The XCKU115-2FLVF1924I is a high-performance Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), belonging to the flagship Kintex UltraScale family. Built on a 20nm process node with a 1924-pin FC-BGA package, this industrial-grade FPGA delivers an exceptional balance of logic density, DSP throughput, and memory bandwidth — making it one of the most capable mid-range FPGAs available today.
Whether you are designing 100G networking systems, high-resolution medical imaging equipment, or advanced wireless infrastructure, the XCKU115-2FLVF1924I provides the performance and flexibility your project demands. As part of the broader family of Xilinx FPGA devices, it represents a proven platform trusted by engineers worldwide.
What Is the XCKU115-2FLVF1924I?
The XCKU115-2FLVF1924I is a programmable logic device manufactured by AMD Xilinx. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC |
Xilinx Commercial/Industrial device |
| KU115 |
Kintex UltraScale family, device size 115 |
| -2 |
Speed grade 2 (standard performance) |
| FLVF |
Flip-chip low-voltage fine-pitch BGA package |
| 1924 |
1924 total package pins |
| I |
Industrial temperature grade (–40°C to +100°C) |
This device targets system designers who need high DSP bandwidth and large on-chip memory in a cost-efficient package, without stepping up to the power and cost requirements of Virtex-class UltraScale devices.
XCKU115-2FLVF1924I Key Specifications
General Specifications Table
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU115-2FLVF1924I |
| FPGA Family |
Kintex UltraScale |
| Device |
KU115 |
| Process Node |
20nm |
| Package |
1924-pin FCBGA (FC-BGA) |
| Package Type |
Flip-Chip Ball Grid Array |
| Speed Grade |
-2 (Standard) |
| Temperature Grade |
Industrial (–40°C to +100°C) |
| RoHS Compliant |
Yes |
| Tray / Packaging |
Tray |
Logic & Fabric Resources
| Resource |
Quantity |
| Logic Cells |
1,451,100 |
| Logic Blocks (CLBs) |
663,360 |
| Look-Up Tables (LUTs) |
663,360 |
| Flip-Flops |
1,326,720 |
| Maximum Operating Frequency |
661 MHz (fabric) / up to 725 MHz |
| Clock Management |
MMCM, PLL |
The XCKU115 offers over 1.4 million logic cells, placing it near the top of the Kintex UltraScale product range and making it suitable for the most demanding logic-intensive designs.
Memory Resources
| Memory Type |
Capacity |
| Total Block RAM (BRAM) |
77,722 Kbits (approx. 75 Mb) |
| Block RAM Tiles |
768 |
| Block RAM (36K blocks) |
768 |
| Block RAM (18K blocks) |
1,536 |
| UltraRAM (URAM) |
Not present (Kintex UltraScale; URAM is Kintex UltraScale+) |
| Distributed RAM |
Available via LUTs |
The enormous on-chip block RAM capacity supports large data-caching architectures, wide FIFOs, and complex DSP filter coefficient storage without external memory dependencies.
DSP Resources
| Parameter |
Value |
| DSP48E2 Slices |
5,520 |
| Peak DSP Performance |
High-bandwidth signal processing |
| Multiplier Width |
27×18-bit multiply-accumulate |
With 5,520 DSP slices, the XCKU115-2FLVF1924I delivers industry-leading signal processing capability for applications including FIR filtering, FFT engines, radar processing, and software-defined radio.
I/O and Transceiver Resources
| Resource |
Value |
| User I/O Pins |
728 |
| Maximum I/O Pins (including package) |
832 |
| I/O Banks |
Multiple |
| Maximum I/O Voltage |
3.3V |
| SelectIO Standards Supported |
LVDS, SSTL, HSTL, LVCMOS, LVPECL, and more |
| GTH Transceivers (16.3 Gbps) |
32 |
| PCIe Gen3 Hardened Blocks |
Available |
| 100G Ethernet (CAUI-4) |
Supported via GTH transceivers |
Power Specifications
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
0.922V – 0.979V (nominal 0.95V) |
| I/O Supply Voltage (VCCO) |
Up to 3.3V |
| Auxiliary Voltage (VCCAUX) |
1.8V |
| Power Architecture |
Multi-rail, low-voltage |
The 20nm process node combined with the UltraScale architecture delivers up to 40% lower power consumption compared to the previous 28nm generation, enabling thermally efficient system designs.
Package & Mechanical Details
| Parameter |
Value |
| Package |
FCBGA-1924 (Flip-Chip Fine-Pitch Ball Grid Array) |
| Total Pins |
1,924 |
| Package Body Size |
45mm × 45mm |
| Ball Pitch |
1.0mm |
| Moisture Sensitivity Level (MSL) |
Per JEDEC J-STD-020 |
| Operating Temperature (Industrial) |
–40°C to +100°C junction |
XCKU115-2FLVF1924I vs. Similar Kintex UltraScale Devices
| Part Number |
Speed Grade |
Temp Grade |
Package Pins |
Logic Cells |
| XCKU115-2FLVF1924I |
-2 |
Industrial |
1924 |
1,451,100 |
| XCKU115-2FLVF1924E |
-2 |
Extended |
1924 |
1,451,100 |
| XCKU115-1FLVF1924I |
-1 |
Industrial |
1924 |
1,451,100 |
| XCKU115-3FLVF1924E |
-3 |
Extended |
1924 |
1,451,100 |
| XCKU085-2FLVF1924I |
-2 |
Industrial |
1924 |
1,045,440 |
The -2 speed grade offers the right balance between timing performance and power consumption for most production designs. The I suffix confirms industrial temperature rating, ensuring reliable operation in harsh environments.
Target Applications for the XCKU115-2FLVF1924I
#### 100G Networking & Data Center Switching
The XCKU115’s GTH transceivers (up to 16.3 Gbps per lane) and hardened PCIe Gen3 blocks make it ideal for line-rate 100G Ethernet packet processing, network function virtualization (NFV), and SmartNIC designs.
#### High-Performance DSP & Signal Processing
With 5,520 DSP48E2 slices, the device supports real-time radar, SONAR, software-defined radio (SDR), and LTE/5G baseband processing with extremely low latency.
#### Medical Imaging & Diagnostics
Next-generation CT scanners, MRI systems, and ultrasound equipment benefit from the XCKU115’s high memory bandwidth and massive parallel processing for 8K4K image reconstruction pipelines.
#### Wireless Infrastructure (Remote Radio Heads)
The device supports heterogeneous wireless infrastructure including LTE Advanced, 5G NR DFE designs, and CPRI/eCPRI fronthaul interfaces.
#### Test & Measurement Equipment
High-channel-count ADC/DAC interfacing and protocol analysis tools leverage the large I/O count (728 user I/Os) and high-speed transceivers.
#### Aerospace & Defense
The industrial temperature grade (–40°C to +100°C) and robust UltraScale architecture make the XCKU115-2FLVF1924I suitable for ruggedized EW, radar, and secure communications platforms.
Development Tools & Ecosystem
The XCKU115-2FLVF1924I is fully supported by AMD’s industry-standard toolchain:
| Tool |
Purpose |
| Vivado Design Suite |
RTL synthesis, implementation, bitstream generation |
| Vitis HLS |
High-level synthesis from C/C++ to RTL |
| Vivado Simulator |
Functional and timing simulation |
| ChipScope Pro / ILA |
In-circuit hardware debug |
| IP Integrator |
Block design for complex IP integration |
| Partial Reconfiguration |
Dynamic hardware reconfiguration at runtime |
Vivado supports full UltraScale architecture optimization including ASIC-like clocking with fine-grained clock gating, reducing dynamic power significantly versus prior FPGA generations.
Ordering Information
| Attribute |
Detail |
| Part Number |
XCKU115-2FLVF1924I |
| Alternate Part Number |
XCKU115-2FLVF1924I3991 |
| Manufacturer |
AMD (formerly Xilinx) |
| DigiKey Part Number |
7604487 |
| Packaging |
Tray |
| RoHS Status |
Compliant |
| ECCN |
Contact distributor for export classification |
Frequently Asked Questions (FAQ)
Q: What is the difference between XCKU115-2FLVF1924I and XCKU115-2FLVF1924E? The only difference is the temperature grade. The I suffix indicates Industrial grade (–40°C to +100°C junction temperature), while the E suffix indicates Extended commercial grade. All logic resources and performance specifications are identical.
Q: Is the XCKU115-2FLVF1924I compatible with Vivado? Yes. It is fully supported by AMD Vivado Design Suite 2014.1 and all subsequent releases, including the latest Vivado 2024.x versions.
Q: What transceiver standard does the XCKU115 use? The KU115 uses GTH transceivers, capable of operating up to 16.3 Gbps line rate. These support PCIe Gen3, 100G Ethernet (CAUI-4), JESD204B, and many other high-speed serial protocols.
Q: Does the XCKU115 support Partial Reconfiguration? Yes. AMD’s UltraScale architecture fully supports Dynamic Partial Reconfiguration (DPR), allowing sections of the FPGA fabric to be reprogrammed during device operation without halting the rest of the design.
Q: What is the core voltage for XCKU115-2FLVF1924I? The core supply voltage (VCCINT) is nominally 0.95V, with an operating range of 0.922V to 0.979V.
Summary
The XCKU115-2FLVF1924I is AMD Xilinx’s most capable Kintex UltraScale device, offering over 1.4 million logic cells, 5,520 DSP slices, 75 Mb of block RAM, 728 user I/Os, and 32 GTH transceivers — all in an industrial-grade 1924-pin FCBGA package. Its 20nm UltraScale architecture delivers best-in-class performance-per-watt for demanding applications across networking, wireless, defense, and high-performance computing.
For engineers seeking a proven, high-density programmable logic solution with deep ecosystem support and long-term availability, the XCKU115-2FLVF1924I stands as one of the strongest choices in the mid-to-high-range FPGA market.
