The XCKU115-2FLVA2104E is a high-performance Xilinx FPGA from AMD’s Kintex® UltraScale™ family, engineered for applications that demand exceptional DSP throughput, high-speed serial connectivity, and maximum logic density. Built on a proven 20nm process node, this device delivers an industry-leading combination of 1,451,100 logic cells, 5,520 DSP slices, and 832 user I/Os in a compact 2104-pin FCBGA package — making it one of the most capable mid-range FPGAs available on the market today.

Whether you are designing 100G networking equipment, next-generation medical imaging systems, or heterogeneous wireless infrastructure, the XCKU115-2FLVA2104E offers the right balance of performance, flexibility, and cost-effectiveness.

---

XCKU115-2FLVA2104E Key Specifications at a Glance

---

What Is the XCKU115-2FLVA2104E?

The XCKU115-2FLVA2104E is a member of AMD’s Kintex UltraScale FPGA family — the flagship device within the KU115 sub-family. The “2” in the part number denotes the speed grade, “FLVA2104” refers to the 2104-pin flip-chip land grid array (FCBGA/FLGA) package variant, and “E” indicates the extended commercial temperature range (0°C to +100°C junction temperature).

As the largest device in the Kintex UltraScale family, the KU115 leverages SSI (Stacked Silicon Interconnect) technology alongside monolithic die architecture to deliver the highest logic and DSP resources in this product tier. It is fully supported by AMD’s Vivado Design Suite, enabling seamless RTL-to-bitstream design flows, IP integration, and timing closure.

---

XCKU115-2FLVA2104E Detailed Technical Specifications

Logic and Compute Resources

With 5,520 DSP48E2 slices, the XCKU115-2FLVA2104E offers the highest DSP processing bandwidth available in any mid-range FPGA device. Each DSP48E2 slice supports pre-adder, multiplier, and accumulator functions, enabling efficient implementation of FIR filters, FFTs, matrix operations, and other compute-intensive algorithms.

Memory Resources

I/O and Connectivity

Package and Physical

Power Supply Requirements

---

XCKU115-2FLVA2104E Part Number Decoder

Understanding the part number naming convention helps engineers quickly identify the correct device:

---

Key Features of the Kintex UltraScale XCKU115 FPGA

#### Industry-Leading DSP Bandwidth

The XCKU115 contains 5,520 DSP48E2 slices — the most DSP resources of any mid-range FPGA ever produced at the time of its release. This makes it ideal for signal processing pipelines, deep neural network inference, and wireless baseband processing where MAC (multiply-accumulate) throughput is the primary bottleneck.

#### High-Speed Serial Transceivers

With 64 GTH transceivers capable of running up to 16.375 Gbps per lane, the XCKU115-2FLVA2104E can support a wide range of high-speed serial protocols including PCIe Gen3, 100GbE, Interlaken, JESD204B, SATA, USB 3.0, and custom high-bandwidth interfaces.

#### Large Logic Fabric

The device integrates over 663,000 LUTs and 1.3 million flip-flops, enabling the implementation of very large, complex digital designs — including multi-core processor systems, advanced memory controllers, and large state machines — without requiring multi-chip partitioning in many use cases.

#### Block RAM Architecture

With 75.9 Mb of on-chip Block RAM, designers gain ample on-device memory for packet buffers, line-rate FIFOs, lookup tables, and filter coefficient storage. Each 36Kb BRAM tile can be configured as a 36Kb or two independent 18Kb memories.

#### UltraScale Architecture Advantages

The Kintex UltraScale architecture introduces several improvements over prior Xilinx FPGA generations:

• ASIC-like clocking with fine-grained clock gating for reduced dynamic power
• Cascaded DSP chains enabling very wide accumulator and MAC operations
• Enhanced routing architecture for improved timing closure on complex high-speed designs
• Integrated hard IP blocks for 100GbE, Interlaken, and PCIe Gen3
• SSI technology for maximum device size and I/O count beyond single-die limits

---

XCKU115-2FLVA2104E vs. Other KU115 Package Variants

The XCKU115 die is offered in multiple packages. The table below compares the most common options:

The XCKU115-2FLVA2104E offers the maximum I/O pin count (832) with a speed grade balanced for cost and performance, and an extended commercial temperature rating suited to industrial and telecom equipment.

---

Target Applications for the XCKU115-2FLVA2104E

The XCKU115-2FLVA2104E is designed for compute-intensive, high-bandwidth applications across multiple industry segments:

#### 100G Networking and Data Centers

The device’s integrated 100GbE and Interlaken hard IP, combined with 64 GTH transceivers, makes it an ideal solution for line-rate packet processing, deep packet inspection, and network function virtualization (NFV) in carrier-grade and data center equipment.

#### Wireless Infrastructure (4G/5G)

With its extraordinary DSP density, the KU115 is well-suited for 5G NR baseband processing, beamforming, massive MIMO signal chains, and heterogeneous network DFE (digital front-end) implementations.

#### Medical Imaging

The combination of high BRAM capacity, large DSP slice count, and fast GTH transceivers enables real-time medical image reconstruction — including MRI, CT, and ultrasound — where 3D FFTs, FIR filters, and high-speed data interfaces are required simultaneously.

#### High-Performance Computing (HPC) and AI Acceleration

The XCKU115-2FLVA2104E is widely used as an FPGA accelerator card for machine learning inference workloads, connected to host CPUs via PCIe Gen3, enabling low-latency data processing that GPUs cannot match for streaming workloads.

#### ASIC Prototyping and Emulation

As the largest Kintex UltraScale device, the KU115 is a popular choice for SoC and ASIC prototyping platforms, offering the logic capacity needed to map large RTL designs for pre-silicon validation.

#### Defense and Aerospace

The extended temperature grade (-E) and the high I/O count make the XCKU115-2FLVA2104E suitable for EW (Electronic Warfare), SIGINT, and radar signal processing applications where environmental stress and processing density are both critical factors.

---

Design Tools and Software Support

The XCKU115-2FLVA2104E is fully supported by AMD’s design ecosystem:

---

Ordering and Availability

Note: The XCKU115-2FLVA2104E is classified as a standard-demand component. Lead times can vary depending on market conditions. Always confirm availability and pricing through your authorized distributor.

---

Frequently Asked Questions (FAQ)

Q: What is the difference between XCKU115-2FLVA2104E and XCKU115-2FLVA2104I? The only difference is the temperature grade. The “E” suffix indicates an Extended commercial temperature range (0°C to +100°C Tj), while the “I” suffix is rated for Industrial temperatures (-40°C to +100°C Tj). The logic resources, package, and speed grade are identical.

Q: Does the XCKU115-2FLVA2104E support PCIe Gen3? Yes. The XCKU115 includes integrated PCIe Gen3 hard IP blocks supporting configurations up to x8 lanes. Higher lane configurations can be implemented using GTH transceivers combined with soft PCIe IP cores.

Q: Is the XCKU115 the same as the KU115? Yes. “KU115” is the common shorthand for the XCKU115 device family. The “XC” prefix is the standard Xilinx/AMD naming convention for all FPGA product lines.

Q: What programming software do I need for the XCKU115-2FLVA2104E? AMD Vivado Design Suite (2014.1 or later) supports full device programming. Vivado ML (Machine Learning) editions are also compatible and provide additional optimization features for AI workloads.

Q: What is the maximum operating frequency of the XCKU115-2FLVA2104E? Achievable clock frequencies depend on the design and logic path complexity. The device’s GTH transceivers support serial line rates up to 16.375 Gbps. Internal fabric clock frequencies typically range from 400–700+ MHz depending on design, resources used, and place-and-route outcomes.

---

Summary

The XCKU115-2FLVA2104E is AMD’s most powerful Kintex UltraScale FPGA in the 2104-pin extended-temperature package. Its unmatched 5,520 DSP slices, 75.9 Mb of Block RAM, 832 user I/Os, and 64 GTH transceivers make it a top-tier choice for engineers building systems that demand the highest level of signal processing, logic density, and high-speed connectivity in a mid-range FPGA form factor. Backed by AMD’s Vivado design ecosystem and a robust IP library, the XCKU115-2FLVA2104E accelerates development timelines across networking, wireless, medical, defense, and HPC application domains.