, database search, genomics, and financial algorithms in data center environments where latency and throughput are critical.
#### Medical Imaging and Instrumentation
DSP-intensive ultrasound beamforming, MRI image reconstruction, and CT scan processing benefit from the XCKU040’s combined block RAM, DSP slice density, and I/O bandwidth.
#### Defense and Aerospace (COTS)
The extended temperature range (0°C to +100°C) of the -E suffix makes the XCKU040-3FBVA676E suitable for ruggedized commercial-off-the-shelf (COTS) applications in radar signal processing, electronic warfare, and satellite payload processing.
#### 8K / 4K Ultra High-Definition Video
Real-time video processing at 8K resolution requires massive pixel-processing bandwidth. The XCKU040’s logic density and I/O resources support multi-channel video capture, processing, and display pipelines.
Design Tool Support
The XCKU040-3FBVA676E is fully supported by AMD’s Vivado Design Suite, which provides synthesis, implementation, simulation, and hardware debugging for all Kintex UltraScale devices.
| Tool |
Details |
| Design Suite |
AMD Vivado Design Suite |
| Minimum Vivado Version |
2014.2 and later |
| IP Catalog |
Full access (PCIe, Ethernet, DDR4, etc.) |
| Simulation |
Vivado Simulator, ModelSim, Questasim |
| Debug |
Integrated Logic Analyzer (ILA), VIO, JTAG |
| Programming |
JTAG (direct), QSPI Flash, SD Card, SelectMAP |
| Power Estimation |
Xilinx Power Estimator (XPE) |
Note: Kintex UltraScale devices require the Vivado Design Edition or higher — they are not supported by the free WebPACK edition.
Ordering Information
| Attribute |
Details |
| Manufacturer Part Number |
XCKU040-3FBVA676E |
| Manufacturer |
AMD (Xilinx) |
| Product Category |
FPGAs – Field Programmable Gate Arrays |
| Package |
676-Ball FCBGA (FBVA676) |
| Speed Grade |
-3 |
| Temperature Range |
Extended (0°C to +100°C) |
| Moisture Sensitivity Level (MSL) |
MSL 3 |
| Lead-Free / RoHS |
Yes |
| Warranty |
12 months from date of purchase |
Frequently Asked Questions (FAQ)
#### What does the “E” suffix mean in XCKU040-3FBVA676E?
The “E” at the end of the part number indicates the Extended commercial temperature grade, specifying an operating junction temperature range of 0°C to +100°C. This is distinct from the “I” suffix (Industrial: -40°C to +100°C) and the “C” suffix (Commercial: 0°C to +85°C).
#### What is the difference between XCKU040-3FBVA676E and XCKU040-2FBVA676E?
The only difference is the speed grade. The -3 variant is screened for higher performance with a 1.0V VCCINT supply, achieving higher maximum clock frequencies. The -2 variant operates at 0.95V and offers slightly lower performance but reduced power consumption.
#### Can the XCKU040-3FBVA676E be used in industrial temperature applications?
No. The “E” suffix specifies an extended range (0°C to +100°C). For industrial temperature designs requiring -40°C operation, use the XCKU040-3FBVA676I or equivalent part with an “I” suffix.
#### What PCIe generation does the XCKU040 support?
The XCKU040 includes PCIe Gen3 hard IP blocks supporting up to x8 lanes at 8 Gb/s per lane. PCIe Gen4 is available in the newer Kintex UltraScale+ family.
#### Is XCKU040-3FBVA676E pin-compatible with other XCKU040 676-pin variants?
Yes. All XCKU040 676-pin FBVA variants share the same physical footprint and pinout, making it straightforward to swap speed grades or temperature grades on the same PCB layout.
Summary
The XCKU040-3FBVA676E is AMD’s highest-speed-grade Kintex UltraScale FPGA in the compact 676-pin FCBGA package — combining 530,250 logic cells, 1,920 DSP slices, 21.1 Mb block RAM, and 20 GTH transceivers capable of 16.3 Gb/s into a 27mm × 27mm form factor. Its 20nm process technology and UltraScale architecture deliver ASIC-class routing, clocking, and power efficiency, making it the right choice for demanding DSP, networking, video, and wireless applications where maximum performance is non-negotiable.
