The XCKU095-1FFVB1760C is a high-performance field-programmable gate array (FPGA) manufactured by Xilinx (now AMD), belonging to the Kintex UltraScale family. Built on a 20nm process node, this device delivers an exceptional balance of processing power, logic density, and I/O flexibility — making it one of the most capable mid-range FPGAs available for demanding embedded, communications, and signal processing applications.

Whether you are an FPGA engineer evaluating devices for a new design or a procurement specialist sourcing components, this guide covers everything you need to know about the XCKU095-1FFVB1760C: its key specifications, architecture highlights, pin configuration, and target applications.

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What Is the XCKU095-1FFVB1760C?

The XCKU095-1FFVB1760C is part of the Xilinx Kintex UltraScale series — a family designed to offer the best price-to-performance-per-watt ratio in a mid-range FPGA. The part number breaks down as follows:

This naming convention confirms the device is a commercial-grade, speed grade -1 variant in a 1760-pin FCBGA package, optimized for cost-sensitive production designs that do not require extreme operating temperatures or maximum switching performance.

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XCKU095-1FFVB1760C Key Specifications

Core Device Parameters

Memory Resources

DSP & Arithmetic Resources

I/O & Transceiver Specifications

Clocking & Power

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XCKU095-1FFVB1760C Package & Pin Configuration

The FFVB1760 package is a 1760-ball flip-chip fine-pitch BGA with a body size designed for high-density PCB layouts. This package is footprint-compatible with other XCKU095 variants in the same “B1760” footprint, enabling design migration between speed grades without board redesign.

For detailed pinout information, refer to UG575 – Kintex UltraScale and Virtex UltraScale FPGAs Packaging and Pinouts User Guide from AMD/Xilinx.

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Kintex UltraScale Architecture Overview

The XCKU095-1FFVB1760C is built on Xilinx’s UltraScale architecture, which introduced several significant improvements over the previous 7-Series platform:

Configurable Logic Blocks (CLBs)

Each CLB in the UltraScale architecture contains 6-input LUTs and flip-flops, and additionally supports shift register operation, multiplexer logic, carry chain logic, and configurable distributed RAM. This gives designers maximum flexibility for both datapath and control logic implementation.

DSP48E2 Slices

The DSP48E2 slice features a 27-bit pre-adder, 27×18 multiplier, and a 96-bit XOR function, enabling high-throughput arithmetic for signal processing, FEC, CRC computation, and floating-point operations. With 2,760 DSP slices, the XCKU095 is well-suited for compute-intensive workloads.

Block RAM

UltraScale block RAM adds hardened memory cascade capability, enabling larger RAM structures without consuming additional routing resources. Each 36 Kb tile also supports built-in FIFO logic and ECC, reducing design complexity for memory-intensive applications.

Transceivers

The XCKU095 supports GTH and GTY transceivers capable of operating up to 16.3 Gb/s per lane. These enable high-bandwidth serial protocols including 100G Ethernet, PCIe Gen3, JESD204B, Interlaken, and other industry-standard interfaces critical to communications infrastructure.

Clock Management

The device includes 12 MMCMs and 12 PLLs that provide highly flexible clock synthesis, de-skew, and distribution. The clock network minimizes skew and power while integrating tightly with dedicated DDR4 memory interface circuitry, supporting the most demanding high-performance memory subsystem designs.

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XCKU095-1FFVB1760C vs Other XCKU095 Variants

Designers often need to compare variants within the XCKU095 subfamily. The key differentiators are speed grade, package, and temperature range:

The -1FFVB1760C variant is the preferred choice for commercial-temperature production designs that require the maximum I/O count (702) in this device density, where the slightly reduced switching performance of speed grade -1 is acceptable in exchange for lower power consumption and better pricing.

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Target Applications for the XCKU095-1FFVB1760C

The XCKU095-1FFVB1760C is a versatile FPGA well suited for a wide range of demanding applications:

Wireless & Wired Communications

The device’s high transceiver count and 100G Ethernet support make it ideal for line cards, base station processing, and network packet processing at 40G/100G speeds.

Defense & Aerospace (Commercial Grade)

High logic density and robust DSP performance support radar signal processing, software-defined radio (SDR), and SIGINT applications in commercial-temperature environments.

Test & Measurement

Large block RAM capacity and high I/O count enable high-speed data acquisition, pattern generation, and protocol analysis instrumentation.

High-Performance Computing (HPC) Acceleration

PCIe Gen3 connectivity and 2,760 DSP slices allow the XCKU095 to serve as a hardware accelerator card for machine learning inference, financial analytics, and data compression.

Video & Broadcast

The combination of high-bandwidth transceivers, large memory, and DSP resources supports 4K/8K video processing, broadcast encoding, and image signal processing pipelines.

Industrial & Medical Imaging

The FPGA’s deterministic execution, DDR4 interface support, and reconfigurability are valuable in CT/MRI reconstruction, industrial machine vision, and real-time control systems.

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Design Tools & Software Support

The XCKU095-1FFVB1760C is fully supported by the Xilinx Vivado Design Suite (minimum version: Vivado 2015.3 for initial support; Vivado 2016.4 with speed spec v1.24 for production designs). Vivado provides:

• RTL synthesis and implementation
• Timing analysis and constraint management
• IP Integrator for block design
• Xilinx Power Estimator (XPE) for power budgeting
• Partial reconfiguration support

For designs using bank 65 VCCO at 3.3V with PCIe or System Monitor I2C, Vivado 2015.4 or later is required per Xilinx Design Advisory.

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Why Choose the XCKU095-1FFVB1760C?

For engineers exploring Xilinx FPGA solutions, the XCKU095-1FFVB1760C represents one of the strongest value propositions in the mid-range segment:

• High logic density (1.176M cells) for complex multi-function designs
• 702 user I/Os in the B1760 package for maximum connectivity
• 2,760 DSP slices enabling compute-heavy DSP/ML/FEC workloads
• 60.5 Mb of block RAM with hardened FIFO and ECC
• 16.3 Gb/s serial transceivers for high-speed serial protocol support
• Commercial-grade pricing with 20nm low-power process efficiency
• Full Vivado toolchain support for rapid design implementation

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XCKU095-1FFVB1760C Frequently Asked Questions

What is the XCKU095-1FFVB1760C used for?

The XCKU095-1FFVB1760C is used in high-performance embedded applications including 100G networking line cards, radar and signal processing systems, hardware accelerators, broadcast video processing, and test & measurement equipment.

What package does the XCKU095-1FFVB1760C use?

It uses a 1760-pin Flip-Chip Fine Pitch BGA (FCBGA) package, designated FFVB1760. The total pin count is 1,760 with 702 user I/O pins available.

What is the operating voltage for the XCKU095-1FFVB1760C?

The core supply voltage (VCCINT) is 0.95V, with an operating range of 0.922V to 0.979V.

What temperature range does the XCKU095-1FFVB1760C support?

The “C” suffix denotes a commercial temperature grade, supporting junction temperatures from 0°C to +85°C. Industrial variants (suffix “I”) support –40°C to +100°C.

Is the XCKU095-1FFVB1760C in production?

Yes, the XCKU095 family at speed grades -1 and -2 is in full production status per Xilinx DS892.

What programming software supports the XCKU095-1FFVB1760C?

The device is supported by Xilinx Vivado Design Suite, starting from version 2015.3. Production designs should use Vivado 2016.4 or later with speed specification version v1.24.

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Summary

The XCKU095-1FFVB1760C is a production-ready, commercial-grade Kintex UltraScale FPGA that delivers 1.176 million logic cells, 702 user I/Os, 2,760 DSP slices, and 60.5 Mb of block RAM in a 1760-pin FCBGA package. Running on a 20nm process at 0.95V core voltage, it offers the ideal blend of logic density, high-speed serial connectivity, and DSP throughput for mid-to-high-end FPGA designs across communications, defense, computing, and industrial markets.