The XC2S200-6FGG1152C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and a robust 1,152-ball Fine-Pitch Ball Grid Array (FGG) package — making it one of the most capable members of the Spartan-II lineup. Whether you are developing communication systems, industrial automation, or embedded processing solutions, the XC2S200-6FGG1152C offers the reconfigurability and performance your design demands.

What Is the XC2S200-6FGG1152C?

The XC2S200-6FGG1152C is a 2.5V CMOS FPGA manufactured by Xilinx (now AMD Xilinx) as part of the Spartan-II product family. The part number breaks down as follows:

This device is built on Xilinx’s proven 0.18 µm process technology, offering the ideal balance between gate density, I/O flexibility, and power efficiency for a wide range of embedded and digital design applications.

XC2S200-6FGG1152C Key Specifications

Core Logic & Memory Specifications

Package & Electrical Specifications

XC2S200-6FGG1152C Detailed Features

 Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1152C is its array of 1,176 Configurable Logic Blocks (CLBs). Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), carry logic, and dedicated multiplexers. This architecture enables efficient implementation of arithmetic functions, shift registers, and distributed RAM.

 Embedded Block RAM

The device integrates 56K bits (57,344 bits) of dedicated block RAM, organized into two columns flanking the CLB array. Block RAM supports true dual-port operation, configurable in various width-depth combinations. This makes the XC2S200-6FGG1152C well suited for applications requiring on-chip data buffering, FIFOs, and lookup tables.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs), placed at each corner of the die, provide precise clock management. The DLLs eliminate clock distribution skew, enable clock multiplication and division, and allow phase shifting — critical features for high-speed synchronous designs running up to 263 MHz.

 Input/Output Blocks (IOBs) and I/O Standards

The XC2S200-6FGG1152C supports up to 284 user I/O pins (excluding four dedicated global clock inputs). Each IOB is fully programmable and supports a wide range of single-ended and differential I/O standards, including:

• LVTTL / LVCMOS (3.3V, 2.5V, 1.8V)
• PCI (3.3V, 5V)
• GTL / GTL+
• HSTL (Class I, II, III, IV)
• SSTL2 / SSTL3

 Configuration Modes

The XC2S200-6FGG1152C supports multiple configuration modes to suit different system architectures:

XC2S200-6FGG1152C vs. Other Spartan-II Devices

Understanding where the XC2S200 sits within the Spartan-II family helps engineers choose the right device for their design requirements.

The XC2S200-6FGG1152C is the largest and highest-density device in the Spartan-II family, making it the preferred choice when maximum I/O capacity and logic resources are required within the 2.5V Spartan-II platform.

Applications of the XC2S200-6FGG1152C

The XC2S200-6FGG1152C is engineered for demanding real-world applications across multiple industries. Its high I/O count (up to 284 pins) combined with maximum logic density makes it especially suitable for the following use cases:

 Communications & Networking

Implement custom communication protocols, Ethernet bridges, DSP pipelines, and network packet processing engines. The 263 MHz clock capability ensures real-time throughput for data-intensive systems.

Industrial Automation & Motor Control

Deploy in programmable logic controllers (PLCs), servo motor drivers, and sensor fusion systems. The FPGA’s reconfigurability means firmware updates can be applied in the field without hardware replacement.

 Embedded Processing & Co-Processing

Use as a hardware accelerator alongside a microcontroller or microprocessor. The large block RAM and distributed RAM resources enable efficient data buffering and custom instruction execution.

 Medical & Imaging Equipment

The reliable 0.18 µm process and broad I/O standard support make the XC2S200-6FGG1152C suitable for diagnostic imaging, patient monitoring, and portable medical devices.

 Security & Surveillance Systems

High-integrity data paths and flexible I/O make this FPGA a strong fit for biometric authentication, video processing, and secure access control applications.

Why Choose the XC2S200-6FGG1152C Over Mask-Programmed ASICs?

The Spartan-II XC2S200-6FGG1152C provides compelling advantages over traditional ASIC solutions:

• No NRE (Non-Recurring Engineering) costs — avoid expensive mask sets
• Faster time-to-market — prototype and iterate designs rapidly
• Field upgradability — update logic in the field via reconfiguration
• Lower risk — design changes don’t require new silicon spins
• Cost-effective at volume — competitive pricing for mid-to-high volume production

For engineers seeking a reliable Xilinx FPGA solution with proven heritage and broad tool support, the XC2S200-6FGG1152C remains a dependable choice.

Design Tools & Software Support

The XC2S200-6FGG1152C is supported by Xilinx’s ISE Design Suite, which provides the complete flow from RTL design entry through synthesis, implementation, and bitstream generation. Key tools include:

• Xilinx ISE — Synthesis, place & route, and timing analysis
• XPower Analyzer — Power estimation and optimization
• ChipScope Pro — On-chip debug and logic analysis
• ModelSim / Xilinx Simulator — Functional and timing simulation

Design entry is supported in VHDL, Verilog, and schematic capture, giving design teams flexibility in their preferred hardware description language.

Ordering Information & Part Number Decoder

When ordering the XC2S200-6FGG1152C, engineers should verify the full part number to ensure the correct speed grade, package, and temperature range. Xilinx uses a standardized part-numbering convention:

XC2S200  -  6  -  FGG  -  1152  -  C
  |          |     |        |      |
Family    Speed  Package  Pins  Temp Range
(200K)  Grade -6  (Pb-Free BGA) (Commercial)

The “G” in FGG indicates the Pb-free (RoHS-compliant) package variant, distinguishing it from the standard “FG” package.

Frequently Asked Questions (FAQ)

#### What is the maximum operating frequency of the XC2S200-6FGG1152C?

The XC2S200-6FGG1152C operates at a maximum system clock frequency of 263 MHz, achievable with the -6 speed grade, which is the fastest grade available in the Spartan-II family.

#### Is the XC2S200-6FGG1152C RoHS compliant?

Yes. The FGG suffix in the part number denotes a Pb-free (lead-free) package, making it compliant with RoHS environmental standards.

#### What is the difference between FG and FGG packages?

The FGG package is the Pb-free (lead-free/RoHS-compliant) variant of the FG Fine-Pitch Ball Grid Array package. Both offer the same electrical performance; the difference is solely in the solder ball composition.

#### Can the XC2S200-6FGG1152C be used in industrial temperature applications?

The “C” suffix denotes the Commercial temperature range (0°C to +85°C). For extended or industrial temperature operation, consult the Spartan-II industrial-grade variants (suffixed “I”).

#### What configuration PROM is compatible with the XC2S200-6FGG1152C?

Xilinx XCF series PROMs (e.g., XCF02S, XCF04S) are commonly used for Master Serial configuration of the XC2S200-6FGG1152C.

Summary

The XC2S200-6FGG1152C is the flagship device of the Xilinx Spartan-II FPGA family, offering the maximum gate count (200K), the highest I/O pin count (up to 284 user I/Os), and the fastest speed grade (-6, 263 MHz) available in this series. Its 1,152-pin FGG BGA package, Pb-free construction, and 2.5V core supply voltage make it a versatile and reliable solution for commercial-grade digital design across communications, industrial, medical, and embedded processing markets.

Engineers looking for maximum design flexibility with proven Xilinx toolchain support will find the XC2S200-6FGG1152C to be an outstanding choice within the Spartan-II product line.