The XCKU115-2FLVA2104I is a high-performance field programmable gate array (FPGA) manufactured by AMD (formerly Xilinx), belonging to the Kintex UltraScale family. Built on 20nm process technology, it delivers an outstanding blend of logic density, signal processing bandwidth, and transceiver performance — making it one of the most capable mid-range FPGAs available for demanding applications in networking, data centers, and industrial markets.
If you are evaluating a Xilinx FPGA for your next design, the XCKU115-2FLVA2104I deserves serious consideration.
What Is the XCKU115-2FLVA2104I?
The XCKU115-2FLVA2104I is a member of the Kintex UltraScale FPGA family — AMD’s premier mid-range FPGA platform built on the UltraScale architecture. It targets applications that require both high DSP throughput and large block RAM capacity at an optimized cost-performance ratio.
Key Identifiers at a Glance
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU115-2FLVA2104I |
| Family |
Kintex UltraScale |
| Process Node |
20nm |
| Speed Grade |
-2 (Mid-range) |
| Temperature Grade |
Industrial (-40°C to 100°C TJ) |
| Package |
2104-FCBGA (47.5 × 47.5 mm) |
| Lifecycle Status |
Active |
| RoHS Compliant |
Yes |
XCKU115-2FLVA2104I Technical Specifications
Logic and Compute Resources
| Specification |
Value |
| System Logic Cells |
1,451,100 |
| CLBs (Configurable Logic Blocks) |
82,920 |
| CLB Flip-Flops |
1,326,720 |
| LUT6-Based Logic |
663,360 |
| DSP Slices |
5,520 |
Memory Resources
| Specification |
Value |
| Total Block RAM |
75.9 Mb (77,721,600 bits) |
| Block RAM (36K blocks) |
2,160 |
| Block RAM (18K blocks) |
4,320 |
I/O and Connectivity
| Specification |
Value |
| Maximum User I/O |
832 |
| Number of I/O Banks |
20 |
| GTH Transceivers |
64 (up to 16.3 Gb/s per lane) |
| Max Transceiver Aggregate Bandwidth |
~2,086 Gb/s (full duplex) |
| PCIe |
Gen3 × 8 hardened block |
| 100G Ethernet |
Supported |
| 150G Interlaken |
Supported |
Power and Electrical
| Specification |
Value |
| Core Voltage (VCCINT) |
0.922V – 0.979V (nominal 0.95V) |
| Mounting Type |
Surface Mount |
| Package / Case |
2104-BBGA, FCBGA |
| Supplier Device Package |
2104-FCBGA (47.5 × 47.5 mm) |
Clocking Resources
| Specification |
Value |
| MMCM (Mixed-Mode Clock Managers) |
20 |
| PLLs |
40 |
| Global Clock Networks |
832 |
XCKU115-2FLVA2104I Features and Architecture Highlights
UltraScale Next-Generation FPGA Architecture
The XCKU115-2FLVA2104I is built on AMD’s UltraScale architecture — the same foundational platform used in ASIC designs. This architecture eliminates traditional FPGA routing bottlenecks through a new routing fabric that delivers ASIC-like performance with full programmability.
Key architectural advantages include:
- Stacked Silicon Interconnect (SSI) Technology — Enables very high I/O and logic density without compromising performance.
- Advanced DSP48E2 Slices — Support wider multipliers, XOR functions for ECC/CRC, and pre-adder squaring, enabling efficient floating-point and error-correction workloads.
- Enhanced Block RAM — Includes hardened memory cascade, flexible hard FIFO, and dynamic power gating to reduce resource usage and improve efficiency.
- Fine-Granular Clock Gating — Reduces dynamic power consumption significantly compared to previous FPGA generations.
Industrial-Grade Temperature Reliability
The “I” suffix in XCKU115-2FLVA2104I indicates an industrial temperature grade, with a junction temperature range of -40°C to 100°C. This makes the device suitable for deployments in harsh environments including industrial automation, military-adjacent applications, and outdoor telecom infrastructure.
High-Performance GTH Transceivers
With 64 GTH transceivers capable of supporting serial data rates up to 16.3 Gb/s per channel, the XCKU115-2FLVA2104I provides the high-bandwidth serial connectivity needed for 100G networking, backplane designs, and optical module interfaces.
XCKU115-2FLVA2104I Application Areas
The XCKU115-2FLVA2104I is designed for high-performance, bandwidth-intensive workloads. Typical application domains include:
Networking and Data Centers
- 100G Ethernet line cards and switches
- 400G and 500G packet processing
- Network function virtualization (NFV) acceleration
- SmartNIC and DPU implementations
Wireless Infrastructure
- Remote Radio Head (RRH) digital front end (DFE)
- 8×8 MIMO TD-LTE base stations
- Heterogeneous wireless network controllers
Video and Imaging
- 8K4K video processing and encoding pipelines
- High-frame-rate multi-channel video capture
- Medical imaging (CT, MRI, ultrasound processing)
Industrial and Embedded
- Industrial motor control and robotics
- Sensor fusion and real-time signal processing
- High-reliability embedded control systems
AI and Machine Learning Acceleration
- Low-latency inference engines
- Custom neural network accelerators
- High-throughput data preprocessing pipelines
Package and Ordering Information
XCKU115-2FLVA2104I Part Number Breakdown
| Code Segment |
Meaning |
| XC |
Xilinx Commercial (now AMD) |
| KU115 |
Kintex UltraScale, device size 115 |
| -2 |
Speed grade (mid-range performance) |
| FLVA |
Package type: FCBGA, Lead-free, Low-profile |
| 2104 |
Number of package pins (2104-pin) |
| I |
Industrial temperature grade |
Available Package Options for XCKU115
| Package |
Pins |
Body Size |
Max I/O |
| FLVA1517 |
1,517 |
40mm × 40mm |
624 |
| FLVA2104 |
2,104 |
47.5mm × 47.5mm |
832 |
| FLVB1760 |
1,760 |
42.5mm × 42.5mm |
676 |
| FLVD1517 |
1,517 |
40mm × 40mm |
598 |
XCKU115-2FLVA2104I vs. Related Kintex UltraScale Devices
| Device |
Logic Cells |
Block RAM (Mb) |
DSP Slices |
GTH Transceivers |
Max I/O |
| XCKU025 |
340,350 |
19.4 |
1,080 |
16 |
312 |
| XCKU060 |
726,000 |
38.0 |
2,760 |
32 |
520 |
| XCKU085 |
1,143,000 |
56.7 |
4,320 |
48 |
676 |
| XCKU115 |
1,451,100 |
75.9 |
5,520 |
64 |
832 |
The XCKU115 is the highest-density device in the Kintex UltraScale family, making the XCKU115-2FLVA2104I the maximum-capability option for applications that require the most logic, memory, and transceiver bandwidth within the Kintex UltraScale tier.
Design Tools and Software Support
The XCKU115-2FLVA2104I is fully supported by AMD’s Vivado Design Suite, which provides:
- Design Entry — VHDL, Verilog, and SystemVerilog support
- Synthesis — Integrated Vivado synthesis engine with timing-driven optimization
- Implementation — Place and route with intelligent routing algorithms
- Verification/Simulation — Vivado simulator and third-party tool integration
- IP Integrator — Block design environment for rapid IP instantiation
- Xilinx Power Estimator (XPE) — Accurate power analysis throughout the design cycle
The device also supports partial reconfiguration, hardware-in-the-loop debugging via Integrated Logic Analyzer (ILA), and AXI-based IP integration.
Footprint Compatibility and Migration
The XCKU115-2FLVA2104I in the 2104-FCBGA package is footprint-compatible with Virtex UltraScale devices in the same package, enabling straightforward design scalability. Designers can migrate between Kintex UltraScale and Virtex UltraScale families without full board redesign when using compatible packages — an important consideration for platform longevity.
Note: The XCKU085 and XCKU115 devices are multi-SLR (Super Logic Region) devices. When referencing datasheet power or timing parameters that specify per-SLR multiplication, apply accordingly for the XCKU115.
Frequently Asked Questions (FAQ)
What is the XCKU115-2FLVA2104I used for?
The XCKU115-2FLVA2104I is used in high-performance applications such as 100G networking, wireless base stations, medical imaging, data center acceleration, and industrial processing systems that require massive parallel computation.
What does the “-2” speed grade mean in XCKU115-2FLVA2104I?
The “-2” designates the mid-range speed grade in the Kintex UltraScale family. Speed grades range from -1 (lowest) to -3 (highest performance). The -2 grade offers a balance of speed, power, and availability.
Is the XCKU115-2FLVA2104I industrial temperature rated?
Yes. The “I” suffix confirms industrial temperature qualification, covering junction temperatures from -40°C to +100°C, suitable for demanding environments.
What package does the XCKU115-2FLVA2104I use?
It uses a 2104-pin FCBGA (Flip-Chip Ball Grid Array) package with a 47.5mm × 47.5mm body size and a 1.0mm ball pitch.
What programming tool supports the XCKU115-2FLVA2104I?
AMD’s Vivado Design Suite is the primary development environment. It supports full RTL design flow, IP integration, simulation, and on-chip debugging.
Summary
The XCKU115-2FLVA2104I stands at the pinnacle of the Kintex UltraScale FPGA family, offering over 1.45 million logic cells, nearly 76 Mb of block RAM, 5,520 DSP slices, 64 high-speed GTH transceivers, and 832 user I/Os — all within an industrial-grade 2104-pin FCBGA package. Its 20nm process technology and UltraScale architecture deliver ASIC-like performance with full programmability, making it the ideal solution for the most demanding mid-range FPGA applications.
Whether targeting 100G networking infrastructure, AI acceleration workloads, advanced wireless systems, or high-resolution video processing, the XCKU115-2FLVA2104I provides the performance density and connectivity needed to push system capabilities to their limit.
