The XC2S200-6FGG1153C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for engineers and designers seeking a cost-effective yet powerful programmable logic device, this component delivers 200,000 system gates, 5,292 logic cells, and a 1,152-ball Fine-Pitch BGA package — making it one of the most capable members of the Spartan-II lineup. Whether you’re developing communication systems, industrial controls, or embedded computing platforms, the XC2S200-6FGG1153C provides the logic density and I/O flexibility to meet demanding design requirements.

What Is the XC2S200-6FGG1153C?

The XC2S200-6FGG1153C is a member of Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic device built on 0.18µm process technology. The part number encodes its key attributes:

For a broader selection of Spartan and UltraScale devices, explore our full range of Xilinx FPGA parts available for immediate sourcing.

XC2S200-6FGG1153C Key Specifications at a Glance

XC2S200-6FGG1153C Detailed Feature Overview

Configurable Logic Blocks (CLBs) and Logic Resources

The XC2S200-6FGG1153C is built around a 28 × 42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains four logic cells, with each logic cell consisting of:

• A 4-input Look-Up Table (LUT) for combinational logic
• A D-type flip-flop for sequential logic
• A carry chain for fast arithmetic operations
• Dedicated multiplexers for routing flexibility

This architecture gives designers the flexibility to implement complex combinational logic, state machines, arithmetic circuits, and DSP pipelines within a single device.

Memory Architecture: Distributed RAM and Block RAM

Block RAMs in the XC2S200 are dual-port and support various depth/width configurations, making them ideal for FIFOs, buffers, lookup tables, and local data storage.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1153C includes four Delay-Locked Loops (DLLs), one placed at each corner of the die. DLLs provide:

• Clock skew elimination across the device
• Clock multiplication and division
• Phase shifting for precise timing control
• Input clock deskewing for synchronous interfaces

I/O Architecture and High Pin Count

The large FGG1153 package provides an exceptionally high pin count for an XC2S200 device, making it ideal for designs that need to interface with a large number of external devices or buses simultaneously. Key I/O characteristics include:

• Support for multiple I/O standards including LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL, and more
• Programmable drive strength and slew rate control per I/O pin
• Input hysteresis for noise immunity
• 3-state (tri-state) support on all outputs
• Separate VCCO voltage rails per I/O bank for multi-standard interfacing

JTAG Boundary Scan

The XC2S200-6FGG1153C is fully compliant with IEEE 1149.1 (JTAG) Boundary Scan, supporting:

• In-system programming and debugging
• Board-level testing and diagnosis
• Integration with standard JTAG test chains

Spartan-II Family Comparison Table

The XC2S200 is the largest device in the Spartan-II family. Here’s how it compares to its siblings:

The XC2S200 delivers the highest logic density, the largest memory resources, and the most user I/O of any Spartan-II device.

Speed Grade Comparison for XC2S200

Xilinx offered the XC2S200 in multiple speed grades. The -6 speed grade used in the XC2S200-6FGG1153C is the fastest option and is exclusively available in the Commercial temperature range:

The -6 grade is the preferred choice for designs where maximum throughput and minimum propagation delay are critical requirements.

Applications of the XC2S200-6FGG1153C

Communication and Networking Systems

The XC2S200-6FGG1153C is widely deployed in high-speed communication systems. Its large I/O count and fast clock speeds support:

• Protocol bridging (PCIe, UART, SPI, I2C)
• Network packet processing and filtering
• Telecom line card interfaces
• Wireless baseband signal processing

Industrial Automation and Control

For industrial applications, the device supports:

• Multi-axis motor control systems
• PLC (Programmable Logic Controller) replacement
• Process monitoring and feedback loops
• Machine vision pre-processing pipelines

Embedded Computing and Custom Processors

Engineers use the XC2S200-6FGG1153C to implement:

• Soft-core processors (MicroBlaze-compatible designs)
• Custom instruction set architectures
• Hardware accelerators for compute-intensive tasks
• Co-processing alongside embedded ARM or RISC-V cores

Medical and Scientific Instrumentation

The FPGA’s reconfigurability and deterministic timing make it suitable for:

• Medical imaging signal chains (ultrasound, MRI front-end)
• Patient monitoring device interfaces
• High-speed data acquisition systems
• Scientific instrument control logic

Defense and Aerospace (Legacy Designs)

In legacy defense and aerospace programs, the XC2S200 continues to serve in:

• Avionics data buses
• Radar signal preprocessing
• Ruggedized embedded control modules

Package Information: FGG1153 Ball Grid Array

The FGG1153 package is a Pb-Free (lead-free, RoHS-compliant) variant of the FG1153 Fine-Pitch Ball Grid Array. The “G” in FGG denotes the Pb-Free construction.

The large ball count provides an expansive I/O interface, making this package optimal for high pin-count system designs requiring extensive external connectivity.

Configuration and Programming

The Spartan-II FPGA uses SRAM-based configuration, meaning the design is loaded at power-on from an external non-volatile source. Supported configuration modes include:

Xilinx’s ISE Design Suite is the recommended development environment for Spartan-II FPGA designs, supporting VHDL, Verilog, and schematic-based entry flows.

Ordering Information and Part Number Decoder

Understanding the XC2S200-6FGG1153C part number helps when sourcing equivalent or alternative components:

XC2S200 - 6 - FGG - 1153 - C
  |        |    |     |      |
  |        |    |     |      └── Temperature: C = Commercial (0°C to +85°C)
  |        |    |     └──────── Pin Count: 1,153 balls
  |        |    └────────────── Package: FGG = Fine-Pitch BGA, Pb-Free
  |        └─────────────────── Speed Grade: -6 (fastest commercial)
  └──────────────────────────── Device: Spartan-II, 200K system gates

Advantages of the XC2S200-6FGG1153C Over Mask-Programmed ASICs

The XC2S200-6FGG1153C provides a compelling alternative to ASICs for applications where design flexibility, rapid development, and field upgradability are more important than per-unit cost at very high volume.

Frequently Asked Questions (FAQ)

What is the maximum clock frequency of the XC2S200-6FGG1153C?

The XC2S200 Spartan-II FPGA supports system performance up to 200 MHz with the -6 speed grade, depending on design implementation, logic depth, and routing.

Is the XC2S200-6FGG1153C RoHS compliant?

Yes. The FGG suffix in the part number indicates a Pb-Free (lead-free), RoHS-compliant package. Standard packaging (without the second “G”) is not lead-free.

What development software should I use for the XC2S200-6FGG1153C?

Xilinx’s ISE Design Suite is the primary tool for Spartan-II designs. Note that Spartan-II is not supported by newer Vivado tooling, so ISE (version 14.7 is the final release) must be used.

Can the XC2S200-6FGG1153C be used in industrial temperature environments?

No. The “C” suffix designates Commercial temperature range only (0°C to +85°C). For industrial environments (–40°C to +85°C), you would need the “I” temperature variant. Note that the -6 speed grade is exclusively available in the Commercial range.

Is there a recommended alternative or replacement for the XC2S200-6FGG1153C?

For new designs, Xilinx (AMD) recommends migrating to more modern FPGA families such as the Spartan-6 or Artix-7 series, which offer greater logic density, embedded DSP slices, and enhanced I/O standards while remaining cost-effective.

What configuration PROMs are compatible with the XC2S200-6FGG1153C?

Xilinx XCF (Platform Flash) and XC17 series serial PROMs are compatible for Master Serial configuration mode. Parallel Flash devices can be used in Master Parallel mode.

Summary

The XC2S200-6FGG1153C is the top-tier Spartan-II FPGA, combining 200,000 system gates, 5,292 logic cells, dual-ported Block RAM, four Delay-Locked Loops, and a high-density 1,153-ball Pb-Free BGA package into a 2.5V device optimized for commercial temperature applications. With its -6 speed grade delivering up to 200 MHz system performance, it remains a workhorse for communication, industrial, embedded, and instrumentation design — particularly in legacy system maintenance and high I/O count applications.

For sourcing, pricing, and availability of the XC2S200-6FGG1153C and the full range of Spartan-II and other programmable logic devices, explore our curated catalog of Xilinx FPGA components.