The XCKU095-2FFVB2104I is a high-performance Xilinx FPGA from AMD’s Kintex® UltraScale™ family, built on 20nm process technology. Designed for engineers who demand maximum signal processing bandwidth at mid-range cost, this device delivers ASIC-class programmable logic with next-generation transceivers, a massive 2104-pin FCBGA package, and industrial-grade temperature rating. Whether you are building 100G networking infrastructure, medical imaging systems, or next-generation wireless equipment, the XCKU095-2FFVB2104I offers an exceptional blend of capability and cost-effectiveness.

---

What Is the XCKU095-2FFVB2104I?

The XCKU095-2FFVB2104I is a member of AMD Xilinx’s Kintex UltraScale FPGA series — the first ASIC-class All Programmable Architecture engineered to support multi-hundred Gbps system performance levels. The part number breaks down as follows:

---

XCKU095-2FFVB2104I Key Specifications

Core Device Parameters

---

I/O and Connectivity Specifications

---

Logic and Processing Resources

---

Transceiver and High-Speed Serial Specifications

---

Ordering and Packaging Information

---

XCKU095-2FFVB2104I Product Description

High-Performance 20nm Kintex UltraScale Architecture

The XCKU095-2FFVB2104I is built on the UltraScale architecture — AMD Xilinx’s first ASIC-class programmable design. Unlike previous-generation FPGAs, the UltraScale architecture employs next-generation routing, ASIC-like clocking methodology, and advanced power reduction features that collectively deliver a step-change in performance-per-watt. The device features 1,176,000 system logic cells, making it one of the most resource-dense mid-range FPGAs available for demanding real-time processing applications.

Speed Grade –2 Performance at Industrial Temperature

The –2 speed grade is the second highest performance tier in the Kintex UltraScale family, providing a 0.95V VCCINT core supply and clock frequencies up to 630 MHz for internal logic paths. The “I” suffix designates industrial-grade temperature operation from –40°C to +100°C junction temperature, ensuring reliable performance in harsh environments including outdoor telecom infrastructure, defense electronics, and industrial control systems.

Massive DSP and Signal Processing Capability

With 2,760 DSP48E2 slices, the XCKU095-2FFVB2104I is optimized for signal-processing-intensive workloads. Each DSP48E2 slice features a 27×18 multiplier, a 30-bit pre-adder, and 96-bit XOR functionality. This translates to peak arithmetic throughput that makes the device ideal for radar signal processing, software-defined radio (SDR), digital predistortion (DPD), and 8K video pipelines.

Next-Generation GTH and GTY Transceivers

The device integrates 32 GTH transceivers and 16 GTY transceivers, each capable of operating at line rates up to 16.3 Gb/s. Transceivers are arranged in groups of four (Quads) for optimized layout and power efficiency. This transceiver count supports backplane designs at 25G+ speeds, multiple lanes of 100G Ethernet, and PCIe Gen3 x8 configurations — all critical requirements in modern data-center and networking line cards.

Integrated Hard IP Blocks

The XCKU095-2FFVB2104I includes several hard (silicon-fixed) IP blocks that save significant logic resources compared to soft implementations:

• Integrated PCIe Gen3 blocks — Supports Endpoint and Root Port operation at up to 8.0 GT/s (Gen3) in x1, x4, or x8 lane widths
• 100G Ethernet MAC/PCS — Simplifies 100G interface design with a hard-coded, standards-compliant logic block
• 150G Interlaken — Enables simple, reliable Nx100G switch and bridge designs
• Clock Management (MMCM/PLL) — 8 MMCMs and 16 PLLs for flexible clocking across all regions

2104-Pin FCBGA Package — High Pin Count and Flexible Migration

The 2104-pin Flip-Chip BGA (FCBGA) package provides the maximum I/O count in the XCKU095 device family, with 702 user I/O pins available. Critically, the B2104 package footprint is pin-compatible with both Kintex UltraScale and select Virtex UltraScale+ devices, enabling PCB-level migration from one family to another without board redesign — a major advantage in long-lifecycle product planning.

---

XCKU095-2FFVB2104I vs. Related Variants

Understanding the part number variants helps engineers select the right configuration for their design.

The XCKU095-2FFVB2104I is the top-tier configuration for industrial use: maximum pin count (2104), highest available speed grade for industrial temperature (-2), and the widest I/O availability (702 pins).

---

Target Applications for the XCKU095-2FFVB2104I

#### 100G and 400G Networking and Data Centers

The combination of 100G Ethernet hard IP, 150G Interlaken support, and high-speed GTH/GTY transceivers makes the XCKU095-2FFVB2104I a natural fit for network line cards, packet processors, and switching fabrics operating at 100G+ throughputs. The device handles deep buffering, traffic management, and header parsing natively in programmable logic at wire speed.

#### Wireless Infrastructure (5G/LTE Base Stations)

The device’s exceptional DSP density and high-speed transceiver interface support Remote Radio Head (RRH) digital front-end (DFE) processing for TD-LTE and 5G NR base stations. Up to 8×8 MIMO configurations, digital predistortion, and CPRI/eCPRI interfaces can all be implemented within the XCKU095’s logic fabric.

#### Medical Imaging

Compute-intensive algorithms such as CT reconstruction, ultrasound beamforming, and MRI signal processing demand both high DSP throughput and low-latency data pipelines. The XCKU095-2FFVB2104I’s 2,760 DSP48E2 slices and 37.9 Mb of block RAM provide the resources needed for next-generation medical imaging at 8K4K resolution.

#### Defense and Aerospace Electronics

The industrial temperature rating (–40°C to +100°C) combined with the robust UltraScale architecture makes this device well-suited for radar, electronic warfare (EW), and signal intelligence (SIGINT) platforms. The device supports AES-256 bitstream encryption and secure key storage to protect sensitive design IP.

#### High-Performance Computing (HPC) and Acceleration

As an FPGA accelerator card component, the XCKU095-2FFVB2104I handles workloads such as genomics processing, financial analytics, and machine learning inference — complementing CPU/GPU compute clusters through its PCIe Gen3 x8 host interface.

---

Design and Development Tools

The XCKU095-2FFVB2104I is fully supported by AMD’s Vivado® Design Suite, which provides integrated synthesis, place-and-route, simulation, and IP integration tools optimized for UltraScale devices.

The Vivado IP catalog includes pre-verified IP cores for DDR4 memory controllers, PCIe endpoints, 100G Ethernet, and transceivers, dramatically reducing time-to-market for XCKU095-based designs.

---

Frequently Asked Questions (FAQ)

Q: What is the industrial temperature range of the XCKU095-2FFVB2104I? The “I” suffix specifies an industrial junction temperature range of –40°C to +100°C (Tj), making it suitable for harsh environments where commercial-grade devices cannot operate reliably.

Q: Is the XCKU095-2FFVB2104I RoHS compliant? Yes. The XCKU095-2FFVB2104I is fully RoHS and REACH compliant in its standard packaging (Tray).

Q: Can the XCKU095-2FFVB2104I migrate to a Virtex UltraScale+ device? Yes. The B2104 package footprint is pin-compatible with select Virtex UltraScale+ devices, allowing designers to migrate to higher-capacity or higher-performance devices without re-spinning the PCB.

Q: What design software should I use for the XCKU095-2FFVB2104I? AMD Vivado Design Suite is the recommended and fully supported design environment for all Kintex UltraScale devices, including the XCKU095. Legacy ISE tools are not supported for this device family.

Q: How many PCIe lanes does the XCKU095-2FFVB2104I support? The device includes integrated PCIe hard blocks supporting Gen3 at x8 lane width (8.0 GT/s), configurable as Endpoint or Root Port.

Q: What is the difference between –1 and –2 speed grades? The –2 speed grade provides higher maximum operating frequency and improved timing margins compared to the –1 grade. Both grades use the same 0.95V VCCINT supply on the XCKU095 device; –2 is generally preferred for timing-critical designs.

---

Summary

The XCKU095-2FFVB2104I represents one of the most capable mid-range FPGAs in AMD Xilinx’s portfolio. With 1,176,000 system logic cells, 2,760 DSP slices, 702 user I/O pins in a 2104-pin FCBGA package, and 48 high-speed transceivers operating at up to 16.3 Gb/s, it delivers ASIC-class performance at a fraction of the development cost. Industrial temperature support and B2104 package migration compatibility make it a long-lifecycle choice for demanding applications across networking, wireless, medical, and defense markets.