The XCKU095-2FFVB1760E is a high-performance Xilinx FPGA from the Kintex UltraScale family, manufactured by AMD (formerly Xilinx). Engineered on a 20nm process node, this device delivers an exceptional balance of signal processing bandwidth, transceiver performance, and power efficiency — making it one of the most capable mid-range FPGAs available for demanding applications such as 100G networking, wireless communications, data centers, and defense electronics.
Whether you’re designing high-throughput packet processing pipelines, advanced DSP systems, or complex protocol offload engines, the XCKU095-2FFVB1760E provides the logic density, memory resources, and I/O flexibility to meet your design requirements.
What Is the XCKU095-2FFVB1760E?
The XCKU095-2FFVB1760E is a Field Programmable Gate Array (FPGA) belonging to Xilinx’s Kintex UltraScale product family. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC |
Xilinx Commercial device |
| KU |
Kintex UltraScale family |
| 095 |
Device density identifier |
| -2 |
Speed grade (standard -2 performance) |
| FFVB |
FCBGA package type |
| 1760 |
1760-pin count |
| E |
Extended commercial temperature (0°C to +100°C) |
XCKU095-2FFVB1760E Key Specifications
Core Device Specifications
| Parameter |
Value |
| Family |
Kintex UltraScale |
| Manufacturer |
AMD / Xilinx |
| Process Technology |
20nm |
| Logic Cells |
1,176,000 |
| CLB LUTs |
~537,600 |
| CLB Flip-Flops |
~1,075,200 |
| DSP Slices |
5,520 |
| Block RAM (Mb) |
75.9 |
| UltraRAM (Mb) |
0 (Kintex UltraScale; available in UltraScale+) |
| Total I/O Pins |
702 |
| Package |
1760-Pin FCBGA (FFVB1760) |
| Speed Grade |
-2 (standard) |
| Core Supply Voltage (VCCINT) |
0.95V |
| Operating Temperature |
0°C to +100°C (Commercial/Extended) |
Transceiver and High-Speed I/O Specifications
| Parameter |
Value |
| GTH Transceivers |
32 |
| GTH Transceiver Line Rate |
Up to 16.3 Gb/s |
| PCIe Gen3 Blocks |
2 × PCIe Gen3 x8 |
| 100G Ethernet MAC |
Yes (integrated) |
| 150G Interlaken |
Yes |
| CMAC (100G) |
Supported |
| Interlaken |
150G supported |
Clock Management Resources
| Resource |
Count |
| MMCM (Mixed-Mode Clock Manager) |
12 |
| PLL |
12 |
| Max Clock Frequency |
725 MHz |
| Global Clock Buffers |
544 |
Package & Physical Characteristics
| Parameter |
Value |
| Package Type |
Flip-Chip Ball Grid Array (FCBGA) |
| Package Designation |
FFVB1760 |
| Ball Count |
1760 |
| Package Body Size |
45mm × 45mm |
| Ball Pitch |
1.0mm |
| Mounting Type |
Surface Mount |
| Operating Temperature Range |
0°C to +100°C |
| Packaging / Shipping Form |
Tray |
XCKU095-2FFVB1760E vs. Other Kintex UltraScale Variants
Understanding where the XCKU095-2FFVB1760E sits within the broader Kintex UltraScale family helps engineers select the right device for their design.
| Part Number |
Speed Grade |
Package |
I/Os |
Temperature |
Logic Cells |
| XCKU095-1FFVB1760C |
-1 |
FFVB1760 |
702 |
Commercial |
1,176,000 |
| XCKU095-1FFVB1760I |
-1 |
FFVB1760 |
702 |
Industrial |
1,176,000 |
| XCKU095-2FFVB1760E |
-2 |
FFVB1760 |
702 |
Extended |
1,176,000 |
| XCKU095-2FFVB1760I |
-2 |
FFVB1760 |
702 |
Industrial |
1,176,000 |
| XCKU095-2FFVB2104E |
-2 |
FFVB2104 |
702 |
Extended |
1,176,000 |
| XCKU095-2FFVA1156E |
-2 |
FFVA1156 |
520 |
Extended |
1,176,000 |
The -2 speed grade in the XCKU095-2FFVB1760E indicates it operates at higher performance levels compared to -1 devices, making it suitable for designs requiring maximum throughput and minimum latency.
Kintex UltraScale Architecture: What Makes It Powerful
UltraScale ASIC-Class Architecture
The XCKU095-2FFVB1760E is built on Xilinx’s UltraScale architecture — the industry’s first ASIC-class programmable architecture. Unlike previous-generation FPGAs, UltraScale devices eliminate the routing bottlenecks and resource starvation issues common in older architectures by using ASIC-like clocking, routing, and logic placement methodologies.
High DSP-to-Logic Ratio for Signal Processing
The Kintex UltraScale family is purpose-built for DSP-intensive workloads. With 5,520 DSP48E2 slices, the XCKU095-2FFVB1760E supports computationally demanding applications including:
- FIR and IIR digital filters
- Fast Fourier Transforms (FFT)
- Floating-point arithmetic pipelines
- Machine learning inference acceleration
- Software-defined radio (SDR) processing
Each DSP48E2 slice can perform a 27×18 multiplier-accumulator operation per clock cycle, delivering aggregate multiply-accumulate throughput that rivals dedicated ASIC solutions.
Next-Generation GTH Transceivers
The 32 integrated GTH transceivers on the XCKU095-2FFVB1760E support line rates up to 16.3 Gb/s per lane. These transceivers enable:
- 100G Ethernet (4×25G or 10×10G configurations)
- PCIe Gen3 ×8 dual-block connectivity
- CPRI/OBSAI for wireless fronthaul
- Interlaken (up to 150G aggregated bandwidth)
- SRIO, JESD204B, and custom serial protocols
Abundant Block RAM for High-Bandwidth Memory
With 75.9 Mb of on-chip Block RAM organized in true dual-port configuration, the XCKU095-2FFVB1760E offers flexible, high-bandwidth memory storage ideal for:
- Packet buffering in network processing
- Line-rate lookup tables (TCAM replacement)
- Frame buffers for video processing
- Circular buffers in DSP pipelines
- On-chip FIFOs for clock domain crossing
XCKU095-2FFVB1760E Applications
The combination of logic density, transceiver capability, and DSP resources makes the XCKU095-2FFVB1760E well suited for a wide range of applications across multiple industries.
Networking and Data Center Applications
| Application |
Relevant Features |
| 100G Ethernet Line Cards |
GTH transceivers, 100G CMAC, PCIe Gen3 |
| Packet Classification Engines |
Large Block RAM, CLB logic density |
| Network Function Virtualization (NFV) |
PCIe Gen3 x8, high I/O count |
| SmartNIC Acceleration |
DSP slices, memory bandwidth, transceivers |
| Optical Transport (OTN/OTU4) |
100G framer support, GTH transceivers |
Wireless Communications
| Application |
Relevant Features |
| 4G/5G Base Station BBU |
CPRI/eCPRI transceivers, DSP density |
| Massive MIMO Processing |
5,520 DSP slices, high clock frequency |
| Beamforming Algorithms |
FFT processing, CLB logic |
| Software Defined Radio (SDR) |
Flexible I/O, high-speed ADC/DAC interfaces |
Defense and Aerospace
| Application |
Relevant Features |
| Radar Signal Processing |
DSP-heavy pipelines, high frequency |
| EW / Electronic Warfare |
Wideband processing, ruggedized design |
| Secure Communications |
Encryption IP cores, high bandwidth |
Broadcast and Video
| Application |
Relevant Features |
| 4K/8K Video Processing |
High logic density, Block RAM |
| HEVC/H.264 Encoding Pipelines |
DSP slices, high memory bandwidth |
| Real-Time Image Processing |
Low latency, configurable logic |
Development Tools and Ecosystem
Vivado Design Suite
The XCKU095-2FFVB1760E is fully supported by AMD’s Vivado Design Suite, which provides:
- RTL synthesis and implementation
- Timing analysis and constraint management
- IP Integrator for block-level design
- Bitstream generation and device programming
- Power estimation via Power Design Manager
Vitis Unified Software Platform
For software-defined hardware acceleration workflows, the Vitis platform enables:
- High-Level Synthesis (HLS) from C/C++
- OpenCL-based hardware acceleration
- AI inference deployment via Vitis AI
- Hardware emulation and co-simulation
Supported Design Flows
| Tool |
Use Case |
| Vivado |
RTL-to-bitstream flow |
| Vitis HLS |
C/C++ to HDL synthesis |
| Vitis AI |
Neural network acceleration |
| IP Integrator |
Block diagram-based design |
| MIG |
DDR4/LPDDR4 memory controller |
| IBERT |
Transceiver characterization |
Ordering Information
| Parameter |
Value |
| Manufacturer Part Number |
XCKU095-2FFVB1760E |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Kintex UltraScale FPGA |
| Package |
1760-Ball FCBGA, Tray |
| RoHS Compliance |
Yes |
| Lifecycle Status |
Active / Production |
| ECCN (Export Control) |
3A001.a.7 (verify current classification) |
| HTS Code |
8542.39.0001 |
Frequently Asked Questions (FAQ)
What is the XCKU095-2FFVB1760E?
The XCKU095-2FFVB1760E is a Kintex UltraScale FPGA from AMD/Xilinx featuring 1,176,000 logic cells, 702 user I/Os, 32 GTH transceivers, and 5,520 DSP slices. It is packaged in a 1760-pin FCBGA and operates at a core voltage of 0.95V with an extended commercial temperature range.
What is the speed grade of the XCKU095-2FFVB1760E?
The “-2” in the part number denotes the standard speed grade within the Kintex UltraScale family, supporting clock frequencies up to 725 MHz. A “-1” (lower performance) and “-3” (if available) variant may also exist for power-optimized or ultra-high-performance applications.
What is the difference between the “E” and “I” suffix?
The “E” suffix indicates an Extended Commercial temperature range (0°C to +100°C), while the “I” suffix indicates an Industrial temperature range (−40°C to +100°C). For designs that must operate in harsher thermal environments, the XCKU095-2FFVB1760I is recommended.
Is the XCKU095-2FFVB1760E RoHS compliant?
Yes, the XCKU095-2FFVB1760E is manufactured in compliance with RoHS (Restriction of Hazardous Substances) directives.
What transceiver line rate does the XCKU095-2FFVB1760E support?
The device integrates 32 GTH transceivers capable of operating up to 16.3 Gb/s per channel, supporting protocols including 100G Ethernet, PCIe Gen3, CPRI, Interlaken, and more.
Does the XCKU095-2FFVB1760E support PCIe?
Yes. The device includes two integrated PCIe Gen3 x8 hard IP blocks, enabling direct CPU-to-FPGA connectivity for server and data center acceleration use cases.
Summary
The XCKU095-2FFVB1760E is a production-ready, high-performance FPGA that brings together massive logic density, high-speed serial connectivity, and rich DSP resources in a cost-effective 20nm mid-range platform. Backed by AMD’s Vivado and Vitis design ecosystems, it is an ideal device for engineers building next-generation networking infrastructure, 5G wireless systems, defense electronics, and data center acceleration solutions.
For a broader overview of compatible Xilinx devices and procurement options, visit Xilinx FPGA.
