The XCKU115-3FLVA2104E is a high-performance programmable logic device from AMD (formerly Xilinx), belonging to the Kintex® UltraScale™ FPGA family. Designed for demanding applications in wireless communications, data centers, and signal processing, this device delivers exceptional logic density, high-speed transceivers, and advanced memory interfacing in a compact flip-chip BGA package. If you are searching for a powerful Xilinx FPGA for your next design, the XCKU115-3FLVA2104E is one of the most capable mid-to-high-range options available.
What Is the XCKU115-3FLVA2104E?
The XCKU115-3FLVA2104E is part of the Kintex UltraScale product line — AMD’s second-generation UltraScale architecture FPGA series. The “3” in the part number indicates a Speed Grade –3 (fastest commercial speed grade), while “FLVA2104” refers to the 2104-pin Fine-pitch Land Grid Array (FLVA) package. The “E” suffix denotes the extended commercial temperature range variant.
This FPGA is fabricated on a 20nm planar CMOS process node, offering an optimal balance between power efficiency, logic capacity, and high-speed I/O — making it widely used in production-level systems where maximum throughput and design flexibility are essential.
XCKU115-3FLVA2104E Key Specifications
General Device Parameters
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU115-3FLVA2104E |
| Series |
Kintex® UltraScale™ |
| Architecture |
UltraScale (20nm) |
| Speed Grade |
–3 (Fastest Commercial) |
| Temperature Range |
0°C to +100°C (Extended Commercial) |
| Package Type |
FLVA (Fine-pitch LGA) |
| Package / Case |
2104-BGA |
| Operating Voltage (VCCINT) |
0.9V |
| RoHS Status |
RoHS Compliant |
Logic and Fabric Resources
| Resource |
Quantity |
| System Logic Cells |
1,451,000 |
| CLB Flip-Flops |
2,832,000 |
| CLB LUTs |
663,360 |
| Distributed RAM (Kb) |
9,180 |
| Block RAM (Mb) |
75.9 |
| UltraRAM Blocks |
0 |
| DSP Slices |
5,520 |
| Max. User I/O |
832 |
High-Speed Serial Transceivers
| Transceiver Type |
Quantity |
Max Line Rate |
| GTH Transceivers |
80 |
Up to 16.3 Gb/s |
| GTY Transceivers |
0 |
— |
| PCIe Gen3 Blocks |
4 |
Up to 8 lanes each |
| 100G Ethernet MACs |
2 |
— |
| Interlaken Cores |
2 |
— |
The 80 GTH transceivers are a defining feature of the XCKU115. These multi-gigabit transceivers support protocols including PCIe, CPRI, JESD204B, Serial RapidIO, and 10G/40G Ethernet, making the chip a natural fit for wireless base stations, backhaul equipment, and high-speed data acquisition systems.
Memory Interface Capabilities
| Memory Interface |
Supported Standards |
| External Memory |
DDR4, DDR3, LPDDR4, QDR II+, RLDRAM 3 |
| Max Memory Bandwidth |
Up to 4,800 Mb/s (DDR4) |
| Memory Controllers (Hard IP) |
Yes (via MIG) |
Clock Management
| Resource |
Quantity |
| MMCM (Mixed-Mode Clock Managers) |
20 |
| PLL |
20 |
| Global Clock Networks |
128 |
Package and Physical Specifications
| Parameter |
Value |
| Package |
FLVA2104 |
| Pin Count |
2104 |
| Package Dimensions |
45mm × 45mm |
| Ball Pitch |
1.0mm |
| Package Height |
~2.74mm |
| Mounting Type |
Surface Mount |
XCKU115-3FLVA2104E Architecture Overview
## UltraScale Architecture Highlights
The Kintex UltraScale architecture introduces several innovations over previous generations of Xilinx FPGAs:
- ASMBL™ Column-Based Architecture — Allows modular placement of logic blocks, memory, DSP, and I/O columns for efficient place-and-route.
- SSI Technology (Stacked Silicon Interconnect) — Though the XCKU115 is a monolithic die, the UltraScale architecture inherits SSI-compatible design methodologies for high-density routing.
- UltraFast Design Methodology — AMD provides IP cores and design guidelines optimized for this architecture, significantly reducing time-to-market.
- Vivado Design Suite Support — Full compatibility with AMD’s Vivado® Design Suite, including High-Level Synthesis (HLS) flows via Vitis™ HLS.
## DSP Performance for Signal Processing
With 5,520 DSP48E2 slices, the XCKU115-3FLVA2104E provides massive fixed-point and floating-point compute capacity. Each DSP48E2 slice includes:
- 27×18-bit multiplier
- 48-bit accumulator
- Pre-adder stage for FIR filter optimization
- Cascade chain support for complex arithmetic pipelines
This makes the device ideal for software-defined radio (SDR), RADAR signal processing, video analytics, and financial analytics workloads.
## High-Density Block RAM
The device contains 75.9 Mb of total Block RAM distributed across the die, supporting true dual-port configurations with widths up to 72 bits. This allows large on-chip data buffering, packet processing pipelines, and lookup tables to reside entirely within the FPGA fabric — reducing latency and board-level complexity.
Supported Communication Protocols
The XCKU115-3FLVA2104E supports a broad range of industry-standard protocols through its hard IP blocks and transceiver capabilities:
| Protocol Category |
Supported Protocols |
| High-Speed Serial |
PCIe Gen1/2/3, SATA, USB 3.0 (soft), CPRI |
| Networking |
10GbE, 40GbE, 100GbE (MAC), Interlaken |
| Wireless |
JESD204B, CPRI, OBSAI |
| Memory |
DDR4, DDR3L, LPDDR4, QDR II+, RLDRAM 3 |
| General Purpose |
UART, SPI, I2C, AXI4, AXI-Stream |
Typical Applications for the XCKU115-3FLVA2104E
#### Wireless Communications and 5G Infrastructure
The combination of 80 GTH transceivers, JESD204B support, and DSP density makes the XCKU115 a preferred choice for 4G/5G base station designs. It can handle fronthaul (CPRI/eCPRI), baseband processing, and data aggregation in a single chip.
#### Data Center Acceleration
With PCIe Gen3 hard blocks and high-bandwidth memory interfaces, the XCKU115 is suited for PCIe-attached accelerator cards used in machine learning inference, database acceleration, and network packet processing.
#### Test and Measurement Equipment
High logic density and multi-protocol transceiver support make this FPGA ideal for high-speed digitizers, protocol analyzers, and automated test equipment (ATE).
#### Radar and Defense Systems
The DSP capacity and radiation-tolerant design practices of the UltraScale platform make the XCKU115 applicable in RADAR signal processors, electronic warfare systems, and secure communications.
#### Video and Broadcast
Support for high-bandwidth memory interfaces and sufficient I/O allows implementation of 4K/8K video processing pipelines, including color space conversion, de-interlacing, and video compression.
XCKU115-3FLVA2104E vs. Other Kintex UltraScale Devices
| Device |
Logic Cells |
DSP Slices |
Block RAM |
GTH Transceivers |
Package Options |
| XCKU025 |
338,000 |
1,440 |
19.0 Mb |
20 |
Various |
| XCKU035 |
407,000 |
1,848 |
26.2 Mb |
20 |
Various |
| XCKU060 |
726,000 |
2,760 |
38.0 Mb |
32 |
Various |
| XCKU085 |
1,091,000 |
4,080 |
56.8 Mb |
56 |
Various |
| XCKU115 |
1,451,000 |
5,520 |
75.9 Mb |
80 |
FLVA2104 |
The XCKU115 sits at the top of the Kintex UltraScale family, offering the highest logic density, DSP count, and transceiver count among all Kintex UltraScale devices.
Development Tools and Design Support
#### AMD Vivado Design Suite
The XCKU115-3FLVA2104E is fully supported by the Vivado Design Suite, AMD’s integrated design environment for synthesis, simulation, implementation, and bitstream generation. Vivado provides:
- IP Integrator for block design flows
- Vitis HLS for high-level synthesis from C/C++
- Partial reconfiguration support
- Power analysis and optimization tools
#### AMD Vitis Unified Software Platform
For accelerated computing applications, the device integrates with the Vitis™ Unified Software Platform, enabling software-defined hardware acceleration using OpenCL and C++ kernels.
#### Reference Designs and IP Cores
AMD provides an extensive library of verified IP cores for the Kintex UltraScale family, including:
- JESD204B/C PHY and controller IP
- PCIe DMA Subsystem
- 100G Ethernet Subsystem
- Memory Interface Generator (MIG)
- Video Processing Subsystem
Ordering Information
| Attribute |
Detail |
| Manufacturer Part Number |
XCKU115-3FLVA2104E |
| DigiKey Part Number |
1168-XCKU115-3FLVA2104E-ND |
| Manufacturer |
AMD (Xilinx) |
| Series |
Kintex® UltraScale™ |
| Lead-Free Status |
Lead Free / RoHS Compliant |
| Export Control |
ECCN 3E001 — export license may be required |
| Moisture Sensitivity Level (MSL) |
MSL 3 (168 hours) |
Frequently Asked Questions (FAQ)
Q: What is the difference between XCKU115-3FLVA2104E and XCKU115-2FLVA2104E? A: The only difference is the speed grade. The “-3” variant is the fastest commercial speed grade, offering better timing margins at higher operating frequencies. The “-2” is the standard commercial speed grade.
Q: Is the XCKU115-3FLVA2104E compatible with Vivado 2023 and later? A: Yes, the Kintex UltraScale family including the XCKU115 is fully supported in all versions of Vivado Design Suite from 2014.1 onward, including the latest 2024.x releases.
Q: What is the maximum operating frequency for the XCKU115-3FLVA2104E? A: Maximum fabric frequency depends on the design, but the -3 speed grade supports DSP cascade chains at over 700 MHz, and GTH transceivers support line rates up to 16.3 Gb/s.
Q: Does the XCKU115-3FLVA2104E support partial reconfiguration? A: Yes, AMD’s Vivado Design Suite supports dynamic partial reconfiguration (DPR) for the Kintex UltraScale family, allowing portions of the FPGA to be reconfigured at runtime.
Q: What power supply voltages are required? A: Core voltage (VCCINT) is 0.9V. VCCO banks support 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V. GTH transceiver power (MGTAVCC) is 0.9V with MGTAVTT at 1.2V.
Summary
The XCKU115-3FLVA2104E represents the pinnacle of AMD’s Kintex UltraScale FPGA family. With over 1.4 million logic cells, 5,520 DSP slices, 80 GTH high-speed transceivers, and 75.9 Mb of block RAM, it is built for system architects who need maximum performance in demanding applications. Whether you are designing 5G wireless infrastructure, PCIe acceleration cards, high-frequency signal processing engines, or high-performance test equipment, this device provides the resources and flexibility to meet your requirements.
For more Xilinx FPGA product options and procurement support, visit Xilinx FPGA.
