The XCKU095-2FFVB2104E is a high-performance, mid-range Xilinx FPGA from AMD’s Kintex UltraScale family, built on a proven 20nm process node. Designed to deliver the best price/performance/watt in its class, this device combines massive logic density, industry-leading DSP bandwidth, and next-generation high-speed serial transceivers — all in a large, fully featured 2104-pin Flip-Chip BGA package. Whether you are developing 100G networking line cards, data center accelerators, advanced medical imaging systems, or heterogeneous wireless infrastructure, the XCKU095-2FFVB2104E delivers the capability and scalability your design demands.

---

What Is the XCKU095-2FFVB2104E?

The XCKU095-2FFVB2104E belongs to AMD’s Kintex UltraScale FPGA product family — a series positioned between the cost-optimized Artix devices and the premium Virtex line. The part number breaks down as follows:

This device is manufactured and sold under the AMD brand following AMD’s acquisition of Xilinx, though it remains fully compatible with the Xilinx Vivado Design Suite toolchain.

---

XCKU095-2FFVB2104E Key Specifications

The table below summarizes the primary technical attributes of the XCKU095-2FFVB2104E as documented in the Kintex UltraScale datasheet and AMD/Xilinx product selection guides.

---

XCKU095-2FFVB2104E Logic Resources in Detail

CLB and LUT Architecture

The XCKU095 uses the UltraScale configurable logic block (CLB) architecture, which is based on 6-input LUTs (LUT6). Each CLB contains eight 6-input LUTs and sixteen flip-flops. With 537,600 LUTs and 537,600 flip-flops, the XCKU095-2FFVB2104E supports highly complex, resource-intensive designs such as packet processing pipelines, video processing engines, and large state machine implementations.

DSP Resources

The device includes 4,100 DSP48E2 slices, each capable of executing a 27×18 multiply-accumulate (MACC) operation per clock cycle. At 725 MHz (-2 speed grade), this translates to exceptionally high signal processing throughput, making the XCKU095-2FFVB2104E a top choice for applications such as:

• Software-defined radio (SDR) and 5G baseband processing
• Medical imaging reconstruction (CT, MRI, ultrasound)
• 8K/4K video processing and codec acceleration
• Radar and LIDAR signal processing

Block RAM

The XCKU095-2FFVB2104E provides approximately 59 Mb of on-chip Block RAM, arranged in 36Kb true dual-port tiles. This large on-chip memory pool enables efficient buffering, data caching, and lookup table storage without requiring costly off-chip memory accesses for latency-sensitive operations.

---

High-Speed Serial Transceivers

The XCKU095-2FFVB2104E is equipped with 64 high-speed serial transceivers — 32 GTH and 32 GTY — offering a total aggregate bandwidth of up to ~1,220 Gb/s (full duplex). In the KU095 device, GTY transceivers are limited to 16.3 Gb/s (same as GTH), unlike the 30.5 Gb/s GTY in Virtex UltraScale devices.

These transceivers enable the XCKU095-2FFVB2104E to directly implement:

• PCIe Gen3 ×8 or ×16 hard IP cores
• 100G Ethernet MAC (IEEE 802.3)
• 150G Interlaken interfaces
• CPRI/eCPRI for wireless fronthaul
• OTN/SONET/SDH for telecom line cards

---

I/O Capabilities and Package Details

Pin and I/O Overview

In the FFVB2104 package, the XCKU095 provides 702 maximum user I/Os, split across high-performance (HP) and high-range (HR) I/O banks.

HP I/O banks support calibrated on-die termination (DCI) and are optimized for high-speed interfaces including DDR4 memory, PCIe, and Ethernet PHYs. HR I/O banks allow interfacing with 3.3V legacy peripherals and standard GPIO.

Package Footprint Compatibility

The FFVB2104 (B2104 footprint) package is footprint-compatible with other UltraScale family devices sharing the same sequence, facilitating board-level scalability and design reuse across the Kintex and Virtex UltraScale families.

---

Clock Management Resources

The XCKU095-2FFVB2104E includes 16 MMCMs (Mixed-Mode Clock Managers) and 16 PLLs, arranged across the device for flexible, low-skew clock distribution. These resources support:

• Clock synthesis and frequency multiplication
• Phase shifting and fine-delay adjustment
• Spread-spectrum clocking for EMI reduction
• MMCM cascade for wide frequency range coverage

---

XCKU095-2FFVB2104E Part Number Ordering Information

---

Supported Design Tools and IP

The XCKU095-2FFVB2104E is fully supported by the Xilinx Vivado Design Suite (2015.3 and later), which provides:

• HDL synthesis and implementation (VHDL, Verilog, SystemVerilog)
• IP Integrator (block design environment)
• Timing-driven place and route
• Power analysis via Xilinx Power Estimator (XPE)
• In-system debugging via Integrated Logic Analyzer (ILA) and Virtual Input/Output (VIO)

Vivado HLS (High-Level Synthesis) and Vitis HLS are also supported, allowing C/C++-to-FPGA design flows for algorithm acceleration.

---

Typical Applications for XCKU095-2FFVB2104E

The combination of high logic density, 4,100 DSP slices, 64 transceivers, and extended temperature rating makes the XCKU095-2FFVB2104E suitable for demanding applications across multiple markets:

---

XCKU095-2FFVB2104E vs. Related Kintex UltraScale Devices

Buyers evaluating the XCKU095-2FFVB2104E often compare it to adjacent devices in the Kintex UltraScale family:

The XCKU095 occupies a unique position in the lineup as the only device combining both GTH and GTY transceivers, giving it exceptional flexibility for high-bandwidth, mixed-protocol system designs.

---

Power Supply Requirements

The XCKU095-2FFVB2104E requires multiple power rails, consistent with all UltraScale devices:

Proper power sequencing (VCCINT → VMGTAVCC → VMGTAVTT) is required to minimize transient currents during power-on.

---

Frequently Asked Questions

Q: What is the difference between XCKU095-2FFVB2104E and XCKU095-2FFVB2104I? The only difference is the temperature grade. The E suffix indicates Extended temperature (0°C to +100°C Tj), while the I suffix indicates Industrial temperature (–40°C to +100°C Tj). The silicon, package, and electrical performance are otherwise identical.

Q: Is the XCKU095-2FFVB2104E compatible with Vivado? Yes. Full support begins with Vivado Design Suite 2015.3 (speed file version 1.24). Always use the latest Vivado release for optimal implementation quality and timing closure.

Q: What PCIe generation does the XCKU095 support? The XCKU095 supports PCIe Gen3 ×8 via its hard IP blocks. Multiple PCIe endpoints or root complex configurations are possible depending on transceiver and logic resource allocation.

Q: Does the XCKU095-2FFVB2104E support DDR4 memory? Yes. HP I/O banks in the XCKU095 support DDR4 interfaces through the UltraScale Memory Interface Generator (MIG) IP, enabling high-bandwidth external memory connections for data-intensive applications.

Q: What design tools are required? The Xilinx Vivado Design Suite is the primary development environment. Vivado HLS/Vitis HLS is available for high-level synthesis. IP cores (PCIe, Ethernet MAC, JESD204B, etc.) are available through the Xilinx IP Catalog within Vivado.

---

Summary

The XCKU095-2FFVB2104E is one of the most capable mid-range FPGAs available on the market today. With 1,176,000 logic cells, 4,100 DSP slices, 59 Mb of Block RAM, 64 high-speed serial transceivers, and 702 user I/Os in a large 2104-pin FCBGA package, it enables engineers to tackle the most demanding data processing, networking, and signal processing challenges. Built on 20nm UltraScale architecture and supported by the full Vivado ecosystem, the XCKU095-2FFVB2104E offers a proven platform for production-grade FPGA system design.