The XCKU085-1FLVB1760C is a high-performance, mid-range Xilinx FPGA from AMD’s Kintex UltraScale family. Built on 20nm process technology and housed in a 1760-pin FCBGA package, this device delivers an exceptional balance of DSP processing power, on-chip memory, and high-speed I/O — all at a competitive price-to-performance ratio. Whether you are designing for wireless communications, data center acceleration, broadcast video, or test and measurement systems, the XCKU085-1FLVB1760C is engineered to meet demanding real-world requirements.

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What Is the XCKU085-1FLVB1760C?

The XCKU085-1FLVB1760C is a member of the Kintex UltraScale FPGA series manufactured by AMD (formerly Xilinx). The part number breaks down as follows:

This device features 1,088,325 logic cells, making it one of the most capable devices in the mid-range FPGA market segment.

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Key Specifications at a Glance

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XCKU085-1FLVB1760C Architecture Overview

UltraScale Architecture — Next-Generation FPGA Fabric

The XCKU085-1FLVB1760C is built on AMD’s UltraScale™ architecture, which introduced several significant improvements over previous-generation FPGA platforms:

• ASIC-like clocking: The UltraScale clock network minimizes skew, power, and delay through advanced distribution techniques including Clock Management Tiles (CMTs) with MMCMs and PLLs.
• SSI Technology Support: For XCKU085, Stacked Silicon Interconnect (SSI) technology is leveraged for high-bandwidth die-to-die connectivity within the package.
• Advanced routing: Improved interconnect fabric reduces routing congestion compared to 7-Series devices, enabling higher logic utilization.
• Enhanced power management: Fine-grained power gating and power-optimized speed grades reduce dynamic and static power consumption.

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DSP Performance — 2,760 DSP48E2 Slices

The 2,760 DSP48E2 slices in the XCKU085-1FLVB1760C provide extremely high signal processing bandwidth. Each DSP48E2 slice supports:

• 27×18-bit two’s complement multiplication
• Pre-adder for symmetric filter optimization
• Optional pipeline registers for maximum throughput
• Cascaded operation for wider arithmetic without using fabric LUTs

This makes the device ideal for applications that require massive parallel computation such as radar processing, software-defined radio (SDR), image processing pipelines, and machine learning inference engines.

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On-Chip Memory — 58.3 Mb Block RAM

Block RAM in UltraScale supports ECC (Error Correction Code), independent read/write clocking, and cascading for deeper memory configurations. For bandwidth-sensitive applications, multiple RAM tiles can be combined.

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High-Speed Transceivers — GTH at up to 16.3 Gb/s

The XCKU085-1FLVB1760C includes 32 GTH transceivers, each capable of operating from 500 Mb/s to 16.3 Gb/s. These full-duplex serial links support a broad range of industry protocols:

GTH transceivers feature advanced equalization (DFE and LPM), automatic adaptation, and built-in PRBS pattern generators for signal integrity testing.

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I/O Banks and Interface Support

The HP I/O banks support DDR4 memory interfaces with speeds up to 2,400 Mb/s per pin, enabling high-bandwidth external memory connectivity for applications requiring large data buffers.

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Package and Thermal Characteristics

1760-Pin FCBGA Package Details

Operating Conditions

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Applications and Use Cases

The XCKU085-1FLVB1760C’s combination of logic density, DSP resources, and high-speed serial interfaces makes it a strong fit for a wide range of industries and applications:

Wireless Communications and 5G

With support for CPRI, JESD204B, and 100G Ethernet protocols alongside 2,760 DSP slices, the device is well-suited for Remote Radio Units (RRUs), Distributed Unit (DU) baseband processing, and massive MIMO signal chains in 5G infrastructure deployments.

Data Center and Cloud Acceleration

The two integrated PCIe Gen3 ×8 blocks enable direct integration as a SmartNIC or acceleration card in server platforms. The device can offload compute-intensive tasks such as compression, encryption, and network packet processing from host CPUs.

Test and Measurement

High I/O density (676 user I/O), fast transceivers, and large on-chip memory enable the XCKU085-1FLVB1760C to function as the core of advanced oscilloscopes, logic analyzers, protocol analyzers, and arbitrary waveform generators.

Broadcast Video

The device supports SDI and high-bandwidth video transport protocols. Its high logic density allows complete video processing pipelines — including scaling, color space conversion, and frame buffering — to fit within a single device.

Defense and Aerospace (with appropriate grade)

While the -1FLVB1760C is rated for commercial temperature range, the UltraScale family includes extended and industrial variants of the XCKU085 for more demanding environments.

RADAR and Electronic Warfare

The high DSP slice count and GTH transceiver bandwidth make the device ideal for pulse compression, beamforming, and signal intelligence (SIGINT) processing chains.

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Development Tools and Design Support

Vivado Design Suite

The XCKU085-1FLVB1760C is fully supported by AMD’s Vivado Design Suite, which provides:

• RTL synthesis and implementation optimized for UltraScale architecture
• Vivado High-Level Synthesis (HLS) for C/C++ to RTL compilation
• IP Integrator for block-level design entry
• Xilinx Power Estimator (XPE) for pre-implementation power analysis
• Integrated simulation with Vivado Simulator or third-party simulators

IP Core Ecosystem

AMD/Xilinx provides a rich catalog of verified IP cores for common functions, including PCIe DMA, DDR4 MIG, 100G Ethernet MAC, JESD204B, and Aurora, reducing time-to-market for complex designs.

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Ordering and Compliance Information

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XCKU085-1FLVB1760C vs. Related Variants

The XCKU085 is available in multiple package and speed grade options. The table below compares the most common variants:

The -1FLVB1760C represents the cost-optimized commercial-grade entry point for the XCKU085 die in the mid-density 1760-pin package — the most widely stocked variant for prototyping and production use.

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Frequently Asked Questions

Q: What is the maximum transceiver data rate for the XCKU085-1FLVB1760C?
A: The GTH transceivers support a maximum line rate of 16.3 Gb/s per lane.

Q: Does this device support PCIe Gen3?
A: Yes. It includes two hard PCIe Gen3 blocks, each supporting up to ×8 lane configurations.

Q: What external memory interfaces does the XCKU085-1FLVB1760C support?
A: The device supports DDR4, DDR3, DDR3L, LPDDR3, and QDR SRAM via its HP I/O banks and dedicated memory controllers.

Q: What design software is required?
A: AMD Vivado Design Suite (version 2014.4 or later) is required for synthesis and implementation of XCKU085 designs.

Q: Is the XCKU085-1FLVB1760C RoHS compliant?
A: Yes, this part is fully RoHS compliant.

Q: What is the difference between speed grade -1 and -2?
A: Speed grade -2 offers higher maximum operating frequencies across all fabric elements compared to -1. The -1 grade represents baseline performance while the -2 grade delivers approximately 10–15% improved timing margins, at higher cost.

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Summary

The XCKU085-1FLVB1760C is a production-ready, commercially temperature-rated Kintex UltraScale FPGA offering 1,088,325 logic cells, 2,760 DSP48E2 slices, 58.3 Mb of Block RAM, 32 GTH transceivers, and 676 user I/O pins in a 1760-ball FCBGA package. Built on AMD’s proven 20nm UltraScale architecture, it provides a compelling price-to-performance ratio for mid-range to high-performance applications across 5G wireless, data center acceleration, broadcast video, radar, and test equipment.

Its full support in Vivado Design Suite and access to AMD’s extensive IP core ecosystem means design teams can move efficiently from concept to production. For engineers seeking a scalable, high-bandwidth FPGA platform without the cost of Virtex-class devices, the XCKU085-1FLVB1760C is one of the strongest choices available in the Kintex family.