The XCKU060-L1FFVA1517I is a high-performance, low-power Xilinx FPGA from AMD’s Kintex UltraScale family. Manufactured on an advanced 20nm process node, this device delivers the best price-per-performance-per-watt ratio in its class, making it an ideal choice for mid-range to high-end applications in telecommunications, data centers, medical imaging, and industrial design. The “-L1” speed grade designation indicates its ultra-low-power operation at 0.9V VCCINT, while the “I” suffix confirms industrial-grade temperature range support.
What Is the XCKU060-L1FFVA1517I? Overview and Key Highlights
The XCKU060-L1FFVA1517I belongs to AMD Xilinx’s Kintex UltraScale FPGA series — a family purpose-built to deliver next-generation signal processing bandwidth at a mid-range price point. Unlike previous-generation FPGAs, the UltraScale architecture introduces ASIC-like clocking, routing, and logic design methodologies that reduce power consumption while maximizing throughput.
This specific variant features:
- Low-power -1L speed grade operating at 0.9V VCCINT (listed in Vivado as -1LV)
- Industrial temperature range (–40°C to +100°C junction temperature)
- 1517-pin FCBGA package in a 40×40 ball grid array layout
- 580,440 system logic cells and 725,550 CLB flip-flops
- 624 user I/O pins for maximum connectivity
XCKU060-L1FFVA1517I Full Technical Specifications
H3: Core Logic Resources
| Parameter |
Value |
| System Logic Cells |
580,440 |
| CLB Flip-Flops |
725,550 |
| CLB LUTs |
331,680 |
| CLB Count |
51,840 |
| Max Distributed RAM (Kb) |
6,788 |
H3: Memory Resources
| Memory Type |
Quantity / Capacity |
| Block RAM Tiles |
1,080 |
| Total Block RAM (Kb) |
38,000 |
| UltraRAM Blocks |
Not available (UltraScale+ only) |
| Max RAM Bits |
38,912 Kbits |
H3: DSP and Signal Processing
| Parameter |
Value |
| DSP48E2 Slices |
2,760 |
| Peak DSP Performance |
High (optimized for 100G networking & imaging) |
H3: Clocking and Timing
| Parameter |
Value |
| MMCMs |
10 |
| PLLs |
20 |
| Maximum Operating Frequency |
Up to 725 MHz (varies by design) |
| Clock Regions |
10 |
H3: High-Speed Transceivers
| Parameter |
Value |
| GTH Transceivers |
32 |
| Max GTH Data Rate |
16.3 Gb/s |
| PCIe Hard Blocks |
2 × Gen3 x8 |
| Interlaken Hard Blocks |
2 |
H3: I/O and Package
| Parameter |
Value |
| User I/O Pins |
624 |
| Package Type |
FCBGA (Flip-Chip BGA) |
| Package Code |
FFVA1517 |
| Pin Count |
1,517 |
| BGA Layout |
40 × 40 ball grid array |
| HP I/O Banks |
Yes (High-Performance) |
| HD I/O Banks |
Yes (High-Density) |
H3: Electrical and Environmental
| Parameter |
Value |
| VCCINT (Core Voltage) |
0.9V (L1 low-power mode) |
| Speed Grade |
-1L (lowest power, –1LV in Vivado) |
| Temperature Grade |
Industrial (I) |
| Junction Temperature Range |
–40°C to +100°C |
| Process Node |
20nm |
| Moisture Sensitivity Level |
See datasheet |
XCKU060-L1FFVA1517I Part Number Decoder
Understanding the part number helps engineers quickly identify the exact variant for their design:
| Code Segment |
Meaning |
| XC |
Xilinx Commercial Product |
| KU060 |
Kintex UltraScale, 60th density tier |
| -L1 |
Low-power speed grade 1 (0.9V VCCINT) |
| FF |
Flip-Chip package |
| VA |
Package variant identifier |
| 1517 |
1,517 total pin count |
| I |
Industrial temperature range |
Key Features of the Kintex UltraScale Architecture
The XCKU060-L1FFVA1517I is built on Xilinx’s UltraScale architecture, which represents a fundamental advancement over the 7-Series generation. Key architectural features include:
H3: ASIC-like Clocking and Routing
The UltraScale architecture employs clocking and routing methodologies derived from ASIC design, enabling significantly reduced power consumption and more predictable timing closure compared to older FPGA generations.
H3: Advanced DSP Processing
With 2,760 DSP48E2 slices, the XCKU060 delivers the high DSP-to-logic ratio required for compute-intensive workloads such as radar signal processing, image reconstruction, and financial analytics.
H3: High-Speed GTH Transceivers
The 32 GTH transceivers support line rates up to 16.3 Gb/s, enabling protocols like 100G Ethernet, PCIe Gen3, Interlaken, and OTN without the need for external serializer/deserializer chips.
H3: Stacked Silicon Interconnect (SSI) Technology
The broader Kintex UltraScale family supports SSI technology for higher-density variants, enabling large designs that go beyond the limits of monolithic silicon — though the XCKU060 itself is a monolithic device.
H3: Low-Power Operation (-1LV Grade)
The -L1 speed grade (shown as -1LV in Vivado) allows the XCKU060-L1FFVA1517I to run at 0.9V core voltage, making it the lowest-static-power option in the XCKU060 family. This is critical for power-sensitive applications such as portable medical devices, remote sensing equipment, and always-on edge processing systems.
Supported Applications
The XCKU060-L1FFVA1517I is engineered for a broad range of demanding use cases:
H3: 100G Networking and Data Centers
The high-bandwidth GTH transceivers and PCIe Gen3 hard blocks make this device a strong fit for 100G line cards, network switches, and SmartNIC accelerators in cloud and enterprise data center deployments.
H3: Medical Imaging and Diagnostics
The combination of high DSP slice count, large block RAM, and low-power operation suits real-time image reconstruction in CT scanners, MRI systems, ultrasound platforms, and 8K4K video processing.
H3: Wireless Infrastructure and Telecom
The XCKU060’s transceiver density and DSP capabilities address baseband processing in 4G/5G radio access network (RAN) equipment, O-RAN fronthaul/midhaul designs, and satellite communication payloads.
H3: Industrial and Defense Applications
With an industrial temperature rating of –40°C to +100°C, the XCKU060-L1FFVA1517I is rated for harsh environments encountered in industrial automation, LIDAR systems, electronic warfare, and radar signal processing.
H3: Test and Measurement Equipment
High I/O count (624 pins) and versatile transceiver support make this device ideal for protocol analyzers, automated test equipment (ATE), and high-speed signal capture systems.
XCKU060-L1FFVA1517I vs. Other XCKU060 Speed Grades
| Variant |
Speed Grade |
VCCINT |
Temp Range |
Use Case |
| XCKU060-3FFVA1517E |
-3 (Fastest) |
1.0V |
Commercial |
Max performance designs |
| XCKU060-2FFVA1517I |
-2 |
0.95V |
Industrial |
Balanced performance/power |
| XCKU060-1FFVA1517I |
-1 |
0.95V |
Industrial |
Standard industrial |
| XCKU060-L1FFVA1517I |
-1L (Lowest power) |
0.9V |
Industrial |
Low-power industrial |
Design Tools and Software Support
AMD Xilinx provides a complete ecosystem of EDA tools for designing with the XCKU060-L1FFVA1517I:
| Tool |
Description |
| Vivado Design Suite |
Primary IDE for synthesis, implementation, and bitstream generation |
| Vitis Unified Platform |
Software development for embedded and accelerated applications |
| Xilinx Power Estimator (XPE) |
Accurate power analysis before hardware is available |
| System Generator for DSP |
MATLAB/Simulink-based high-level DSP design entry |
| PetaLinux Tools |
Embedded Linux development for FPGA-based SoC designs |
Vivado 2015.4 and later versions support the XCKU060 device family. For designs using the -1LV (L1FFVA1517I) speed grade, Vivado 2015.4 v1.23 or newer is required for correct timing analysis.
PCB Design Considerations
The XCKU060-L1FFVA1517I uses the FFVA1517 package with a 40×40 BGA layout. Engineers should consider the following during PCB design:
H4: Power Supply Requirements
Multiple voltage rails are required:
- VCCINT: 0.9V (core logic — L1 grade)
- VCCAUX: 1.8V (auxiliary logic and I/O)
- VCCO: 1.0V – 3.3V (I/O bank supply, depends on standard)
- MGTAVCC / MGTAVTT: Transceiver analog supplies
H4: Signal Integrity Best Practices
- Minimize via stubs on high-speed differential pairs
- Use controlled-impedance traces for GTH transceiver lanes (typically 100Ω differential)
- Place decoupling capacitors close to each power pin
H4: Thermal Management
Even in low-power mode, junction temperature management is essential. Use thermal simulation with AMD’s XPE tool and ensure adequate heatsinking or airflow for the target operating environment, especially given the industrial temperature requirement.
H4: I/O Planning
The 624 I/O pins are organized into HP (High-Performance) and HD (High-Density) banks. HP banks support high-speed DDR4, QDR, and 1.0V–1.8V standards, while HD banks support a broader voltage range for legacy interfaces.
Ordering Information and Alternatives
H3: Related Part Numbers
| Part Number |
Package |
Pins |
Temp Grade |
Speed Grade |
| XCKU060-L1FFVA1156I |
FFVA1156 |
1,156 |
Industrial |
-1L |
| XCKU060-L1FFVA1517I |
FFVA1517 |
1,517 |
Industrial |
-1L |
| XCKU060-1FFVA1517I |
FFVA1517 |
1,517 |
Industrial |
-1 |
| XCKU060-2FFVA1517I |
FFVA1517 |
1,517 |
Industrial |
-2 |
H3: Functional Alternatives (Higher Density)
- XCKU085-L1FFVA1517I — higher logic density with same package footprint
- XCKU115-L1FLVA1517I — largest Kintex UltraScale device for maximum resource requirements
Frequently Asked Questions (FAQ)
Q: What does the “L1” in XCKU060-L1FFVA1517I mean?
A: The “L1” designates the lowest-power speed grade (-1L), which operates at a core voltage (VCCINT) of 0.9V instead of the standard 0.95V. In Vivado, this device appears as the -1LV speed grade. This reduces static power consumption, making it ideal for power-sensitive designs.
Q: Is the XCKU060-L1FFVA1517I RoHS compliant?
A: Yes. The “I” suffix (industrial grade) and AMD’s standard product compliance practices confirm RoHS-compliant construction. Verify with your distributor’s compliance documentation for your specific lot.
Q: What is the difference between the XCKU060 and XCKU060+?
A: The XCKU060 belongs to the original Kintex UltraScale family (20nm). The Kintex UltraScale+ is a next-generation family built on 16nm FinFET+ technology with additional on-chip UltraRAM memory and improved power efficiency.
Q: Which Vivado version is required for XCKU060-L1FFVA1517I?
A: Vivado Design Suite 2015.4 (speed file v1.23) or later is required for proper support and timing analysis of the XCKU060 family, including the -1LV (L1) speed grade.
Q: Can the XCKU060-L1FFVA1517I operate at 0.95V instead of 0.9V?
A: Yes. The -1L device is screened for both 0.90V and 0.95V VCCINT operation. When operated at 0.95V, the timing performance is equivalent to the standard -1 speed grade, offering design flexibility.
Summary
The XCKU060-L1FFVA1517I is a production-grade, low-power industrial FPGA that balances high logic density, rich DSP and memory resources, and robust high-speed connectivity in a well-supported 1517-pin package. Its 20nm UltraScale architecture, 32 GTH transceivers, 2,760 DSP slices, and 580K+ logic cells address the most demanding signal processing, networking, and imaging workloads — all while maintaining the lowest static power in the XCKU060 family at 0.9V operation.
Whether you are designing a 100G line card, a next-generation medical imaging platform, or an industrial edge compute system, the XCKU060-L1FFVA1517I delivers the performance headroom and ecosystem support needed to bring your design to production.
