The XCKU115-1FLVD1517I is an industrial-grade, high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx, belonging to the Kintex® UltraScale™ family. Built on 20nm process technology, this device delivers an exceptional balance of price and performance, making it the go-to choice for engineers designing demanding applications in telecommunications, defense, high-performance computing, medical imaging, and 100G networking. If you are looking for a proven Xilinx FPGA with industrial temperature rating and top-tier logic density, the XCKU115-1FLVD1517I is a compelling solution.
What Is the XCKU115-1FLVD1517I?
The XCKU115-1FLVD1517I is a member of AMD Xilinx’s Kintex UltraScale series — a product family engineered specifically to offer the highest DSP and block RAM-to-logic ratios in its class, combined with next-generation transceivers and cost-effective flip-chip BGA packaging. The “D” suffix in the part number indicates this device is supplied in tray packaging, while the “I” suffix designates industrial-grade operation, rated for the full –40°C to +100°C temperature range. This makes it ideal for rugged environments where commercial-grade components fall short.
XCKU115-1FLVD1517I Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU115-1FLVD1517I |
| FPGA Family |
Kintex UltraScale |
| Process Technology |
20nm |
| Package Type |
1517-Pin FCBGA (Flip-Chip Ball Grid Array) |
| Package Code |
FLVD1517 |
| Speed Grade |
–1 (Slowest / Low-power optimized) |
| Supply Voltage (VCC INT) |
0.95V |
| Operating Temperature |
–40°C to +100°C (Industrial) |
| Packing Type |
Tray |
| RoHS Compliance |
Yes |
| Lifecycle Status |
Production (Active) |
XCKU115-1FLVD1517I Logic & Memory Resources
The XCKU115-1FLVD1517I packs enormous logic and memory resources into a single device, making it suitable for the most demanding parallel processing workloads.
| Resource |
Quantity |
| System Logic Cells |
1,160,880 |
| CLB Flip-Flops |
1,326,720 |
| LUT-based Logic Cells (Macrocells) |
1,451,100 |
| CLB Logic Blocks |
663,360 |
| Block RAM (Total Bits) |
77,721,600 bits (~77.7 Mb) |
| Block RAM Blocks (36K) |
2,160 |
| UltraRAM (URAM) Blocks |
0 (Kintex UltraScale, not UltraScale+) |
| DSP Slices |
5,520 |
I/O and Transceiver Capabilities
| I/O Parameter |
Value |
| Total User I/O |
624 |
| Maximum Differential I/O Pairs |
312 |
| GTH Transceivers |
32 |
| Transceiver Line Rate (GTH) |
Up to 16.3 Gb/s |
| PCIe Gen3 Hard Blocks |
2 |
| CMAC (100G Ethernet) |
2 |
| Interlaken Hard Blocks |
2 |
| MMCM / PLL |
20 / 40 |
Part Number Decoder: Understanding XCKU115-1FLVD1517I
Breaking down the part number helps engineers quickly identify key device attributes:
| Code Segment |
Meaning |
| XC |
Xilinx Commercial Product |
| KU |
Kintex UltraScale Family |
| 115 |
Device Size (115 = largest in KU series at this node) |
| -1 |
Speed Grade –1 (lower power, conservative timing) |
| FL |
Flip-Chip Low-profile package |
| V |
Pb-free (RoHS compliant) |
| D |
Tray packaging |
| 1517 |
Pin count (1517 balls) |
| I |
Industrial temperature grade (–40°C to +100°C) |
XCKU115-1FLVD1517I vs. Other XCKU115 Variants
Engineers often need to choose between closely related variants. The table below compares the most common XCKU115 orderable part numbers:
| Part Number |
Speed Grade |
Temp Grade |
Package |
Packing |
| XCKU115-1FLVD1517I |
–1 |
Industrial |
FCBGA-1517 |
Tray |
| XCKU115-1FLVA1517I |
–1 |
Industrial |
FCBGA-1517 |
Tray (alt) |
| XCKU115-2FLVD1517I |
–2 |
Industrial |
FCBGA-1517 |
Tray |
| XCKU115-2FLVA1517I |
–2 |
Industrial |
FCBGA-1517 |
Tray |
| XCKU115-1FLVD1517C |
–1 |
Commercial |
FCBGA-1517 |
Tray |
| XCKU115-1FLVB2104I |
–1 |
Industrial |
FCBGA-2104 |
Tray |
Tip: The “-1” speed grade in the XCKU115-1FLVD1517I is recommended for power-sensitive or thermally constrained designs, while “-2” variants offer higher maximum clock frequencies.
Key Features and Technology Highlights
UltraScale Architecture Advantages
The XCKU115-1FLVD1517I is built on Xilinx’s UltraScale™ architecture, the industry’s first ASIC-class programmable architecture. Key architectural benefits include:
- ASIC-like clocking: Eliminates clock region constraints found in older 7-series devices, enabling higher sustained performance across the fabric.
- 2D NoC (Network-on-Chip): Reduces routing congestion and improves timing closure predictability on large designs.
- SSI Technology Support: Supports stacked silicon interconnect technology for bandwidth-intensive multi-die configurations.
- Advanced power management: Integrated power gating and fine-grain clock enables for reduced dynamic and static power.
DSP and Signal Processing Performance
With 5,520 DSP48E2 slices, the XCKU115-1FLVD1517I delivers massive fixed-point and floating-point computation throughput. Each DSP48E2 slice supports pre-adder functionality, reducing LUT usage for symmetric filter implementations. This makes the device especially well suited for radar signal processing, software-defined radio (SDR), image processing pipelines, and FEC (Forward Error Correction) in 100G optical networking.
High-Speed Serial Transceivers
The device integrates 32 GTH transceivers capable of operating at line rates from 500 Mb/s to 16.3 Gb/s. These transceivers natively support protocols including PCIe Gen3, CPRI/eCPRI, SRIO, Interlaken, 10/40/100GbE, OTU4, and custom serial interfaces, making this FPGA an ideal front-end processor for wireless base stations and line cards.
Hard IP Blocks
| Hard IP Block |
Count |
Benefit |
| PCIe Gen3 (x8) |
2 |
Zero-LUT PCIe endpoint/root-port implementation |
| 100G Ethernet MAC (CMAC) |
2 |
Line-rate 100GbE without external MACs |
| Interlaken |
2 |
Chip-to-chip interconnect at up to 150G |
XCKU115-1FLVD1517I Applications
The combination of industrial-grade temperature rating, massive logic density, and high-speed transceivers makes the XCKU115-1FLVD1517I a strong fit for the following application domains:
Networking and Telecommunications
- 100G / 400G line card processing
- Deep packet inspection (DPI) engines
- Network traffic management and QoS
- CPRI/eCPRI front-haul in 5G radio units
Defense and Aerospace
- Electronic warfare signal processing
- SIGINT and ELINT receivers
- Synthetic aperture radar (SAR) image formation
- Secure communications with hardware-level cryptography
High-Performance Computing
- Hardware accelerators for AI/ML inference
- Data center SmartNIC implementations
- Memory interface controllers (DDR4, HBM via external stacking)
Medical and Industrial Imaging
- 4K/8K video processing pipelines
- CT and MRI image reconstruction accelerators
- Real-time ultrasound beamforming
Broadcast and Video
- Ultra-high-definition (UHD) video encode/decode
- Multi-channel video routing
- HDR processing and frame-rate conversion
XCKU115-1FLVD1517I Package Details: FCBGA-1517
The 1517-ball flip-chip BGA package offers a compact footprint (45mm × 45mm) suitable for high-density PCB designs. Engineers should consider the following during board design:
| Package Attribute |
Detail |
| Package Type |
Flip-Chip Ball Grid Array (FCBGA) |
| Ball Count |
1,517 |
| Body Size |
45mm × 45mm |
| Ball Pitch |
1.0mm |
| Package Height (max) |
~3.2mm |
| Thermal Solution |
Requires heatsink/airflow for sustained full-power operation |
Design Tools and Development Ecosystem
The XCKU115-1FLVD1517I is fully supported by AMD Xilinx’s Vivado Design Suite, which provides:
- Vivado ML Edition: Free-to-download synthesis, implementation, and simulation for Kintex UltraScale devices.
- Vitis HLS: High-Level Synthesis (HLS) flow for C/C++/OpenCL-based IP generation.
- IP Integrator (IPI): Drag-and-drop block design for assembling complex subsystems using AMD-certified IP cores.
- Partial Reconfiguration: Supported, enabling dynamic reprogramming of device regions without system downtime.
Compatible Vivado versions: 2014.4 and later. Always use the most recent Vivado release for best timing closure results on this device.
Ordering Information
| Attribute |
Detail |
| Manufacturer Part Number |
XCKU115-1FLVD1517I |
| Manufacturer |
AMD (formerly Xilinx) |
| Category |
Embedded – FPGAs (Field Programmable Gate Array) |
| Series |
Kintex® UltraScale™ |
| Packaging |
Tray |
| ECCN |
3A991.a.2 (export classification may vary by region) |
| HTS Code |
8542.39.00 |
Frequently Asked Questions (FAQ)
What is the difference between XCKU115-1FLVD1517I and XCKU115-1FLVA1517I?
Both parts share identical silicon, logic resources, and I/O count. The primary difference is packaging: “D” denotes tray packing while “A” may denote an alternative tape-and-reel or tray designation. Always verify with your distributor for current packing options.
Is the XCKU115-1FLVD1517I RoHS compliant?
Yes. The “V” in the part number indicates a lead-free, RoHS-compliant package finish.
What is the maximum operating temperature of the XCKU115-1FLVD1517I?
The “I” suffix designates industrial grade: –40°C to +100°C (junction temperature, T_J). This exceeds commercial-grade parts (0°C to +85°C), making it suitable for rugged deployments.
What programming tool do I use for the XCKU115-1FLVD1517I?
AMD Xilinx’s Vivado Design Suite is the primary design and programming tool. The device connects to a programmer via JTAG or can be configured from external flash memory using the SPI or BPI configuration interfaces.
How does the –1 speed grade affect my design?
The –1 speed grade offers lower maximum operating frequency compared to –2 parts, but typically results in reduced power consumption. If your design has relaxed timing requirements or prioritizes power efficiency over peak performance, –1 is the preferred choice.
Summary
The XCKU115-1FLVD1517I is one of the most capable industrial-grade FPGAs available in the Kintex UltraScale family. Its combination of 1.16M logic cells, 5,520 DSP slices, 77.7 Mb of block RAM, 32 high-speed GTH transceivers, and hardened 100G Ethernet and PCIe blocks — all within a 1517-ball FCBGA package rated for industrial temperatures — makes it a powerful platform for next-generation system designs. Supported by Xilinx’s mature Vivado ecosystem and a wide distribution network, the XCKU115-1FLVD1517I remains an active, production-ready device for the most demanding embedded applications.
