The XCKU095-1FFVA1156I is a high-performance Xilinx FPGA from AMD’s Kintex UltraScale family, engineered for demanding mid-range applications that require exceptional signal processing bandwidth, next-generation transceivers, and optimized power efficiency. Built on a proven 20nm process node, this device delivers an outstanding blend of performance, logic capacity, and cost-effectiveness — making it a top choice for 100G networking, data center acceleration, medical imaging, and advanced wireless infrastructure designs.
What Is the XCKU095-1FFVA1156I?
The XCKU095-1FFVA1156I is a field-programmable gate array (FPGA) manufactured by AMD (formerly Xilinx) as part of the Kintex UltraScale product line. It is housed in a 1156-pin FCBGA (Flip-Chip Ball Grid Array) package and is rated for industrial temperature operation (-I grade), making it suitable for environments where reliability and thermal resilience are critical.
This device is identified by the following naming convention breakdown:
| Part Number Element |
Meaning |
| XC |
Xilinx Commercial/Industrial IC |
| KU |
Kintex UltraScale Family |
| 095 |
Device Size Identifier |
| -1 |
Speed Grade 1 (Standard) |
| FFVA |
Flip-Chip Fine-Pitch BGA Package Type |
| 1156 |
1156 Pin Count |
| I |
Industrial Temperature Range |
XCKU095-1FFVA1156I Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Series |
Kintex UltraScale |
| Part Number |
XCKU095-1FFVA1156I |
| Technology Node |
20nm |
| Logic Cells (Macrocells) |
1,176,000 |
| Logic Blocks (CLBs) |
537,600 |
| Total I/O Count |
520 |
| Maximum Clock Frequency |
630 MHz |
| Total RAM Bits |
60,518 Kbit |
| Operating Voltage |
922 mV – 979 mV (nominal 0.95V) |
| Package |
FCBGA-1156 (FC-BGA) |
| Temperature Grade |
Industrial (-I) |
| Clock Resources |
MMCM, PLL |
| Speed Grade |
-1 |
| RoHS Compliant |
Yes |
XCKU095-1FFVA1156I Detailed Technical Description
UltraScale Architecture: The Foundation of Performance
The XCKU095-1FFVA1156I is built on AMD’s UltraScale™ architecture — a significant advancement that delivers ASIC-like system-level performance. Unlike previous-generation FPGAs, the UltraScale architecture introduces a new routing and interconnect methodology that eliminates long-standing bottlenecks in timing closure, enabling designers to achieve higher clock frequencies and greater design predictability.
The architecture is optimized for both monolithic die implementations and next-generation stacked silicon interconnect (SSI) technology, allowing AMD to scale device capacity without sacrificing signal integrity or power efficiency.
Logic Resources and Programmable Fabric
With 1,176,000 macrocells and 537,600 logic blocks, the XCKU095-1FFVA1156I offers substantial programmable logic resources suitable for the most complex FPGA designs. The configurable logic blocks (CLBs) are interconnected via a high-performance routing fabric that supports efficient pipelining and parallel processing — essential for DSP-heavy and data-intensive workloads.
Memory Architecture: On-Chip RAM Resources
| Memory Type |
Specification |
| Total RAM Bits |
60,518 Kbit |
| Block RAM (BRAM) |
High-density, distributed throughout fabric |
| UltraRAM |
Included for high-bandwidth data buffering |
The combination of traditional Block RAM and UltraRAM allows system designers to significantly reduce external memory requirements, lowering total BOM (Bill of Materials) cost and simplifying PCB layout.
DSP Processing Capabilities
The XCKU095-1FFVA1156I includes a large number of hardened DSP48E2 slices, enabling it to handle the highest signal processing bandwidth among mid-range FPGA devices. Key DSP use cases include:
- 8K/4K Ultra HD video processing pipelines
- Next-generation medical imaging (MRI, CT, ultrasound)
- Digital beamforming and 5G wireless baseband processing
- Scientific instrumentation and radar signal processing
- High-frequency trading (HFT) algorithms
I/O and Transceiver Resources
| I/O Feature |
Details |
| Total User I/Os |
520 |
| Package |
FCBGA-1156 |
| Transceiver Type |
Next-generation GTH/GTY |
| Supported Protocols |
PCIe, 100G Ethernet, 150G Interlaken, SATA, USB |
| I/O Voltage Standards |
LVCMOS, LVDS, HSTL, SSTL, and more |
The 520 user-configurable I/O pins support a wide array of single-ended and differential signaling standards, giving hardware designers the flexibility to interface with virtually any industry-standard bus or protocol.
Clock Management Resources
The XCKU095-1FFVA1156I features robust clock management infrastructure, including:
- MMCM (Mixed-Mode Clock Manager) – For flexible clock synthesis, phase shifting, and frequency scaling
- PLL (Phase-Locked Loop) – For low-jitter clock multiplication and division
- Maximum Clock Frequency: 630 MHz – Enabling high-throughput pipelined designs
These clocking primitives allow complex multi-clock domain designs to be implemented reliably, with tight control over phase relationships and clock skew.
XCKU095-1FFVA1156I Package Information
| Package Parameter |
Details |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Package Code |
FFVA1156 |
| Pin Count |
1156 |
| Body Size |
Fine-pitch BGA |
| Mounting Style |
Surface Mount (SMT) |
| Tray/Packaging |
Tray |
The FCBGA-1156 package is designed for high-density PCB applications where signal integrity and power delivery are paramount. The flip-chip bump technology enables shorter die-to-ball trace lengths, which is critical for maintaining signal fidelity at high data rates.
Temperature Grade and Reliability: Industrial “-I” Designation
The “I” suffix in XCKU095-1FFVA1156I denotes an Industrial Temperature Grade, meaning the device is specified to operate reliably across the full industrial temperature range of –40°C to +100°C (junction temperature). This makes it suitable for:
- Telecom and networking equipment deployed in unconditioned environments
- Industrial automation and control systems
- Military-adjacent commercial (COTS) applications
- Outdoor or edge computing deployments
Applications and Use Cases for the XCKU095-1FFVA1156I
100G Networking and Data Center Applications
The XCKU095-1FFVA1156I is specifically optimized for packet processing in 100G Ethernet environments. Its combination of high-speed transceivers, large logic fabric, and on-chip memory makes it ideal for:
- Network interface cards (NICs) and SmartNICs
- Data center switching fabrics
- Network packet inspection and classification engines
- Offload accelerators for cloud and hyperscale infrastructure
Wireless Infrastructure and 5G Radio
For wireless OEMs developing next-generation radio access network (RAN) equipment, this device offers the right blend of DSP horsepower and transceiver bandwidth for:
- Massive MIMO baseband processing
- Digital pre-distortion (DPD)
- Heterogeneous network (HetNet) aggregation
- Fronthaul and midhaul processing (eCPRI, CPRI)
Medical Imaging Systems
Medical device manufacturers rely on Kintex UltraScale FPGAs for high-resolution, real-time imaging applications including:
- Ultrasound beamforming and image reconstruction
- MRI gradient waveform control
- CT scan data acquisition front-ends
- High-speed fluoroscopy readout
Broadcast and Professional Video
The high DSP capacity and memory bandwidth of the XCKU095-1FFVA1156I make it an excellent fit for:
- 8K/4K real-time video processing
- SDI/HDMI/DisplayPort protocol bridging
- Video compression (HEVC, AVC acceleration)
- Studio-grade signal routing and conversion equipment
Development Tools and Software Support
The XCKU095-1FFVA1156I is fully supported by AMD’s Vivado Design Suite, which provides:
| Tool |
Functionality |
| Vivado HLS |
High-level synthesis from C/C++/SystemC |
| Vivado IP Integrator |
Block design with pre-verified IP cores |
| Vivado Simulator |
Functional and timing simulation |
| Vitis Unified Platform |
Hardware/software co-design flow |
| MicroBlaze Soft Processor |
Embedded processing up to 200+ DMIPs |
The MicroBlaze™ soft processor, when deployed on this device, can achieve over 200 DMIPs with 800 Mb/s DDR3 support, enabling sophisticated embedded control alongside the FPGA fabric.
XCKU095-1FFVA1156I vs. Related Kintex UltraScale Devices
| Part Number |
Logic Cells |
I/Os |
Package Pins |
Temp Grade |
| XCKU025-1FFVA1156I |
318,150 |
520 |
1156 |
Industrial |
| XCKU040-1FFVA1156I |
~522,800 |
520 |
1156 |
Industrial |
| XCKU060-1FFVA1156I |
~725,600 |
520 |
1156 |
Industrial |
| XCKU095-1FFVA1156I |
1,176,000 |
520 |
1156 |
Industrial |
| XCKU095-1FFVC1517I |
1,176,000 |
624 |
1517 |
Industrial |
The XCKU095-1FFVA1156I offers the highest logic cell count in the 1156-pin package footprint, making it the preferred choice for designers who need maximum capacity while maintaining pin-count compatibility with smaller family members.
Ordering Information
| Field |
Value |
| Manufacturer Part Number |
XCKU095-1FFVA1156I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Category |
Embedded FPGAs (Field Programmable Gate Arrays) |
| ECCN (Export Classification) |
3A991.d |
| USHTS Code |
8542390001 |
| TARIC Code |
8542399000 |
| Packaging |
Tray |
| RoHS Status |
RoHS Compliant |
Frequently Asked Questions (FAQ)
Q: What is the XCKU095-1FFVA1156I used for? A: It is primarily used in 100G networking, data center compute acceleration, 5G wireless baseband, medical imaging, 8K/4K video processing, and industrial control applications that require high logic density and industrial-grade reliability.
Q: What does the “-1” speed grade mean? A: The “-1” indicates the standard (base) speed grade within the Kintex UltraScale family. Higher speed grades (e.g., -2, -3) offer faster timing at higher cost; the -1 grade provides a strong balance of performance and price.
Q: What design software supports this FPGA? A: The XCKU095-1FFVA1156I is supported by AMD Vivado Design Suite and the Vitis Unified Software Platform, both available from AMD’s official website.
Q: Is the XCKU095-1FFVA1156I RoHS compliant? A: Yes, this part is fully RoHS compliant and meets international environmental regulations for hazardous substances in electronics.
Q: What is the operating voltage for this device? A: The core voltage (VCCINT) operates between 922 mV and 979 mV, with a nominal value of 0.95V.
Summary: Why Choose the XCKU095-1FFVA1156I?
The XCKU095-1FFVA1156I stands out as a premier mid-range FPGA solution for demanding industrial and communications applications. With its 1.17 million logic cells, 60,518 Kbit of on-chip RAM, 520 I/Os, 630 MHz maximum operating frequency, and full industrial temperature coverage, it delivers the performance headroom engineers need — all within the compact and board-friendly 1156-pin FCBGA footprint.
Whether you are designing the next generation of 100G network switches, pushing the boundaries of real-time medical imaging, or developing 5G radio platforms, the XCKU095-1FFVA1156I provides the logic density, memory bandwidth, and transceiver capability to get your product to market with confidence.
